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8 条记录 (耗时 0.015 秒)

    End fitting tubular members and method of applying same
    1.
    发明授权
    End fitting tubular members and method of applying same 失效
    端部管件及其应用方法

    公开(公告)号：US06827375B2

    公开(公告)日：2004-12-07

    申请号：US10261518

    申请日：2002-10-01

    申请人： Dana J. Fraser

    发明人： Dana J. Fraser

    IPC分类号： F16L3300

    CPC分类号： F16L13/147 ,  F16L33/213 ,  Y10T29/49911 ,  Y10T29/49913

    摘要： An end fitting for tubular member and a method of applying an end fitting to a tubular member, according to which an end portion of the tubular member is placed in an annular space defined between an outer ferrule and a tubular insert having a tapered inner wall and a radially outwardly-directed force is applied to the insert to force it into engagement with the tubular member.

    摘要翻译： 用于管状构件的端部配件和将端部配件应用于管状构件的方法，根据该方法，管状构件的端部放置在限定在外部套圈和具有锥形内壁的管状插入件之间的环形空间中， 向插入件施加径向向外的力以迫使其与管状构件接合。

    Flexible pipe and method of manufacturing same using metal reinforced tape
    2.
    发明授权
    Flexible pipe and method of manufacturing same using metal reinforced tape 有权
    柔性管及其制造方法使用金属加固胶带

    公开(公告)号：US06899140B2

    公开(公告)日：2005-05-31

    申请号：US10217849

    申请日：2002-08-12

    申请人： Dana J. Fraser ,  Colin Soens

    发明人： Dana J. Fraser ,  Colin Soens

    IPC分类号： F16L9/12 ,  F16L11/00

    CPC分类号： F16L9/12 ,  F16L9/121 ,  F16L11/082

    摘要： A flexible pipe and a method of manufacturing same according to which a tubular sheath is provided that defines a longitudinal passage for receiving a conveyed fluid, a tape is formed by a plurality of metal fibers supported by a strip of flexible material to form a tape, and the tape is wound around the sheath.

    摘要翻译： 一种柔性管及其制造方法，根据该管，护套设置有限定用于接收输送的流体的纵向通道，带由多个由柔性材料条支撑的金属纤维形成，以形成带， 并且磁带缠绕在护套上。

    Low impedance package for integrated circuit die
    7.
    发明授权
    Low impedance package for integrated circuit die 失效
    用于集成电路管芯的低阻抗封装

    公开(公告)号：US4680613A

    公开(公告)日：1987-07-14

    申请号：US557119

    申请日：1983-12-01

    申请人： Wilbert E. Daniels ,  Dana J. Fraser

    发明人： Wilbert E. Daniels ,  Dana J. Fraser

    IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L23/64 ,  H01L23/48 ,  H01L23/30

    CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/3135 ,  H01L23/49534 ,  H01L23/49548 ,  H01L23/49589 ,  H01L23/645 ,  H01L2224/05553 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011

    摘要： A low inductive impedance dual in-line package for an integrated circuit die incorporates a lead frame formed with a central opening without a die attach paddle. A ground plate forms the die attach plane spaced from and parallel with the lead frame. A dielectric layer is formed between the lead frame and ground plate. The lead frame is formed with a ground lead finger electrically coupled in parallel with the ground plate thereby providing a ground path through the ground plate with planar configuration to minimize inductive impedance to ground current and to minimize cross coupling between the electrically active lead fingers of the lead frame. In the preferred embodiment, the lead frame and ground plate are initially supported in a spaced parallel plane relationship by complementary spacing tab elements. During encapsulation, the encapsulation molding compound is introduced between the lead frame and ground plate to form the dielectric layer. A low impedance lead frame is also described in which the power lead finger and ground lead finger are at least 2.5 times wider than the signal lead finger for cooperating with the ground plane and for minimizing inductive reactance to power currents and ground currents. The package may be further stabilized by incorporating an internal decoupling capacitor. The invention is particularly applicable to dual in-line packages (DIP'S) and provides a method for extending DIP technology for high speed low inductance applications.

    摘要翻译： 用于集成电路管芯的低电感阻抗双列直插封装包括形成有中心开口的引线框架，而没有管芯连接板。 接地板形成与引线框架间隔开并与引线框架平行的管芯附接平面。 在引线框架和接地板之间形成介电层。 引线框架形成有与接地板并联电耦合的接地引线指，从而提供通过接地板的平面配置的接地路径，以最小化对地电流的电感阻抗，并最小化电流有效引线的交叉耦合 引线框架 在优选实施例中，引线框架和接地板最初以间隔平行的平面关系由互补的间隔片元件支撑。 在封装期间，封装模塑料引入引线框架和接地板之间以形成电介质层。 还描述了一种低阻抗引线框架，其中电源引线指和接地引线指与信号引线相比至少2.5倍，用于与接地平面协作并最小化对电流和接地电流的感抗。 可以通过并入内部去耦电容器来进一步稳定封装。 本发明特别适用于双列直插封装（DIP'S），并提供了一种用于扩展用于高速低电感应用的DIP技术的方法。