System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
    1.
    发明授权
    System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards 失效
    用于改进布置在印刷电路板内的电 - 光发射器的系统,方法和装置

    公开(公告)号:US07529448B2

    公开(公告)日:2009-05-05

    申请号:US11524581

    申请日:2006-09-21

    CPC classification number: H05K1/0274 G02B6/4214 G02B6/43 H05K1/0203

    Abstract: The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.

    Abstract translation: 本发明提供了一种用于改进布置在印刷电路板(104)内的电 - 光发射机(100)的系统,方法和装置。 散热器(110,200)是设置在印刷电路板(104)的空腔(102)内并且热耦合到电 - 光发射器(100)的底表面(112)的导热材料, 。 导热材料的一部分大致延伸到印刷电路板(104)的层(114,116或118)的外表面(120,122或124)。 印刷电路板可以包括平面化信号通信系统或光电子信号通信系统。 此外,本发明提供一种制造散热器的方法,其中设置在印刷电路板的空腔内的电 - 光发射器被制造。 还提供了用于柔性波导和微镜耦合器的新方法。

    System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards
    2.
    发明授权
    System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards 失效
    用于改进布置在印刷电路板内的电 - 光发射器的系统,方法和装置

    公开(公告)号:US07444041B1

    公开(公告)日:2008-10-28

    申请号:US11524557

    申请日:2006-09-21

    CPC classification number: H05K1/0274 G02B6/4214 G02B6/43 H05K1/0203

    Abstract: The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.

    Abstract translation: 本发明提供了一种用于改进布置在印刷电路板(104)内的电 - 光发射机(100)的系统,方法和装置。 散热器(110,200)是设置在印刷电路板(104)的空腔(102)内并且热耦合到电 - 光发射器(100)的底表面(112)的导热材料, 。 导热材料的一部分大致延伸到印刷电路板(104)的层(114,116或118)的外表面(120,122或124)。 印刷电路板可以包括平面化信号通信系统或光电子信号通信系统。 此外,本发明提供一种制造散热器的方法,其中设置在印刷电路板的空腔内的电 - 光发射器被制造。 还提供了用于柔性波导和微镜耦合器的新方法。

    SYSTEM, METHOD AND APPARATUS FOR IMPROVED ELECTRICAL-TO-OPTICAL TRANSMITTERS DISPOSED WITHIN PRINTED CIRCUIT BOARDS
    3.
    发明申请
    SYSTEM, METHOD AND APPARATUS FOR IMPROVED ELECTRICAL-TO-OPTICAL TRANSMITTERS DISPOSED WITHIN PRINTED CIRCUIT BOARDS 失效
    在印刷电路板中处理改进的电光放大器的系统,方法和装置

    公开(公告)号:US20080273830A1

    公开(公告)日:2008-11-06

    申请号:US11524557

    申请日:2006-09-21

    CPC classification number: H05K1/0274 G02B6/4214 G02B6/43 H05K1/0203

    Abstract: The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.

    Abstract translation: 本发明提供了一种用于改进布置在印刷电路板(104)内的电 - 光发射机(100)的系统,方法和装置。 散热器(110,200)是设置在印刷电路板(104)的空腔(102)内并且热耦合到电 - 光发射器(100)的底表面(112)的导热材料, 。 导热材料的一部分大致延伸到印刷电路板(104)的层(114,116或118)的外表面(120,122或124)。 印刷电路板可以包括平面化信号通信系统或光电子信号通信系统。 此外,本发明提供一种制造散热器的方法,其中设置在印刷电路板的空腔内的电 - 光发射器被制造。 还提供了用于柔性波导和微镜耦合器的新方法。

    Slot Waveguide with Structural Modulation
    4.
    发明申请

    公开(公告)号:US20190067830A1

    公开(公告)日:2019-02-28

    申请号:US15683527

    申请日:2017-08-22

    Abstract: Apparatuses for communication or sensing are disclosed, the apparatuses comprising a substrate; a bottom cladding disposed on the substrate; a device layer disposed on the bottom cladding, wherein the device layer comprises: two substantially parallel rails extending from an input side to an output side of the device layer and configured to form a slot between the two substantially parallel rails, wherein each of the two substantially parallel rails comprises an inner edge adjacent to the slot and an outer edge opposite the slot; and one or more teeth coupled to each of the two substantially parallel rails; and a top cladding disposed onto the device layer and bottom cladding; wherein the bottom cladding, the device layer, and the top cladding are configured to support at least one optical guided mode. Other embodiments are described and claimed.

    Subwavelength photonic crystal waveguide with trapezoidal shaped dielectric pillars in optical systems
    5.
    发明授权
    Subwavelength photonic crystal waveguide with trapezoidal shaped dielectric pillars in optical systems 有权
    光子系统中带梯形形介质柱的亚波长光子晶体波导

    公开(公告)号:US09563016B1

    公开(公告)日:2017-02-07

    申请号:US14951464

    申请日:2015-11-24

    Abstract: A method for reducing loss in a subwavelength photonic crystal waveguide bend is disclosed. The method comprising: forming the subwavelength photonic crystal waveguide bend with a series of trapezoidal shaped dielectric pillars centered about a bend radius; wherein each of the trapezoidal shaped dielectric pillars comprise a top width, a bottom width, and a trapezoid height; wherein the length of the bottom width is greater than the length of the top width; and wherein the bottom width is closer to the center of the bend radius of the subwavelength photonic crystal waveguide bend than the top width. Other embodiments are described and claimed.

    Abstract translation: 公开了一种用于减少亚波长光子晶体波导弯管中的损耗的方法。 该方法包括:用一系列以弯曲半径为中心的梯形介质柱形成亚波长光子晶体波导弯曲; 其中每个所述梯形介质柱包括顶部宽度,底部宽度和梯形高度; 其中所述底部宽度的长度大于所述顶部宽度的长度; 并且其中所述底部宽度比所述顶部宽度更靠近所述亚波长光子晶体波导弯曲部的弯曲半径的中心。 描述和要求保护其他实施例。

    Method for the Chip-Integrated Spectroscopic Identification of Solids, Liquids, and Gases
    7.
    发明申请
    Method for the Chip-Integrated Spectroscopic Identification of Solids, Liquids, and Gases 有权
    固体,液体和气体的芯片集成光谱鉴定方法

    公开(公告)号:US20140084147A1

    公开(公告)日:2014-03-27

    申请号:US14089759

    申请日:2013-11-26

    Abstract: Methods and systems for a label-free on-chip optical absorption spectrometer consisting of a photonic crystal slot waveguide are disclosed. The invention comprises an on-chip integrated optical absorption spectroscopy device that combines the slow light effect in photonic crystal waveguide and optical field enhancement in a slot waveguide and enables detection and identification of multiple analytes to be performed simultaneously using optical absorption techniques leading to a device for chemical and biological sensing, trace detection, and identification via unique analyte absorption spectral signatures. Other embodiments are described and claimed.

    Abstract translation: 公开了一种由光子晶体槽波导组成的无标签片上光吸收光谱仪的方法和系统。 本发明包括片内集成光吸收光谱装置,其结合光子晶体波导中的慢光效应和时隙波导中的光场增强,并且能够使用导致器件的光吸收技术同时执行多个分析物的检测和识别 用于化学和生物感测,痕量检测和通过独特的分析物吸收光谱特征识别。 描述和要求保护其他实施例。

    Fabrication Tolerant Design for the Chip-Integrated Spectroscopic Identification of Solids, Liquids, and Gases
    8.
    发明申请
    Fabrication Tolerant Design for the Chip-Integrated Spectroscopic Identification of Solids, Liquids, and Gases 有权
    用于固体,液体和气体的芯片集成光谱鉴定的制造容限设计

    公开(公告)号:US20120328233A1

    公开(公告)日:2012-12-27

    申请号:US13607794

    申请日:2012-09-09

    Abstract: Methods and systems for a label-free on-chip optical absorption spectrometer consisting of a photonic crystal slot waveguide are disclosed. The invention comprises an on-chip integrated optical absorption spectroscopy device that combines the slow light effect in photonic crystal waveguide and optical field enhancement in a slot waveguide and enables detection and identification of multiple analytes to be performed simultaneously using optical absorption techniques leading to a device for chemical and biological sensing, trace detection, and identification via unique analyte absorption spectral signatures. Other embodiments are described and claimed.

    Abstract translation: 公开了一种由光子晶体槽波导组成的无标签片上光吸收光谱仪的方法和系统。 本发明包括片内集成光吸收光谱装置,其结合光子晶体波导中的慢光效应和时隙波导中的光场增强,并且能够使用导致器件的光吸收技术同时执行多个分析物的检测和识别 用于化学和生物感测,痕量检测和通过独特的分析物吸收光谱特征识别。 描述和要求保护其他实施例。

    Multimode interference coupler for use with slot photonic crystal waveguides
    9.
    发明授权
    Multimode interference coupler for use with slot photonic crystal waveguides 有权
    用于插槽光子晶体波导的多模干涉耦合器

    公开(公告)号:US08189968B2

    公开(公告)日:2012-05-29

    申请号:US12550186

    申请日:2009-08-28

    CPC classification number: G02B6/1225 B82Y20/00 G02B6/29344

    Abstract: The present invention provides an optical apparatus having a multimode interference coupler configured to optically couple a strip waveguide to a slot photonic crystal waveguide. The multimode interference coupler has a coupling efficiency to the slot photonic crystal waveguide greater than or equal to 90%, a width that is approximately equal to a defect width of the slot photonic crystal waveguide, a length that is equal to or less than 1.5 μm, and interfaces with the slot photonic crystal waveguide at an edge of a period that gives a termination parameter of approximately zero. The optical apparatus may also include an insulation gap disposed between the multimode interference coupler and the slot photonic crystal waveguide, wherein the length of the multimode interference coupler is reduced by approximately one half of a width of the insulation gap.

    Abstract translation: 本发明提供了一种具有多模干涉耦合器的光学装置,其被配置为将条形波导光学耦合到时隙光子晶体波导。 多模干扰耦合器对槽隙光子晶体波导具有大于或等于90%的耦合效率,大约等于槽光子晶体波导的缺陷宽度的宽度,等于或小于1.5μm的长度 并且在给出约为零的终止参数的周期的边缘处与时隙光子晶体波导接口。 光学装置还可以包括设置在多模干涉耦合器和狭缝光子晶体波导之间的绝缘间隙,其中多模干涉耦合器的长度减小绝缘间隙的宽度的大约一半。

    System, method and apparatus for improved electrical-to-optical transmitters disposed within printed circuit boards

    公开(公告)号:US07457491B2

    公开(公告)日:2008-11-25

    申请号:US11524576

    申请日:2006-09-21

    CPC classification number: H05K1/0274 G02B6/4214 G02B6/43 H05K1/0203

    Abstract: The present invention provides a system, method and apparatus for improved electrical-to-optical transmitters (100) disposed within printed circuit boards (104). The heat sink (110, 200) is a thermal conductive material disposed within a cavity (102) of the printed circuit board (104) and is thermally coupled to a bottom surface (112) of the electrical-to-optical transmitter (100). A portion of the thermal conductive material extends approximately to an outer surface (120, 122 or 124) of a layer (114, 116 or 118) of the printed circuit board (104). The printed circuit board may comprise a planarized signal communications system or an optoelectronic signal communications system. In addition, the present invention provides a method for fabricating the heat sink wherein the electrical-to-optical transmitter disposed within a cavity of the printed circuit board is fabricated. New methods for flexible waveguides and micro-mirror couplers are also provided.

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