公开(公告)号：US20090039488A1

公开(公告)日：2009-02-12

申请号：US12228379

申请日：2008-08-11

申请人： Chang-Yueh Chan ,  Chih-Ming Huang ,  Chun-Yuan Li ,  Chih-Hsin Lai

发明人： Chang-Yueh Chan ,  Chih-Ming Huang ,  Chun-Yuan Li ,  Chih-Hsin Lai

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L24/89 ,  H01L21/561 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A semiconductor package and a method for fabricating the same are provided. A leadframe including a die pad and a plurality of peripheral leads is provided. A carrier, having a plurality of connecting pads formed thereon, is attached to the die pad, wherein a planar size of the carrier is greater than that of the die pad, allowing the connecting pads on the carrier to be exposed from the die pad. At least a semiconductor chip is attached to a side of an assembly including the die pad and the carrier, and is electrically connected to the connecting pads of the carrier and the leads via bonding wires. A package encapsulant encapsulates the semiconductor chip, the bonding wires, a part of the carrier and a part of the leadframe, allowing a bottom surface of the carrier and a part of the leads to be exposed from the package encapsulant.

摘要翻译： 提供半导体封装及其制造方法。 提供了包括管芯焊盘和多个外围引线的引线框架。 具有形成在其上的多个连接焊盘的载体被附接到管芯焊盘，其中载体的平面尺寸大于管芯焊盘的平面尺寸，允许载体上的连接焊盘从裸片焊盘露出。 至少一个半导体芯片附着到包括芯片焊盘和载体的组件的一侧，并通过接合线电连接到载体和引线的连接焊盘。 封装密​​封剂封装半导体芯片，接合线，载体的一部分和引线框架的一部分，允许载体的底表面和引线的一部分从封装密封剂暴露。

公开(公告)号：US08618641B2

公开(公告)日：2013-12-31

申请号：US12228379

申请日：2008-08-11

申请人： Chang-Yueh Chan ,  Chih-Ming Huang ,  Chun-Yuan Li ,  Chih-Hsin Lai

发明人： Chang-Yueh Chan ,  Chih-Ming Huang ,  Chun-Yuan Li ,  Chih-Hsin Lai

IPC分类号： H01L23/495

CPC分类号： H01L24/89 ,  H01L21/561 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A semiconductor package and a method for fabricating the same are provided. A leadframe including a die pad and a plurality of peripheral leads is provided. A carrier, having a plurality of connecting pads formed thereon, is attached to the die pad, wherein a planar size of the carrier is greater than that of the die pad, allowing the connecting pads on the carrier to be exposed from the die pad. At least a semiconductor chip is attached to a side of an assembly including the die pad and the carrier, and is electrically connected to the connecting pads of the carrier and the leads via bonding wires. A package encapsulant encapsulates the semiconductor chip, the bonding wires, a part of the carrier and a part of the leadframe, allowing a bottom surface of the carrier and a part of the leads to be exposed from the package encapsulant.

摘要翻译： 提供半导体封装及其制造方法。 提供了包括管芯焊盘和多个外围引线的引线框架。 具有形成在其上的多个连接焊盘的载体被附接到管芯焊盘，其中载体的平面尺寸大于管芯焊盘的平面尺寸，允许载体上的连接焊盘从裸片焊盘露出。 至少一个半导体芯片附着到包括芯片焊盘和载体的组件的一侧，并通过接合线电连接到载体和引线的连接焊盘。 封装密​​封剂封装半导体芯片，接合线，载体的一部分和引线框架的一部分，允许载体的底表面和引线的一部分从封装密封剂暴露。