公开(公告)号：US20050191768A1

公开(公告)日：2005-09-01

申请号：US11054752

申请日：2005-02-09

申请人： Young-Jee Yoon ,  Chung-Sam Jun ,  Chul-Gi Song ,  Sang-Mun Chon

发明人： Young-Jee Yoon ,  Chung-Sam Jun ,  Chul-Gi Song ,  Sang-Mun Chon

IPC分类号： G01N27/416 ,  G01R31/26 ,  H01L21/4763 ,  H01L21/66 ,  H01L21/768

CPC分类号： H01L22/14 ,  H01L21/76802 ,  H01L2924/0002 ,  H01L2924/00

摘要： A substrate measuring apparatus includes a reference value storage unit, an electron irradiator, a current measuring device, and a property value calculating device. The reference value storage unit stores data on the relationship between current flow in a sample substrate with a contact hole of known characteristics that is irradiated by an electron beam. The current measuring device measures current flow in a test substrate. The property value calculating device calculates the property value of the contact hole formed in a material layer of the test substrate using the current flow in the test substrate and the data stored in the reference value storage unit. The property values of the contact hole may be a surface area of underlying substrate exposed by a contact hole or an amount of residual material remaining in the contact hole.

摘要翻译： 基板测量装置包括参考值存储单元，电子辐射器，电流测量装置和属性值计算装置。 参考值存储单元存储关于样品基板中的电流与具有由电子束照射的已知特性的接触孔之间的关系的数据。 当前的测量装置测量测试基板中的电流。 属性值计算装置使用测试基板中的电流和存储在参考值存储单元中的数据来计算形成在测试基板的材料层中的接触孔的属性值。 接触孔的特性值可以是由接触孔暴露的下层基板的表面积或残留在接触孔中的残留材料的量。

公开(公告)号：US20080213069A1

公开(公告)日：2008-09-04

申请号：US12028993

申请日：2008-02-11

申请人： Chul-Gi Song ,  Deok-yong Kim ,  Yong-Chul Lee

发明人： Chul-Gi Song ,  Deok-yong Kim ,  Yong-Chul Lee

IPC分类号： H01L21/67

CPC分类号： H01L21/67772 ,  H01L21/67034 ,  H01L21/67115

摘要： An apparatus for fabricating semiconductor devices is provided. The apparatus includes a process equipment in which a process is performed and a transfer system attached to the process equipment to supply a substrate to the process equipment. The transfer system includes a transfer robot for moving the substrate and a light supplier for supplying ultraviolet rays to the substrate. Methods of fabricating the semiconductor devices using the apparatus are also provided.

摘要翻译： 提供一种用于制造半导体器件的装置。 该设备包括其中执行处理的处理设备和附接到处理设备以将基板供应到处理设备的传送系统。 传送系统包括用于移动基板的传送机器人和用于向基板供应紫外线的光供应器。 还提供了使用该装置制造半导体器件的方法。