公开(公告)号：US5022580A

公开(公告)日：1991-06-11

申请号：US435477

申请日：1989-11-30

申请人： David J. Pedder

发明人： David J. Pedder

IPC分类号： G02B6/42 ,  H01L21/60 ,  H01L23/544 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L23/544 ,  H05K1/0269 ,  G02B6/4232 ,  H01L2223/54473 ,  H01L2224/16 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K2201/09409 ,  H05K2201/09781 ,  H05K2203/166 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3457 ,  Y10S438/975 ,  Y10T29/49133

摘要： A flip-chip solder bonding structure having first and second components. Each component is made from a substrate haivng on one surface an array of solderable pads. Selected pads have solder bumps deposited thereon with each surface having a plurality of alignment marks formed thereon whereby when the components are positioned face to face, the arrays register with one another to enable a solder bond to be formed. The respective pluralities of alignment marks may be inspected to assess their relative positions in order to determine the accuracy of the solder bond. The solderable pads and the alignment marks on each surface are formed during the same processing stage as metallized regions. The solder bumps are applied to the metallized regions forming the alignment marks.

摘要翻译： PCT No.PCT / GB89 / 00282 Sec。 371日期：一九八九年十一月三十日 102（e）1989年11月30日日期PCT 1989年3月16日PCT公布。 出版物WO89 / 08926 日期：1989年9月21日。具有第一和第二组分的倒装焊接结合结构。 每个部件由一个表面上的可焊接焊盘阵列制成。 所选择的焊盘具有沉积在其上的焊料凸块，每个表面具有形成在其上的多个对准标记，当组件面对面地定位时，阵列彼此对准以使得能够形成焊接接合。 可以检查相应的多个对准标记以评估它们的相对位置，以便确定焊料接合的精度。 每个表面上的可焊接焊盘和对准标记在与金属化区域相同的处理阶段期间形成。 焊料凸点被施加到形成对准标记的金属化区域。

公开(公告)号：US4317063A

公开(公告)日：1982-02-23

申请号：US88169

申请日：1979-10-25

申请人： David J. Pedder ,  David J. Warner

发明人： David J. Pedder ,  David J. Warner

IPC分类号： H01J29/45

CPC分类号： H01J29/458

摘要： A reticulated pyroelectric target, for the detection of infra red radiation, comprising a plurality of closely packed islands of pyroelectric material separated by a plurality of relatively narrow grooves in which in order to physically strengthen the target the islands and grooves are so shaped that the grooves do not form a straight line over any appreciable portion of the target surface. Preferably the islands are hexagonal to provide a good packing density.

摘要翻译： 一种用于检测红外辐射的网状热电靶，包括多个紧密堆叠的热电材料岛，其由多个相对较窄的槽分隔，其中为了物理地加强目标，岛和沟被成形为使得凹槽 不要在目标表面的任何明显部分上形成直线。 优选地，岛是六边形以提供良好的堆积密度。

公开(公告)号：US4311730A

公开(公告)日：1982-01-19

申请号：US131910

申请日：1980-03-20

申请人： David J. Pedder

发明人： David J. Pedder

IPC分类号： H01C17/065 ,  B05D5/12

CPC分类号： H01C17/06533

摘要： A thick film resistor suitable for deposition on a copper printed circuit is produced by providing a resistor pattern of a mixture of metal powder and oxide of the metal and heating in a nitrogen atmosphere at a temperature such that the metal and the metallic oxide react to produce a conducting lower oxide.

摘要翻译： 通过提供金属粉末和金属的氧化物的混合物的电阻器图案，并在氮气气氛中在使金属和金属氧化物反应产生的温度下加热来制造适用于沉积在铜印刷电路上的厚膜电阻器 导电低氧化物。

公开(公告)号：US5406210A

公开(公告)日：1995-04-11

申请号：US12998

申请日：1993-02-03

申请人： David J. Pedder

发明人： David J. Pedder

IPC分类号： G01R1/067 ,  G01R1/073 ,  G01R31/26 ,  G01R31/28 ,  H01L21/66 ,  G01R1/04

CPC分类号： G01R1/07307

摘要： A bare die testing apparatus comprising a multilayer interconnection structure 10 having a testing station 11 for testing the bare die 20, testing circuits and components 12 arranged in said structure adjacent the testing station 11, said testing station 11 having a plurality of microbumps 17 of conductive material soldered onto wettable metallization pads 18 located on interconnection trace terminations of the interconnection structure, said terminations being connected through the interconnections of the multilayer structure to said testing circuits and components 12. The microbumps 17 are distributed in a pattern corresponding to the pattern of contact pads 19 on a bare die 20 to be tested. A method of testing bare dies by the bare-die testing apparatus embodying the invention, the method including optically aligning the contact pads 19 of a bare die 20 under test with the microbumps 17 of the testing station 11, contacting the aligned contact pads 19 of the bare die 20 with the corresponding microbumps 17 of the testing station 11 and applying appropriate pressure on to bare die 20 to ensure desired low contact resitstance between the microbumps 17 and the contact pads 14.

摘要翻译： 一种裸片测试装置，包括具有用于测试裸裸片20的测试台11，布置在与测试台11相邻的所述结构中的测试电路和部件12的多层互连结构10，所述测试台11具有多个导电的微胶片17 材料焊接到位于互连结构的互连迹线端子上的可润湿金属化焊盘18上，所述端接件通过多层结构的互连连接到所述测试电路和部件12.微胶囊17以对应于接触图案的图案分布 垫片19在待测试的裸裸片20上。 通过本发明的裸芯片测试装置测试裸芯片的方法，该方法包括将被测试的裸片20的接触垫19与测试台11的微胶片17光学对准，使与对准的接触垫19接触 裸裸片20与测试台11的相应的微胶片17一起施加适当的压力到裸模20上，以确保微胶片17和接触垫14之间所期望的低接触电阻。

公开(公告)号：US5108027A

公开(公告)日：1992-04-28

申请号：US684483

申请日：1991-04-12

申请人： David J. Warner ,  Kim L. Pickering ,  David J. Pedder

发明人： David J. Warner ,  Kim L. Pickering ,  David J. Pedder

IPC分类号： B23K35/00 ,  G02B6/42 ,  H01L21/60 ,  H01L23/485

CPC分类号： H01L24/10 ,  B23K35/001 ,  H01L24/13 ,  H01L24/81 ,  G02B6/4232 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/30107

摘要： A flip-chip solder bonding arrangement including a semiconductor substrate having thereon layers of metallization which have a tendency to interact with a solder material, forming on said layers of metallization a barrier metallization layer which is not reactive with said solder material, forming solder pads on the barrier layer and thereafter forming solder bonds with such solder pads employing said solder material.

公开(公告)号：USRE30052E

公开(公告)日：1979-07-24

申请号：US863542

申请日：1977-12-23

申请人： Terrence A. Davies ,  David J. Pedder

发明人： Terrence A. Davies ,  David J. Pedder

IPC分类号： C22C1/10 ,  C22C32/00 ,  H01B1/02 ,  H01H1/0237

CPC分类号： C22C1/1078 ,  C22C32/0021 ,  H01B1/02 ,  H01H1/02374

摘要： A material for use in making electrical contacts is produced in a powder form suitable for later processing into electrical contacts by standard metallurgical techniques. The material consists of a first metal, such as silver, and the oxide of a second metal, such as cadmium, added to the first metal in a proportion up to the limits of solubility of the second metal in the first metal. An oxide of a third metal having a low electronic work function level, such as lithium oxide, is added and uniformly distributed on the surfaces of the powder particles by precipitation. A fourth metal, such as tellurium, that is insoluble in the first metal is also added to provide selected characteristics.

公开(公告)号：US5604658A

公开(公告)日：1997-02-18

申请号：US501630

申请日：1995-07-12

申请人： David J. Pedder

发明人： David J. Pedder

IPC分类号： H01G4/255 ,  H01L21/02 ,  H01G5/011

CPC分类号： H01L28/40

摘要： In a multilayer metallisation/dielectric structure on a silicon substrate a trimmable capacitor is formed between two of the higher metallisation layers, with one layer being segmented and the individual segments connected by way of one or more vias and respective narrow links to one terminal of the capacitor. The narrow links are formed from titanium tungsten on the oxide isolated silicon substrate.

摘要翻译： 在硅衬底上的多层金属化/电介质结构中，在两个较高金属化层之间形成可调节电容器，其中一层被分段，并且各个段通过一个或多个通孔和相应的窄链路连接到 电容器。 窄链接由氧化钛隔离硅衬底上的钛钨形成。

公开(公告)号：US4847500A

公开(公告)日：1989-07-11

申请号：US925833

申请日：1986-09-12

申请人： David J. Pedder ,  Paul Watson ,  Richard A. C. Bache

发明人： David J. Pedder ,  Paul Watson ,  Richard A. C. Bache

IPC分类号： G01J5/10 ,  G01J5/20

CPC分类号： G01J5/10 ,  G01J5/20 ,  G01J2005/202 ,  G01J2005/206

摘要： A thermal detector of the type comprising an array of discrete detector elements each of which is supported by a common supportive layer, each of which is provided in thermal contact with a corresponding collector of radiation absorbent material, the area of each collector being larger than the area of the corresponding detector element, characterized in that contact between each collector and the supportive layer is restricted to an area lying substantially within and displaced from the edge periphery of said collector.

摘要翻译： 一种热检测器，其类型包括离散检测器元件阵列，每个检测器元件由公共支撑层支撑，每个支撑层设置成与相应的辐射吸收材料的收集器热接触，每个收集器的面积大于 相应的检测器元件的区域，其特征在于，每个收集器和支撑层之间的接触被限制在基本上位于并且从所述收集器的边缘周边移位的区域。

公开(公告)号：US5185613A

公开(公告)日：1993-02-09

申请号：US911017

申请日：1986-09-08

申请人： Roger W. Whatmore ,  David J. Pedder

发明人： Roger W. Whatmore ,  David J. Pedder

IPC分类号： H01Q19/06

CPC分类号： H01Q19/06 ,  H01L2224/13 ,  H01L2924/19107

摘要： A hybrid structure comprising a lens 10, an antenna array 8 and a semiconductor microcircuit 2. The antenna array 8 is formed on a surface of the lens 10 or on a surface of a substrate 14 having substantially the same refractive index as the material of the lens 10. Metal bump bonds 6, 12 provide connections between the antenna array 8 and the semiconductor microcircuit 2.

摘要翻译： 一种混合结构，包括透镜10，天线阵列8和半导体微电路2.天线阵列8形成在透镜10的表面上或基板14的表面上，该基板14具有基本上与折射率相同的折射率 金属凸块接合6,12提供天线阵列8和半导体微电路2之间的连接。

公开(公告)号：US5000819A

公开(公告)日：1991-03-19

申请号：US442797

申请日：1989-11-29

申请人： David J. Pedder ,  Christopher J. Wort ,  Kim L. Pickering

发明人： David J. Pedder ,  Christopher J. Wort ,  Kim L. Pickering

IPC分类号： B23K1/20 ,  C23G5/00 ,  H05K3/34

CPC分类号： C23G5/00 ,  B23K1/206 ,  B23K2201/40 ,  H05K3/3489

摘要： A dry solder reflow process, in which metal surface oxides are removed from the solder surface by abstraction of the oxygen from the metal oxide by atomic hydrogen, the atomic hydrogen being created within an intense microwave frequency plasma of a gas containing hydrogen.