公开(公告)号：US4911809A

公开(公告)日：1990-03-27

申请号：US228897

申请日：1988-08-05

申请人： Christopher J. Wort ,  Lynn Y. Dorey

发明人： Christopher J. Wort ,  Lynn Y. Dorey

IPC分类号： H01L21/203 ,  C23C14/34 ,  C23C14/35 ,  C23C14/36

CPC分类号： C23C14/352 ,  C23C14/3457

摘要： A thin film deposition process comprises the steps of providing a first target area on a magnetron electrode, sputtering particles from said area so that they fall onto a heated substrate body for forming the required deposit, simultaneously operating a sputtering gun such that further particles are dislodged from a second target area and directed towards the substrate, the two resulting particle plasmas mixing at the substrate surface such that a deposit of a predetermined chemical composition is produced.This allows a multicomponent material such as a PLZT ceramic to be deposited without a change in composition due to different volatilities etc. of the components.

公开(公告)号：US5000819A

公开(公告)日：1991-03-19

申请号：US442797

申请日：1989-11-29

申请人： David J. Pedder ,  Christopher J. Wort ,  Kim L. Pickering

发明人： David J. Pedder ,  Christopher J. Wort ,  Kim L. Pickering

IPC分类号： B23K1/20 ,  C23G5/00 ,  H05K3/34

CPC分类号： C23G5/00 ,  B23K1/206 ,  B23K2201/40 ,  H05K3/3489

摘要： A dry solder reflow process, in which metal surface oxides are removed from the solder surface by abstraction of the oxygen from the metal oxide by atomic hydrogen, the atomic hydrogen being created within an intense microwave frequency plasma of a gas containing hydrogen.