公开(公告)号：US07529448B2

公开(公告)日：2009-05-05

申请号：US11524581

申请日：2006-09-21

Applicant: Ray T. Chen ,  Chulchae Choi

Inventor： Ray T. Chen ,  Chulchae Choi

IPC: G02B6/26 ,  G02B6/42

CPC classification number: H05K1/0274 ,  G02B6/4214 ,  G02B6/43 ,  H05K1/0203

Abstract: The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.

Abstract translation: 本发明提供了一种用于改进布置在印刷电路板（104）内的电 - 光发射机（100）的系统，方法和装置。 散热器（110,200）是设置在印刷电路板（104）的空腔（102）内并且热耦合到电 - 光发射器（100）的底表面（112）的导热材料， 。 导热材料的一部分大致延伸到印刷电路板（104）的层（114,116或118）的外表面（120,122或124）。 印刷电路板可以包括平面化信号通信系统或光电子信号通信系统。 此外，本发明提供一种制造散热器的方法，其中设置在印刷电路板的空腔内的电 - 光发射器被制造。 还提供了用于柔性波导和微镜耦合器的新方法。

公开(公告)号：US09070800B2

公开(公告)日：2015-06-30

申请号：US12557480

申请日：2009-09-10

Applicant: Jinsung Kim ,  Chulchae Choi ,  Changseo Park ,  Jaewon Chang ,  Hyungseok Kim ,  Youngho Choe ,  Philwon Yoon

Inventor： Jinsung Kim ,  Chulchae Choi ,  Changseo Park ,  Jaewon Chang ,  Hyungseok Kim ,  Youngho Choe ,  Philwon Yoon

IPC: H01L31/00 ,  H01L31/0236 ,  H01L31/0352 ,  H01L31/068 ,  H01L31/18

CPC classification number: H01L31/02366 ,  H01L31/02168 ,  H01L31/022433 ,  H01L31/0236 ,  H01L31/02363 ,  H01L31/03529 ,  H01L31/068 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

Abstract: The present invention relates to a solar cell. The solar cell includes a substrate of a first conductive type, the substrate having a textured surface on which a plurality of projected portions are formed, and surfaces of the projected portions having at least one of a plurality of particles attached thereto and a plurality of depressions formed thereon; an emitter layer of a second conductive type opposite the first conductive type, the emitter layer being positioned in the substrate so that the emitter layer has the textured surface; an anti-reflection layer positioned on the emitter layer which has the textured surface and including at least one layer; a plurality of first electrodes electrically connected to the emitter layer; and at least one second electrode electrically connected to the substrate.

Abstract translation: 本发明涉及一种太阳能电池。 太阳能电池包括第一导电类型的基板，该基板具有纹理表面，多个凸起部分形成在其上，并且突出部分的表面具有附着到其上的多个颗粒中的至少一个和多个凹陷部分 在其上形成; 与第一导电类型相反的第二导电类型的发射极层，发射极层位于衬底中，使得发射极层具有纹理表面; 位于发射极层上的防反射层，其具有纹理表面并且包括至少一个层; 电连接到发射极层的多个第一电极; 以及至少一个第二电极，其电连接到所述衬底。

公开(公告)号：US20070013061A1

公开(公告)日：2007-01-18

申请号：US11524576

申请日：2006-09-21

Applicant: Ray Chen ,  Chulchae Choi

Inventor： Ray Chen ,  Chulchae Choi

IPC: H01L23/34

CPC classification number: H05K1/0274 ,  G02B6/4214 ,  G02B6/43 ,  H05K1/0203

Abstract: The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.

公开(公告)号：US20100229917A1

公开(公告)日：2010-09-16

申请号：US12721353

申请日：2010-03-10

Applicant: Chulchae CHOI ,  Changseo Park ,  Jinsung Kim ,  Jaewon Chang ,  Hyungseok Kim ,  Youngho Choe ,  Philwon Yoon

Inventor： Chulchae CHOI ,  Changseo Park ,  Jinsung Kim ,  Jaewon Chang ,  Hyungseok Kim ,  Youngho Choe ,  Philwon Yoon

IPC: H01L31/042 ,  H01L31/00

CPC classification number: H01L31/022441 ,  H01L31/049 ,  H01L31/0516 ,  H01L31/0682 ,  Y02E10/547

Abstract: A solar cell and a solar cell module are disclosed. The solar cell includes a substrate of a first conductive type, a plurality of emitter layers of a second conductive type opposite the first conductive type, a plurality of first conductive members partially connected to the substrate, and a plurality of second conductive members partially connected to each of the plurality of emitter layers.

Abstract translation: 公开了太阳能电池和太阳能电池模块。 太阳能电池包括第一导电类型的衬底，与第一导电类型相对的第二导电类型的多个发射极层，部分地连接到衬底的多个第一导电构件，以及多个第二导电构件，其部分地连接到 多个发射极层中的每一个。

公开(公告)号：US07444041B1

公开(公告)日：2008-10-28

申请号：US11524557

申请日：2006-09-21

Applicant: Ray T. Chen ,  Chulchae Choi

Inventor： Ray T. Chen ,  Chulchae Choi

IPC: G02B6/30 ,  G02B6/42

CPC classification number: H05K1/0274 ,  G02B6/4214 ,  G02B6/43 ,  H05K1/0203

Abstract: The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.

Abstract translation: 本发明提供了一种用于改进布置在印刷电路板（104）内的电 - 光发射机（100）的系统，方法和装置。 散热器（110,200）是设置在印刷电路板（104）的空腔（102）内并且热耦合到电 - 光发射器（100）的底表面（112）的导热材料， 。 导热材料的一部分大致延伸到印刷电路板（104）的层（114,116或118）的外表面（120,122或124）。 印刷电路板可以包括平面化信号通信系统或光电子信号通信系统。 此外，本发明提供一种制造散热器的方法，其中设置在印刷电路板的空腔内的电 - 光发射器被制造。 还提供了用于柔性波导和微镜耦合器的新方法。

公开(公告)号：US20070063342A1

公开(公告)日：2007-03-22

申请号：US11524581

申请日：2006-09-21

Applicant: Ray Chen ,  Chulchae Choi

Inventor： Ray Chen ,  Chulchae Choi

IPC: H01L23/34

CPC classification number: H05K1/0274 ,  G02B6/4214 ,  G02B6/43 ,  H05K1/0203

Abstract: The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.

Abstract translation: 本发明提供了一种用于改进布置在印刷电路板（104）内的电 - 光发射机（100）的系统，方法和装置。 散热器（110,200）是设置在印刷电路板（104）的空腔（102）内并且热耦合到电 - 光发射器（100）的底表面（112）的导热材料， 。 导热材料的一部分大致延伸到印刷电路板（104）的层（114,116或118）的外表面（120,122或124）。 印刷电路板可以包括平面化信号通信系统或光电子信号通信系统。 此外，本发明提供一种制造散热器的方法，其中设置在印刷电路板的空腔内的电 - 光发射器被制造。 还提供了用于柔性波导和微镜耦合器的新方法。

公开(公告)号：US20100065117A1

公开(公告)日：2010-03-18

申请号：US12557480

申请日：2009-09-10

Applicant: Jinsung KIM ,  Chulchae Choi ,  Changseo Park ,  Jaewon Chang ,  Hyungseok Kim ,  Youngho Choe ,  Philwon Yoon

Inventor： Jinsung KIM ,  Chulchae Choi ,  Changseo Park ,  Jaewon Chang ,  Hyungseok Kim ,  Youngho Choe ,  Philwon Yoon

IPC: H01L31/0236 ,  H01L21/302

CPC classification number: H01L31/02366 ,  H01L31/02168 ,  H01L31/022433 ,  H01L31/0236 ,  H01L31/02363 ,  H01L31/03529 ,  H01L31/068 ,  H01L31/1804 ,  Y02E10/547 ,  Y02P70/521

Abstract: The present invention relates to a solar cell. The solar cell includes a substrate of a first conductive type, the substrate having a textured surface on which a plurality of projected portions are formed, and surfaces of the projected portions having at least one of a plurality of particles attached thereto and a plurality of depressions formed thereon; an emitter layer of a second conductive type opposite the first conductive type, the emitter layer being positioned in the substrate so that the emitter layer has the textured surface; an anti-reflection layer positioned on the emitter layer which has the textured surface and including at least one layer; a plurality of first electrodes electrically connected to the emitter layer; and at least one second electrode electrically connected to the substrate.

Abstract translation: 本发明涉及一种太阳能电池。 太阳能电池包括第一导电类型的基板，该基板具有纹理表面，多个凸起部分形成在其上，并且突出部分的表面具有附着到其上的多个颗粒中的至少一个和多个凹陷部分 在其上形成; 与第一导电类型相反的第二导电类型的发射极层，发射极层位于衬底中，使得发射极层具有纹理表面; 位于发射极层上的防反射层，其具有纹理表面并且包括至少一个层; 电连接到发射极层的多个第一电极; 以及至少一个第二电极，其电连接到所述衬底。

公开(公告)号：US20080273830A1

公开(公告)日：2008-11-06

申请号：US11524557

申请日：2006-09-21

Applicant: Ray T. Chen ,  Chulchae Choi

Inventor： Ray T. Chen ,  Chulchae Choi

IPC: G02B6/30

CPC classification number: H05K1/0274 ,  G02B6/4214 ,  G02B6/43 ,  H05K1/0203

Abstract: The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.

Abstract translation: 本发明提供了一种用于改进布置在印刷电路板（104）内的电 - 光发射机（100）的系统，方法和装置。 散热器（110,200）是设置在印刷电路板（104）的空腔（102）内并且热耦合到电 - 光发射器（100）的底表面（112）的导热材料， 。 导热材料的一部分大致延伸到印刷电路板（104）的层（114,116或118）的外表面（120,122或124）。 印刷电路板可以包括平面化信号通信系统或光电子信号通信系统。 此外，本发明提供一种制造散热器的方法，其中设置在印刷电路板的空腔内的电 - 光发射器被制造。 还提供了用于柔性波导和微镜耦合器的新方法。

公开(公告)号：US20050046011A1

公开(公告)日：2005-03-03

申请号：US10888350

申请日：2004-07-07

Applicant: Ray Chen ,  Chulchae Choi

Inventor： Ray Chen ,  Chulchae Choi

IPC: G02B6/42 ,  G02B6/43 ,  H01L23/15 ,  H05K1/02

CPC classification number: H05K1/0274 ,  G02B6/4214 ,  G02B6/43 ,  H05K1/0203

Abstract: The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.

Abstract translation: 本发明提供了一种用于改进布置在印刷电路板（104）内的电 - 光发射机（100）的系统，方法和装置。 散热器（110,200）是设置在印刷电路板（104）的空腔（102）内并且热耦合到电 - 光发射器（100）的底表面（112）的导热材料， 。 导热材料的一部分大致延伸到印刷电路板（104）的层（114,116或118）的外表面（120,122或124）。 印刷电路板可以包括平面化信号通信系统或光电子信号通信系统。 此外，本发明提供一种制造散热器的方法，其中设置在印刷电路板的空腔内的电 - 光发射器被制造。 还提供了用于柔性波导和微镜耦合器的新方法。