公开(公告)号：US07452753B2

公开(公告)日：2008-11-18

申请号：US11172689

申请日：2005-06-30

申请人： Dae-Sang Chun ,  Jae-Hong Kim ,  Heui-Seog Kim ,  Jong-Keun Jeon ,  Wha-Su Sin

发明人： Dae-Sang Chun ,  Jae-Hong Kim ,  Heui-Seog Kim ,  Jong-Keun Jeon ,  Wha-Su Sin

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  H01L21/6835 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368

摘要： A method of processing a semiconductor wafer that has a first surface and a second surface opposite to the first surface. The method includes forming grooves of a predetermined depth on the second surface on which circuit patterns are formed, attaching a first surface of a protective tape to the second surface on which the grooves are formed, attaching a carrier tape to a second surface of the protective tape opposite to the first surface of the protective tape so that the first surface of the semiconductor wafer can be oriented upward, removing the first surface of the semiconductor wafer by a predetermined thickness and dividing the semiconductor wafer into chips by the grooves, and supplying each chip to a die bonder in the state where the first surface of the of the chip is oriented upward. Only one kind of die bonder is needed. A UV-type tape is not required.

摘要翻译： 一种处理具有与第一表面相对的第一表面和第二表面的半导体晶片的方法。 该方法包括在其上形成有电路图案的第二表面上形成预定深度的凹槽，将保护带的第一表面附接到其上形成有凹槽的第二表面，将载带附着到保护层的第二表面上 带，使得半导体晶片的第一表面可以向上取向，将半导体晶片的第一表面除去预定的厚度，并通过凹槽将半导体晶片分成芯片，并将每个 在芯片的第一表面朝向上方的状态下的芯片接合器。 只需要一种管芯焊接机。 不需要UV型胶带。

公开(公告)号：US20070023487A1

公开(公告)日：2007-02-01

申请号：US11447118

申请日：2006-06-06

申请人： Jun-young Ko ,  Ho-geon Song ,  Jae-yun Lim ,  Dae-sang Chun

发明人： Jun-young Ko ,  Ho-geon Song ,  Jae-yun Lim ,  Dae-sang Chun

IPC分类号： B23K31/00 ,  B23K31/02

CPC分类号： B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85947 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： A wire bonding method may involve forming a bonding ball on a leading end of a wire projected from a capillary. The bonding ball may be transformed to increase an area of the mounting surface of the bonding ball. The transformed bonding ball may be bonded to the bonding pad.

摘要翻译： 引线接合方法可以包括在从毛细管突出的线的前端形成接合球。 接合球可以被变形以增加接合球的安装表面的面积。 转变的接合球可以结合到接合焊盘。

公开(公告)号：US20060008948A1

公开(公告)日：2006-01-12

申请号：US11172689

申请日：2005-06-30

申请人： Dae-Sang Chun ,  Jae-Hong Kim ,  Heui-Seog Kim ,  Jong-Keun Jeon ,  Wha-Su Sin

发明人： Dae-Sang Chun ,  Jae-Hong Kim ,  Heui-Seog Kim ,  Jong-Keun Jeon ,  Wha-Su Sin

IPC分类号： H01L21/44

CPC分类号： H01L21/78 ,  H01L21/6835 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2221/68368

摘要： A method of processing a semiconductor wafer that has a first surface and a second surface opposite to the first surface. The method includes forming grooves of a predetermined depth on the second surface on which circuit patterns are formed, attaching a first surface of a protective tape to the second surface on which the grooves are formed, attaching a carrier tape to a second surface of the protective tape opposite to the first surface of the protective tape so that the first surface of the semiconductor wafer can be oriented upward, removing the first surface of the semiconductor wafer by a predetermined thickness and dividing the semiconductor wafer into chips by the grooves, and supplying each chip to a die bonder in the state where the first surface of the of the chip is oriented upward. Only one kind of die bonder is needed. A UV-type tape is not required.

摘要翻译： 一种处理具有与第一表面相对的第一表面和第二表面的半导体晶片的方法。 该方法包括在其上形成有电路图案的第二表面上形成预定深度的凹槽，将保护带的第一表面附接到其上形成有凹槽的第二表面，将载带附着到保护层的第二表面上 带，使得半导体晶片的第一表面可以向上取向，将半导体晶片的第一表面除去预定厚度，并通过凹槽将半导体晶片分成芯片，并且将每个 在芯片的第一表面朝向上方的状态下的芯片接合器。 只需要一种管芯焊接机。 不需要UV型胶带。