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公开(公告)号:US08029384B2
公开(公告)日:2011-10-04
申请号:US12464102
申请日:2009-05-12
Applicant: Chan-Tung Chen , Wen-Ching Hou , Chiang-Tai Lin , Jiun-Hseng Chuang , Chun-Han Wu
Inventor: Chan-Tung Chen , Wen-Ching Hou , Chiang-Tai Lin , Jiun-Hseng Chuang , Chun-Han Wu
IPC: A63B53/04
CPC classification number: A63B53/047 , A63B2053/0408 , A63B2053/0445 , A63B2209/00
Abstract: A golf club head includes a striking face having a plurality of grooves formed therein. At least one groove includes a first curved side surface, a second curved side surface opposite to the first curved side surface, and a bottom surface connecting the first and the second curved side surfaces. As viewed in the longitudinal direction of the at least one groove, the first and the second curved surfaces respectively have first and second involute profiles. A distance measured between the first and the second curved surfaces continuously increases from the bottom surface to the striking face.
Abstract translation: 高尔夫球杆头包括在其中形成有多个凹槽的冲击面。 至少一个凹槽包括第一弯曲侧表面,与第一弯曲侧表面相对的第二弯曲侧表面和连接第一弯曲侧表面和第二弯曲侧表面的底表面。 从至少一个槽的长度方向看,第一和第二曲面分别具有第一和第二渐开线轮廓。 在第一和第二曲面之间测量的距离从底面连续地增加到打击面。
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公开(公告)号:US20130009090A1
公开(公告)日:2013-01-10
申请号:US13611594
申请日:2012-09-12
Applicant: Chun-Han Wu , Tien-Huat Gan
Inventor: Chun-Han Wu , Tien-Huat Gan
IPC: C23F1/20
Abstract: An aluminum etchant includes 3-30 wt % of hydrochloric acid, 4-20 wt % of sulfuric acid, 1-5 wt % of oxidizing agent, 0.5-2 wt % of surfactant, and water for the rest. The etchant can produce circuits of 200-25 μm wide on an aluminum foil or aluminum plate. The circuit has good quality. Therefore, the invention is suitable for miniaturized products that require higher precision.
Abstract translation: 铝蚀刻剂包括3-30重量%的盐酸,4-20重量%的硫酸,1-5重量%的氧化剂,0.5-2重量%的表面活性剂和其余的水。 蚀刻剂可以在铝箔或铝板上产生200-25μm宽的电路。 电路质量好。 因此,本发明适用于需要更高精度的小型化产品。
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公开(公告)号:US06901601B1
公开(公告)日:2005-05-31
申请号:US09489791
申请日:2000-01-24
Applicant: Chun Han Wu , Huan Chang Lin
Inventor: Chun Han Wu , Huan Chang Lin
CPC classification number: G11B23/0316
Abstract: The optical recording medium protection cassette of the present invention comprises a housing, a clasping member and at least one switch member. A first opening for retaining an optical recording medium is formed on a first lateral side of the housing and a groove is formed on the inside of a second lateral side which is perpendicular to the first lateral side. The clasping member is in engagement with the first opening of the housing to restrict the optical recording medium to be located within the housing. The clasping member is provided with at least a first buckling portion and at least a V-shaped portion having a first side and a second side. Each switch member has a first end as a second buckling portion fastened to the first buckling portion of the clasping member, which makes the switch member rotate relative to the first buckling portion, and a second end which is a positioning portion substantially stops at either the first side or the second side of the V-shaped portion.Furthermore, a clip member is formed at the clasping member, which has a protruding portion to fasten the groove disposed at the inside of the second lateral side of the housing so as to secure the clasping member within the housing, and an annular portion, the protruding portion of the clip member being disengaged from the groove such that the clasping member can be withdrawn from the housing by switching the annular portion.
Abstract translation: 本发明的光记录介质保护盒包括壳体,夹紧构件和至少一个开关构件。 用于保持光学记录介质的第一开口形成在壳体的第一侧面上,并且在垂直于第一侧面的第二横向侧的内侧上形成有凹槽。 夹紧构件与壳体的第一开口接合以限制光记录介质位于壳体内。 夹紧构件设置有至少第一弯曲部分和至少具有第一侧面和第二侧面的V形部分。 每个开关构件具有第一端部,该第一端部紧固到夹紧构件的第一弯曲部分,该第二弯曲部分使得开关构件相对于第一弯曲部分旋转,并且作为定位部分的第二端基本上停止在 V形部分的第一侧或第二侧。 此外,夹紧构件形成在夹紧构件上,该夹紧构件具有突出部分,以紧固设置在壳体的第二侧面的内侧的凹槽,以将夹紧构件固定在壳体内,并且环形部分, 夹子构件的突出部分与凹槽脱离啮合,从而通过切换环形部分可以将夹紧构件从壳体中取出。
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4.
公开(公告)号:US07416930B2
公开(公告)日:2008-08-26
申请号:US11302280
申请日:2005-12-14
Applicant: Borlin Lee , Chun-Han Wu , Jin-Shan Pan , Hung-Ching Lai
Inventor: Borlin Lee , Chun-Han Wu , Jin-Shan Pan , Hung-Ching Lai
IPC: H01L21/336 , H01L21/8234 , H01L21/4763
CPC classification number: H01S5/18311 , H01S5/0261 , H01S5/0425 , H01S5/06226 , H01S2301/176
Abstract: A method for producing an oxide confined semiconductor laser uses a dual platform to synchronously produce a light emitting active area and a wire bonding area on a semiconductor material and use a metal protective material, an electrically conductive metal material, and a dielectric material together with an etching process, an oxide confined technology, and plating technology to produce the dual platform, an oxide layer, a dielectric layer, a protective layer, and a metal layer. The light emitting active area platform and the wire bonding area platform are independent, and the wire bonding area platform is produced on the semiconductor structure, such that an ion implant process can adjust the capacitance and provide a higher wire bonding strength. Since the electric layer is filled on the external sides of the dual platforms, the wire connected metal capacitance is lowered, and the planarization facilitates the production of the metal layer.
Abstract translation: 一种氧化物半导体激光器的制造方法使用双平台来同步地在半导体材料上产生发光有源区域和引线键合区域,并且使用金属保护材料,导电金属材料和介电材料以及 蚀刻工艺,氧化物限制技术和电镀技术来生产双平台,氧化物层,电介质层,保护层和金属层。 发光有源面积平台和引线键合区域平台是独立的,并且在半导体结构上制造引线接合区域平台,使得离子注入工艺可以调节电容并提供更高的引线键合强度。 由于电层被填充在双平台的外侧,所以连接的金属电容降低,平坦化有利于金属层的制造。
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公开(公告)号:US20120112124A1
公开(公告)日:2012-05-10
申请号:US12942974
申请日:2010-11-09
Applicant: Chun-Han Wu , Tien-Huat Gan
Inventor: Chun-Han Wu , Tien-Huat Gan
IPC: C09K13/04
CPC classification number: C09K13/04
Abstract: An aluminum etchant includes 3-30 wt % of hydrochloric acid, 4-20 wt % of sulfuric acid, and water for the rest. The etchant can produce circuits of 200-25 μm wide on an aluminum foil or aluminum plate. The circuit has good quality. Therefore, the invention is suitable for miniaturized products that require higher precision.
Abstract translation: 铝蚀刻剂包括3-30重量%的盐酸,4-20重量%的硫酸和其余的水。 蚀刻剂可以在铝箔或铝板上产生200-25μm宽的电路。 电路质量好。 因此,本发明适用于需要更高精度的小型化产品。
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公开(公告)号:US20100292025A1
公开(公告)日:2010-11-18
申请号:US12464102
申请日:2009-05-12
Applicant: Chan-Tung CHEN , Wen-Ching HOU , Chiang-Tai LIN , Jiun-Hseng CHUANG , Chun-Han WU
Inventor: Chan-Tung CHEN , Wen-Ching HOU , Chiang-Tai LIN , Jiun-Hseng CHUANG , Chun-Han WU
IPC: A63B53/04
CPC classification number: A63B53/047 , A63B2053/0408 , A63B2053/0445 , A63B2209/00
Abstract: A golf club head includes a striking face having a plurality of grooves formed therein. At least one groove includes a first curved side surface, a second curved side surface opposite to the first curved side surface, and a bottom surface connecting the first and the second curved side surfaces. As viewed in the longitudinal direction of the at least one groove, the first and the second curved surfaces respectively have first and second involute profiles. A distance measured between the first and the second curved surfaces continuously increases from the bottom surface to the striking face.
Abstract translation: 高尔夫球杆头包括在其中形成有多个凹槽的冲击面。 至少一个凹槽包括第一弯曲侧表面,与第一弯曲侧表面相对的第二弯曲侧表面和连接第一弯曲侧表面和第二弯曲侧表面的底表面。 从至少一个槽的长度方向看,第一和第二曲面分别具有第一和第二渐开线轮廓。 在第一和第二曲面之间测量的距离从底面连续地增加到打击面。
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7.
公开(公告)号:US20060126696A1
公开(公告)日:2006-06-15
申请号:US11302280
申请日:2005-12-14
Applicant: Borlin Lee , Chun-Han Wu , Jin-Shan Pan , Hung-Ching Lai
Inventor: Borlin Lee , Chun-Han Wu , Jin-Shan Pan , Hung-Ching Lai
IPC: H01S5/00
CPC classification number: H01S5/18311 , H01S5/0261 , H01S5/0425 , H01S5/06226 , H01S2301/176
Abstract: A method for producing an oxide confined semiconductor laser uses a dual platform to synchronously produce a light emitting active area and a wire bonding area on a semiconductor material and use a metal protective material, an electrically conductive metal material, and a dielectric material together with an etching process, an oxide confined technology, and plating technology to produce the dual platform, an oxide layer, a dielectric layer, a protective layer, and a metal layer. The light emitting active area platform and the wire bonding area platform are independent, and the wire bonding area platform is produced on the semiconductor structure, such that an ion implant process can adjust the capacitance and provide a higher wire bonding strength. Since the electric layer is filled on the external sides of the dual platforms, the wire connected metal capacitance is lowered, and the planarization facilitates the production of the metal layer.
Abstract translation: 一种氧化物半导体激光器的制造方法使用双平台来同步地在半导体材料上产生发光有源区域和引线键合区域,并且使用金属保护材料,导电金属材料和介电材料以及 蚀刻工艺,氧化物限制技术和电镀技术来生产双平台,氧化物层,电介质层,保护层和金属层。 发光有源面积平台和引线键合区域平台是独立的,并且在半导体结构上制造引线接合区域平台,使得离子注入工艺可以调节电容并提供更高的引线键合强度。 由于电层被填充在双平台的外侧,所以连接的金属电容降低,平坦化有利于金属层的制造。
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公开(公告)号:US20060126691A1
公开(公告)日:2006-06-15
申请号:US11302336
申请日:2005-12-14
Applicant: Borlin Lee , Chun-Han Wu , Jin-Shan Pan , Hung-Ching Lai
Inventor: Borlin Lee , Chun-Han Wu , Jin-Shan Pan , Hung-Ching Lai
IPC: H01S5/00
CPC classification number: H01S5/0261 , H01S5/0425 , H01S5/06226 , H01S5/18311 , H01S5/2214 , H01S2301/176
Abstract: A dual platform semiconductor laser device includes a laser chip layer, two independent platforms formed on the laser chip layer and defining a light emitting active area platform and a wire bonding platform, a planarized dielectric layer filled between the independent platforms, a protective layer disposed at the dielectric layer and including a contact area hole corresponding to the first independent platform, coated onto the metal layer at the protective layer and coupled to the first independent platform, and extended to the second independent platform to form a pad for wire bonding the first independent platform. The independent platforms define the second independent platform for wire bonding, and its capacitance is modulated to provide a stronger wire bonding strength, and the dielectric layer filled at the external sides of the two platforms lowers the wire connected metal capacitance and obtain a planarized surface for producing the metal layer easily.
Abstract translation: 双平台半导体激光器件包括激光芯片层,形成在激光芯片层上的两个独立平台,并且限定发光有源区域平台和引线键合平台,填充在独立平台之间的平坦化介电层,设置在 介电层并且包括与第一独立平台相对应的接触面积孔,在保护层处涂覆到金属层上并且耦合到第一独立平台,并且延伸到第二独立平台以形成用于引线键合的第一独立 平台。 独立平台定义了用于引线键合的第二独立平台,并且其电容被调制以提供更强的引线键合强度,并且在两个平台的外侧填充的电介质层降低了导线连接的金属电容并获得平面化表面 生产金属层容易。
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