摘要:
The present invention relates to a position detector and a touch sensing device of using same with SNR enhancement. In one embodiment, the position detector has (P+1) inputs, each input for receiving an input signal associated with a position, P being a positive integer, and P operational amplifiers, each operational amplifier having a non-inverting input and an inverting input, where the inverting input of the j-th operational amplifier is electrically connected to the non-inverting input of the (j+1)-th operational amplifier, and the non-inverting input and the inverting input of the j-th operational amplifier are electrically connected to the j-th input port and the (j+1)-th input port, respectively, j=1, 2, 3, . . . , (P−1).
摘要:
Multipoint tracking is performed by receiving raw data of an image, calculating line average values for a plurality of lines of the raw data, filtering the raw data according to the line average values to generate filtered data, performing a dilation algorithm on the filtered data to generate dilated data, performing an erosion algorithm on the dilated data to generate eroded data, performing edge detection on the eroded data for identifying touch regions of the raw data, performing a labeling algorithm on the touch regions, calculating centers of gravity for the touch regions, and generating a multipoint tracking result according to the centers of gravity.
摘要:
An active TFT circuit structure with current scaling function is disclosed, which includes a current source, a data line, a scan line, a direct current voltage source, capacitors and four transistors, wherein the capacitors form a cascade structure. During the ON-state, the two of the transistors are turn-on based on the voltage provided by the scan line, so that the data current provided by the current source flows through the data line-and the transistor which is one of the opened transistors, thereby arriving an emitting light element and the transistor connected to the emitting light element. When the pixel circuit changes from ON- to OFF-state, the voltage of the node between the storage capacitors reduces due to the feed-through effect of one of storage capacitor, thereby reducing the driving current of the emitting light element. Therefore, it can be achieved the current scaling function.
摘要:
An active TFT circuit structure with current scaling function is disclosed, which includes a current source, a data line, a scan line, a direct current voltage source, capacitors and four transistors, wherein the capacitors form a cascade structure. During the ON-state, the two of the transistors are turn-on based on the voltage provided by the scan line, so that the data current provided by the current source flows the data line and the transistor which is one of the opened transistors, thereby arriving an emitting light element and the transistor connected to the emitting light element. When the pixel circuit changes from ON- to OFF-state, the voltage of the node between the storage capacitors reduces due to the feed-through effect of one of storage capacitor, thereby reducing the driving current of the emitting light element. Therefore, it can be achieved the current scaling function.
摘要:
Multipoint tracking is performed by receiving raw data of an image, calculating line average values for a plurality of lines of the raw data, filtering the raw data according to the line average values to generate filtered data, performing a dilation algorithm on the filtered data to generate dilated data, performing an erosion algorithm on the dilated data to generate eroded data, performing edge detection on the eroded data for identifying touch regions of the raw data, performing a labeling algorithm on the touch regions, calculating centers of gravity for the touch regions, and generating a multipoint tracking result according to the centers of gravity.
摘要:
According to the method, a trench structure is formed in a substrate. LED arrays and driver ICs are located in the corresponding trenches. An insulating layer is formed over the substrate, the LED arrays and the driver ICs. A photolithography process forms an electrical connection structure between the LED arrays and the driver ICs. Then, a die-cutting process cuts out individual units. These units are fixed in a PCB and an electrical connection structure is formed between these units and input/output pins on the PCB.
摘要:
A touch panel device having high touch sensitivity includes sensing capacitors, switches, storage capacitors, a differential amplifier and a signal processing unit. During a sense period, the switches are periodically turned on alternately for periodically transferring the charges of the sensing capacitors to the storage capacitors. The differential amplifier is put in use for amplifying the voltage difference of two corresponding storage capacitors for generating a touch readout signal. The signal processing unit performs an OR operation on two touch readout signals generated during different sense periods based on different sensing capacitor combinations regarding same panel touch position for providing a touch position signal.
摘要:
For a multitouch input configuration, tracking touch inputs includes calculating a first center position corresponding to two touch points along a first axis for a first frame, detecting variation of the first center position from the first frame to a second frame, and determining a gesture type according to the variation of the first center position.
摘要:
A touch panel circuitry, which is coupled to a controller, comprises a plurality of electrode strips and a plurality of conductive traces. The electrode strip configured to provide touch signals has two strip ends. The conductive trace is configured for electrically coupling the two strip ends of the corresponding electrode strip so as to form a closed loop circuit. Each conductive trace is also connected to the controller to transmit signals generated by the corresponding electrode strip.
摘要:
According to the method, a trench structure is formed in a substrate. LED arrays and driver ICs are located in the corresponding trenches. An insulating layer is formed over the substrate, the LED arrays and the driver ICs. A photolithography process forms an electrical connection structure between the LED arrays and the driver ICs. Then, a die-cutting process cuts out individual units. These units are fixed in a PCB and an electrical connection structure is formed between these units and input/output pins on the PCB.