公开(公告)号：US08758552B2

公开(公告)日：2014-06-24

申请号：US12898623

申请日：2010-10-05

申请人： Steve Canale ,  David J. Zapp ,  Daniel E. Sanchez ,  Hung V. Phan ,  Hyong Y. Lee

发明人： Steve Canale ,  David J. Zapp ,  Daniel E. Sanchez ,  Hung V. Phan ,  Hyong Y. Lee

IPC分类号： B32B38/10

CPC分类号： B32B43/006 ,  H01L21/67005 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/6835 ,  H01L21/6838 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T156/1132 ,  Y10T156/1933 ,  Y10T156/1944 ,  Y10T156/1961 ,  Y10T156/1978

摘要： Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.

摘要翻译： 公开了用于从载板剥离晶片的系统，装置和方法。 在某些晶片处理操作中，期望将晶片临时安装在载体板上用于支撑和易于处理。 这种安装可以通过用粘合剂粘合晶片和载体板来实现。 一旦这样的操作完成，晶片需要从载板脱离。 这种脱粘工艺可以通过对晶片载体板组件施加吸力来实现。 公开了各种脱粘系统，装置和方法以及相关特征。

公开(公告)号：US20110297329A1

公开(公告)日：2011-12-08

申请号：US12898623

申请日：2010-10-05

申请人： Steve Canale ,  David J. Zapp ,  Daniel E. Sanchez ,  Hung V. Phan ,  Hyong Y. Lee

发明人： Steve Canale ,  David J. Zapp ,  Daniel E. Sanchez ,  Hung V. Phan ,  Hyong Y. Lee

IPC分类号： H01L21/687

CPC分类号： B32B43/006 ,  H01L21/67005 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/6835 ,  H01L21/6838 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T156/1132 ,  Y10T156/1933 ,  Y10T156/1944 ,  Y10T156/1961 ,  Y10T156/1978

摘要： Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.

摘要翻译： 公开了用于从载板剥离晶片的系统，装置和方法。 在某些晶片处理操作中，期望将晶片临时安装在载体板上用于支撑和易于处理。 这种安装可以通过用粘合剂粘合晶片和载体板来实现。 一旦这样的操作完成，晶片需要从载板脱离。 这种脱粘工艺可以通过对晶片载体板组件施加吸力来实现。 公开了各种脱粘系统，装置和方法以及相关特征。