公开(公告)号：US5483024A

公开(公告)日：1996-01-09

申请号：US134035

申请日：1993-10-08

申请人： Ernest J. Russell ,  Daniel A. Baudouin ,  Duy-Loan T. Le ,  James Wallace

发明人： Ernest J. Russell ,  Daniel A. Baudouin ,  Duy-Loan T. Le ,  James Wallace

IPC分类号： H01L23/495 ,  H01L23/02

CPC分类号： H01L23/4951 ,  H01L23/49575 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14

摘要： The invention discloses a high density semiconductor package. In one embodiment, two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are encapsulated, wherein only a portion of the leads of the lead frames protrudes and extends from the package.

摘要翻译： 本发明公开了一种高密度半导体封装。 在一个实施例中，两个半导体芯片各自固定在两个引线框架中相应的一个上。 半导体芯片和引线框架被封装，其中引线框架的引线的仅一部分从封装件突出并延伸。

公开(公告)号：US5637828A

公开(公告)日：1997-06-10

申请号：US483676

申请日：1995-06-07

申请人： Ernest J. Russell ,  Daniel A. Baudouin ,  Duy-Loan T. Le ,  James Wallace

发明人： Ernest J. Russell ,  Daniel A. Baudouin ,  Duy-Loan T. Le ,  James Wallace

IPC分类号： H01L23/495 ,  H01L23/28

CPC分类号： H01L23/4951 ,  H01L23/49575 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14

摘要： The invention discloses a high density semiconductor package. Two semiconductor chips are each affixed on a corresponding one of two lead frames. The semiconductor chips and the lead frames are encapsulated, wherein only a portion of the leads of the lead frames protrudes and extends from the package.

摘要翻译： 本发明公开了一种高密度半导体封装。 两个半导体芯片各自固定在两个引线框架中相应的一个上。 半导体芯片和引线框架被封装，其中引线框架的引线的仅一部分从封装突出并延伸。

公开(公告)号：US4975763A

公开(公告)日：1990-12-04

申请号：US168049

申请日：1988-03-14

申请人： Daniel A. Baudouin ,  Ernest J. Russell

发明人： Daniel A. Baudouin ,  Ernest J. Russell

IPC分类号： H05K1/18 ,  H01L23/495 ,  H01L23/50 ,  H05K3/30

CPC分类号： H05K3/303 ,  H01L23/49555 ,  H01L2924/0002 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613

摘要： A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package. The leads are bent to provide an area to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of the package adjacent the leads. The studs have stops formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.

公开(公告)号：US5275975A

公开(公告)日：1994-01-04

申请号：US907258

申请日：1992-07-01

申请人： Daniel A. Baudouin ,  Ernest J. Russell

发明人： Daniel A. Baudouin ,  Ernest J. Russell

IPC分类号： H01L23/495 ,  H05K3/30 ,  H01L21/60

CPC分类号： H01L23/49555 ,  H05K3/303 ,  H01L2924/0002 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49121

摘要： A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package. The leads are bent to provide an area to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of the package adjacent the leads. The studs have stops formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.

摘要翻译： 用于半导体集成电路器件的扁平封装允许边缘安装和表面贴装。 封装可以是包含半导体芯片的模制塑料，并且扁平引线从封装的一个边缘延伸。 引线被弯曲以提供焊接到PC板上的导体的区域。 机械定位，机械支撑和间距由靠近导线的封装边缘延伸的螺柱提供。 螺柱具有形成在甚至具有弯曲引线的平坦外表面的位置处的止动件; 止动件外侧的部分适合PC板中的孔。

公开(公告)号：US5260601A

公开(公告)日：1993-11-09

申请号：US578058

申请日：1990-09-05

申请人： Daniel A. Baudouin ,  Ernest J. Russell

发明人： Daniel A. Baudouin ,  Ernest J. Russell

IPC分类号： H01L23/495 ,  H05K3/30 ,  H05K7/12 ,  H01L23/50

CPC分类号： H01L23/49555 ,  H05K3/303 ,  H01L2924/0002 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49121

摘要： A flat package for semiconductor integrated circuit devices allows edge-mounting and surface-mount. The package may be molded plastic containing a semiconductor chip, and flat leads extend from one edge of the package. The leads are bent to provide an area to solder to conductors on a PC board. Mechanical positioning, mechanical support and spacing are provided by studs extending from the edge of the package adjacent the leads. The studs have stops formed at a position even with flat outer surfaces of the bent leads; the portion outward of the stops fits into holes in the PC board.

摘要翻译： 用于半导体集成电路器件的扁平封装允许边缘安装和表面贴装。 封装可以是包含半导体芯片的模制塑料，并且扁平引线从封装的一个边缘延伸。 引线被弯曲以提供焊接到PC板上的导体的区域。 机械定位，机械支撑和间距由靠近导线的封装边缘延伸的螺柱提供。 螺柱具有形成在甚至具有弯曲引线的平坦外表面的位置处的止动件; 止动件外侧的部分适合PC板中的孔。

公开(公告)号：US4994938A

公开(公告)日：1991-02-19

申请号：US290972

申请日：1988-12-28

申请人： Daniel A. Baudouin

发明人： Daniel A. Baudouin

IPC分类号： H05K1/18 ,  H05K3/34 ,  H05K3/40

CPC分类号： H05K1/184 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09981 ,  H05K2201/10636 ,  H05K3/403 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144

摘要： A printed circuit board or other substrate mounts electrical components substantially coplanar with the median plane or thickness of the board or substrate. The board furnishes an opening having bonding pads plated through the opening and fixed on the opposite sidewalls of the opening. The electrical component becomes placed in the the opening with solder paste between the bonding pads and end terminals of the electrical component. Reflow soldering techniques melt the solder paste into solder filets that solidify to fasten the electrical component within the opening in coplanar with the median plane or thickness of the board.

摘要翻译： 印刷电路板或其它基板安装与基板或基板的中间平面或厚度基本上共面的电气部件。 板提供开口，其具有通过开口电镀并且固定在开口的相对侧壁上的焊盘。 电气部件通过在焊接焊盘和电气部件的端子之间的焊膏放置在开口中。 回流焊接技术将焊膏熔化成焊料，其固化，以将开口内的电气部件与板的中间平面或厚度共面紧固。