公开(公告)号：US07239333B2

公开(公告)日：2007-07-03

申请号：US11038125

申请日：2005-01-21

申请人： Shun-Lih Tu ,  Chih-Hung Chuang ,  Huai-Ku Chung ,  Chia-Feng Yang ,  Cheng-Wei Yang ,  Tsu-An Han ,  Hung-Tung Wang ,  Chien-Chen Hung

发明人： Shun-Lih Tu ,  Chih-Hung Chuang ,  Huai-Ku Chung ,  Chia-Feng Yang ,  Cheng-Wei Yang ,  Tsu-An Han ,  Hung-Tung Wang ,  Chien-Chen Hung

IPC分类号： B41J2/45 ,  H01L27/00 ,  H01L21/70 ,  H01L21/77 ,  H01L21/78

CPC分类号： B41J2/45 ,  G03G15/04054 ,  H01L24/24 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to the method, a trench structure is formed in a substrate. LED arrays and driver ICs are located in the corresponding trenches. An insulating layer is formed over the substrate, the LED arrays and the driver ICs. A photolithography process forms an electrical connection structure between the LED arrays and the driver ICs. Then, a die-cutting process cuts out individual units. These units are fixed in a PCB and an electrical connection structure is formed between these units and input/output pins on the PCB.

摘要翻译： 根据该方法，在衬底中形成沟槽结构。 LED阵列和驱动器IC位于相应的沟槽中。 在衬底，LED阵列和驱动器IC上形成绝缘层。 光刻工艺在LED阵列和驱动器IC之间形成电连接结构。 然后，切割工艺切割出各个单元。 这些单元固定在PCB中，并且这些单元和PCB上的输入/输出引脚之间形成电连接结构。

公开(公告)号：US20060132578A1

公开(公告)日：2006-06-22

申请号：US11038125

申请日：2005-01-21

申请人： Shun-Lih Tu ,  Chih-Hung Chuang ,  Huai-Ku Chung ,  Chia-Feng Yang ,  Cheng-Wei Yang ,  Tsu-An Han ,  Hung-Tung Wang ,  Chien-Chen Hung

发明人： Shun-Lih Tu ,  Chih-Hung Chuang ,  Huai-Ku Chung ,  Chia-Feng Yang ,  Cheng-Wei Yang ,  Tsu-An Han ,  Hung-Tung Wang ,  Chien-Chen Hung

IPC分类号： B41J2/385 ,  G03G13/04

CPC分类号： B41J2/45 ,  G03G15/04054 ,  H01L24/24 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to the method, a trench structure is formed in a substrate. LED arrays and driver ICs are located in the corresponding trenches. An insulating layer is formed over the substrate, the LED arrays and the driver ICs. A photolithography process forms an electrical connection structure between the LED arrays and the driver ICs. Then, a die-cutting process cuts out individual units. These units are fixed in a PCB and an electrical connection structure is formed between these units and input/output pins on the PCB.

摘要翻译： 根据该方法，在衬底中形成沟槽结构。 LED阵列和驱动器IC位于相应的沟槽中。 在衬底，LED阵列和驱动器IC上形成绝缘层。 光刻工艺在LED阵列和驱动器IC之间形成电连接结构。 然后，切割工艺切割出各个单元。 这些单元固定在PCB中，并且这些单元和PCB上的输入/输出引脚之间形成电连接结构。

公开(公告)号：US20060049475A1

公开(公告)日：2006-03-09

申请号：US11073701

申请日：2005-03-08

申请人： Hung-Tung Wang ,  Chien-Chen Hung ,  Shun-Lih Tu ,  Dennis Yen ,  Chih-Hung Chuang ,  Huai-Ku Chung ,  Cheng-Wei Yang ,  Tsu-An Han

发明人： Hung-Tung Wang ,  Chien-Chen Hung ,  Shun-Lih Tu ,  Dennis Yen ,  Chih-Hung Chuang ,  Huai-Ku Chung ,  Cheng-Wei Yang ,  Tsu-An Han

IPC分类号： H01L31/0232

CPC分类号： H01L25/0753 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention relates to a high-power LED array. The high-power LED array has a printed circuit board (PCB), anodes, cathodes, high-power LED dies, packing materials, and lenses. The PCB has cavities arranged in an array. One anode and one cathode are located in each cavity. The anode and the cathode are correspondingly connected to the anode and cathode in the neighboring cavities. At least one high-power LED die is placed in the cavity and connected to the anode and the cathode in series or in parallel. The cavity is filled with packing material to secure the high-power LED die. Lenses are placed on the cavities to focus light emitted by the high-power LED die.

摘要翻译： 本发明涉及一种大功率LED阵列。 大功率LED阵列具有印刷电路板（PCB），阳极，阴极，大功率LED管芯，包装材料和透镜。 PCB具有排列成阵列的空腔。 一个阳极和一个阴极位于每个空腔中。 阳极和阴极相应地连接到相邻腔中的阳极和阴极。 至少一个大功率LED管芯被放置在空腔中并串联或并联连接到阳极和阴极。 空腔填充有包装材料，以固定大功率LED管芯。 将镜片放置在腔体上以聚焦由大功率LED管芯发射的光。

公开(公告)号：US20070081340A1

公开(公告)日：2007-04-12

申请号：US11246879

申请日：2005-10-07

申请人： Huai-Ku Chung ,  Cheng-Wei Yang ,  Chien-Hung Lin ,  Shun-Lih Tu ,  Hung-Tung Wang

发明人： Huai-Ku Chung ,  Cheng-Wei Yang ,  Chien-Hung Lin ,  Shun-Lih Tu ,  Hung-Tung Wang

IPC分类号： F21V29/00

CPC分类号： F21V29/503 ,  F21K9/00 ,  F21V29/70 ,  F21V29/74 ,  F21V29/85 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/305 ,  H05K3/4069 ,  H05K3/42 ,  H05K2201/0209 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/10106

摘要： The present invention provides a light source module with high efficiency, super bright LEDs featured with efficient heat dissipation. This invention comprises a printed circuit board installed with an LED array which is composed of multiple emitter LEDs. To achieve efficient effect for heat dissipation, there is more than one hole punctured on the printed circuit board right underneath each emitter LED. The surface of each punctured hole is coated with thermal conductive layer such that the accumulative heat generated by the high power LEDs can be effectively dissipated through the conductive layer.

摘要翻译： 本发明提供一种具有高效散热功能的高效率超亮LED的光源模块。 本发明包括安装有由多个发射极LED组成的LED阵列的印刷电路板。 为了获得有效的散热效果，在每个发射极LED正下方的印刷电路板上都有不止一个穿孔。 每个穿孔的表面涂覆有导热层，使得由高功率LED产生的累积热能够通过导电层有效地消散。

公开(公告)号：US20070081339A1

公开(公告)日：2007-04-12

申请号：US11246877

申请日：2005-10-07

申请人： Huai-Ku Chung ,  Cheng-Wei Yang ,  Chien-Hung Lin ,  Shun-Lih Tu ,  Hung-Tung Wang

发明人： Huai-Ku Chung ,  Cheng-Wei Yang ,  Chien-Hung Lin ,  Shun-Lih Tu ,  Hung-Tung Wang

IPC分类号： F21V29/00

CPC分类号： F21V29/503 ,  F21K9/00 ,  F21V29/70 ,  F21V29/74 ,  F21V29/89 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/305 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/10106

摘要： The present invention provides an LED light source module design featured with efficient heat dissipation. This invention comprises a printed circuit board of thickness less than 400 μm, installed with an LED array which is composed of multiple high powers, super bright emitter LEDs. The thinner version of the printed circuit provides shorter route for faster thermal conductivity; and thus promotes the efficiency for heat dissipation. With its bendable flexibility, the thinner version of the printed circuit board can accommodate and well affix to the inner side of any shape of lighting fixture rack. This further enhances the heat dissipation for varieties of lighting fixture rack design.

摘要翻译： 本发明提供了具有高效散热特征的LED光源模块设计。 本发明包括厚度小于400μm的印刷电路板，安装有由多个高功率超亮发光体LED组成的LED阵列。 印刷电路的较薄版本为较快的导热性提供了较短的路线; 从而提高散热效率。 凭借其可弯曲的灵活性，印刷电路板的较薄版本可以容纳并且适合固定在任何形状的照明器具架的内侧。 这进一步增强了各种照明灯具架设计的散热。

公开(公告)号：US06208073B1

公开(公告)日：2001-03-27

申请号：US09153113

申请日：1998-09-15

申请人： Hung-Tung Wang ,  Shun-Chih Chen ,  Chih-Yuan Yen ,  Chun-Fang Hsiao ,  Fang-Shih Chuang ,  Chien-Chen Hung

发明人： Hung-Tung Wang ,  Shun-Chih Chen ,  Chih-Yuan Yen ,  Chun-Fang Hsiao ,  Fang-Shih Chuang ,  Chien-Chen Hung

IPC分类号： H01J162

CPC分类号： G09F9/33 ,  G06F3/147 ,  G09F27/008 ,  G09G3/32 ,  G09G2300/026 ,  Y10S362/80

摘要： A smart light emitting diode cluster and system includes a central processing unit (CPU) and a plurality of LED cluster strings, each comprising a plurality of LED cluster connected in series. Each LED cluster includes an LED drive circuit and a plurality of LEDs. The CPU receives external input image signal, and then desired control signal and image data are sent to the LED cluster strings by appropriate processing. The control signal is used to switch the LEDs in the cluster to generate desired image and related color variation. The control signal and image data are transferred to the next LED cluster by the present LED drive circuit. In this manner, the control signal and image data are progressively transferred from the first to the last cluster so that a whole image with color variation can be displayed by all the LEDs in the system.

摘要翻译： 智能发光二极管簇和系统包括中央处理单元（CPU）和多个LED串组，每个LED串串均包括串联连接的多个LED串。 每个LED集群包括LED驱动电路和多个LED。 CPU接收外部输入图像信号，然后通过适当的处理将期望的控制信号和图像数据发送到LED簇串。 控制信号用于切换群集中的LED，以产生所需的图像和相关的颜色变化。 控制信号和图像数据通过本LED驱动电路传输到下一个LED集群。 以这种方式，控制信号和图像数据从第一个到最后一个簇逐渐传送，使得具有颜色变化的整个图像可以由系统中的所有LED显示。