利索-全球专利检索

  1. Login
  2. Sign Up

Search Results

6 records (took 0.016 seconds)

    Static cell culture maintenance system
    1.
    发明授权
    Static cell culture maintenance system 失效
    静电细胞培养维持系统

    公开(公告)号：US4537860A

    公开(公告)日：1985-08-27

    申请号：US447748

    申请日：1982-12-08

    Applicant: William R. Tolbert ,  Joseph Feder ,  Charles Lewis, Jr.

    Inventor： William R. Tolbert ,  Joseph Feder ,  Charles Lewis, Jr.

    IPC: C12N15/02 ,  C12M3/00 ,  C12M3/06 ,  C12N5/00 ,  C12N5/06 ,  C12N15/00 ,  C12P21/08 ,  C12R1/91 ,  C12M1/12 ,  B07B1/30 ,  B07C5/16 ,  C12M1/00 ,  C12M1/04 ,  C12N5/02

    CPC classification number: C12M29/16 ,  C12M23/06 ,  C12M25/14 ,  C12M29/04

    Abstract: A method and apparatus for maintaining animal cells in vitro in a substantially arrested state of proliferation with continuous secretion of cell product is disclosed. The cells are retained within a reactor vessel chamber in a semi-rigid matrix having interstices for passage of fluid nutrient medium. Fresh nutrient medium is supplied by perfusion into the matrix through relatively low porosity tubes which are suspended in the reactor chamber and which substantially traverse the matrix; expended medium and cell product is withdrawn through relatively high porosity tubes which also are suspended in the reactor chamber and which substantially traverse the matrix; and oxygenated gaseous medium is supplied by perfusion into the matrix through a selectively-permeable membrane disposed in the reactor chamber.

    Abstract translation: 公开了一种用于在动物细胞体外维持基本上阻滞的增殖状态并连续分泌细胞产物的方法和装置。 细胞被保留在具有间隙以用于流体营养培养基通过的半刚性基质的反应器容器室内。 新鲜营养培养基通过悬浮在反应器室中并且基本上穿过基质的较低孔隙率管灌注到基质中; 消耗的介质和细胞产物通过相对较高的孔隙率管排出，其也悬浮在反应器室中并且基本上穿过基质; 并且通过设置在反应器室中的选择性渗透的膜通过灌注将氧化气体介质供给到基质中。

    Production of serum albumin
    2.
    发明授权
    Production of serum albumin 失效
    生产血清白蛋白

    公开(公告)号：US4097473A

    公开(公告)日：1978-06-27

    申请号：US828013

    申请日：1977-08-26

    Applicant: Charles Lewis, Jr. ,  James M. Schuck

    Inventor： Charles Lewis, Jr. ,  James M. Schuck

    IPC: C07K14/76 ,  A61K35/14 ,  A61K35/16 ,  A61K38/16 ,  A61K38/38 ,  C07K14/435 ,  C07K14/765 ,  C07G7/00

    CPC classification number: C07K14/765 ,  Y10S530/83

    Abstract: A serum albumin fraction is prepared in high yield and purity from plasma and other albumin-containing blood protein fractions by contacting with a resinous polymeric material having a high capacity for adsorption of albumin, heating at 65.degree. C-72.degree. C for about 1-4 hours while maintaining a pH of 5.0-5.5, and then selectively eluting the albumin from the resin-protein mixture at a pH of 3.5-4.5. The resinous polymeric materials are water-insoluble, cross-linked polyelectrolyte copolymers of ethylene and maleic anhydride containing pendant dimethylaminopropyl functional groups.

    Abstract translation: 通过与具有高吸收白蛋白的能力的树脂聚合物接触，与血浆和其它含白蛋白的血液蛋白质级分制备高产率和纯度的血清白蛋白部分，在65℃-72℃下加热约1- 4小时，同时保持pH为5.0-5.5，然后在3.5-4.5的pH下从树脂 - 蛋白质混合物中选择性洗脱白蛋白。 树脂聚合物材料是含有二甲基氨基丙基官能团侧链的乙烯和马来酸酐的水不溶性交联聚电解质共聚物。

    Encapsulation for high frequency semiconductor device
    3.
    发明授权
    Encapsulation for high frequency semiconductor device 失效
    高频半导体器件封装

    公开(公告)号：US3974518A

    公开(公告)日：1976-08-10

    申请号：US551991

    申请日：1975-02-21

    Applicant: Basil Charles Lewis, Jr. ,  James Robert Mathews ,  Louis Henry Von Ohlsen, Jr.

    Inventor： Basil Charles Lewis, Jr. ,  James Robert Mathews ,  Louis Henry Von Ohlsen, Jr.

    IPC: H01L23/66 ,  H01L39/02 ,  H01L23/02

    CPC classification number: H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011

    Abstract: An hermetic sealed microwave diode package having high thermal conductivity and very low parasitic impedances. The diode chip is mounted upon a diamond member embedded in a copper base member so that the diamond mounting surface and the copper base member surface are coplanar. A fused silica insulator ring produced by selective grit blasting surrounds the chip and is mounted likewise entirely on the diamond surface. The silica insulator has a height comparable to the thickness of the semiconductor chip and the enclosure is completed by a metal covering member which includes a contact to the top surface of the diode chip. The package thereby has extremely short conductive paths and low capacitance by virtue of the very small silica insulator ring.

    Abstract translation: 密封的微波二极管封装具有高导热性和非常低的寄生阻抗。 二极管芯片安装在嵌入铜基构件的金刚石构件上，使得金刚石安装表面和铜基构件表面是共面的。 通过选择性喷砂生产的熔融硅石绝缘体环绕芯片，同样完全安装在金刚石表面上。 二氧化硅绝缘体具有与半导体芯片的厚度相当的高度，并且外壳由包括与二极管芯片的顶表面的接触的金属覆盖件完成。 由于非常小的二氧化硅绝缘体环，封装由此具有极短的导电路径和低的电容。

Patent Agency Ranking