公开(公告)号：US20120080052A1

公开(公告)日：2012-04-05

申请号：US12898627

申请日：2010-10-05

申请人： Steve Canale ,  David J. Zapp

发明人： Steve Canale ,  David J. Zapp

IPC分类号： B08B7/00 ,  B08B3/00 ,  B32B3/02 ,  B23Q3/18

CPC分类号： H01L21/02076 ,  B23Q3/084 ,  H01L21/6838 ,  H01L21/68735 ,  Y10S269/90 ,  Y10S269/903 ,  Y10T428/21

摘要： Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations such as solvent and plasma cleaning. In an example situation, a wafer that has been separated from a support plate can be cleaned. The wafer still needs to be handled carefully during such a cleaning operation. Various devices and methodologies that facilitate efficient handling of wafers and wafer-cleaning operations are disclosed.

摘要翻译： 公开了用于在诸如溶剂和等离子体清洗的晶片加工操作中处理晶片的系统，装置和方法。 在示例情况下，可以清洁已经与支撑板分离的晶片。 在这样的清洁操作期间，晶片仍然需要小心处理。 公开了有助于晶片和晶片清洁操作的有效处理的各种装置和方法。

公开(公告)号：US08758553B2

公开(公告)日：2014-06-24

申请号：US12898648

申请日：2010-10-05

申请人： Jens A. Riege ,  Steve Canale ,  David J. Zapp

发明人： Jens A. Riege ,  Steve Canale ,  David J. Zapp

IPC分类号： B32B38/10

CPC分类号： H01L21/6838 ,  B32B38/10 ,  B32B2457/14 ,  H01L21/67092

摘要： Disclosed are systems, devices and methodologies for separating wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be separated or unbonded from the carrier plate. Such a separation process can be achieved by applying a mechanical shear force to the wafer-carrier plate assembly. Various devices and methodologies, and related features, are disclosed.

摘要翻译： 公开了用于从载板分离晶片的系统，装置和方法。 在某些晶片处理操作中，期望将晶片临时安装在载体板上用于支撑和易于处理。 这种安装可以通过用粘合剂粘合晶片和载体板来实现。 一旦这样的操作完成，晶片需要与载体板分离或未粘合。 这种分离过程可以通过对晶片载体板组件施加机械剪切力来实现。 公开了各种装置和方法以及相关特征。

公开(公告)号：US08758552B2

公开(公告)日：2014-06-24

申请号：US12898623

申请日：2010-10-05

申请人： Steve Canale ,  David J. Zapp ,  Daniel E. Sanchez ,  Hung V. Phan ,  Hyong Y. Lee

发明人： Steve Canale ,  David J. Zapp ,  Daniel E. Sanchez ,  Hung V. Phan ,  Hyong Y. Lee

IPC分类号： B32B38/10

CPC分类号： B32B43/006 ,  H01L21/67005 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/6835 ,  H01L21/6838 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T156/1132 ,  Y10T156/1933 ,  Y10T156/1944 ,  Y10T156/1961 ,  Y10T156/1978

摘要： Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.

摘要翻译： 公开了用于从载板剥离晶片的系统，装置和方法。 在某些晶片处理操作中，期望将晶片临时安装在载体板上用于支撑和易于处理。 这种安装可以通过用粘合剂粘合晶片和载体板来实现。 一旦这样的操作完成，晶片需要从载板脱离。 这种脱粘工艺可以通过对晶片载体板组件施加吸力来实现。 公开了各种脱粘系统，装置和方法以及相关特征。

公开(公告)号：US08640755B2

公开(公告)日：2014-02-04

申请号：US12898643

申请日：2010-10-05

申请人： Steve Canale ,  David J. Zapp

发明人： Steve Canale ,  David J. Zapp

IPC分类号： B32B37/00

CPC分类号： B32B37/1009 ,  B32B38/0004 ,  B32B38/1858 ,  B32B2310/0843 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/673 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/76898 ,  H01L22/10 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68372 ,  Y10T156/10 ,  Y10T292/45

摘要： Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer.

摘要翻译： 公开了与晶片接合机的固定机构相关联的各种特征。 在某些情况下，固定机构的操作可能产生不期望的颗粒和碎屑，并且其中一些可以被引入被粘合的晶片。 在某些实施方案中，固定机构可被配置成减少将这种颗粒和碎屑引入晶片的可能性。

公开(公告)号：US20120080832A1

公开(公告)日：2012-04-05

申请号：US13153954

申请日：2011-06-06

申请人： Elena B. Woodard ,  Daniel K. Berkoh ,  David J. Zapp ,  Steve Canale

发明人： Elena B. Woodard ,  Daniel K. Berkoh ,  David J. Zapp ,  Steve Canale

IPC分类号： B23Q3/18 ,  B32B17/00 ,  B32B3/02 ,  F24J3/00

CPC分类号： H01L21/6835 ,  B23Q3/084 ,  B32B43/006 ,  H01L21/67092 ,  H01L21/6838 ,  H01L2221/68327 ,  H01L2221/68359 ,  H01L2221/68381 ,  Y10S156/93 ,  Y10S156/941 ,  Y10T156/1132 ,  Y10T156/1933 ,  Y10T156/1944 ,  Y10T156/1978 ,  Y10T428/21 ,  Y10T428/219

摘要： Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a wafer carrier can be configured as a plate to allow bonding of a wafer thereto to provide support for the wafer during some processing operations. Upon completion of such operations, the processed wafer can be separated from the support plate so as to allow further processing. Various devices and methodologies related to such wafer carriers for efficient handling of wafers are disclosed.

摘要翻译： 公开了通过使用晶片载体在晶片处理操作中处理晶片的系统，装置和方法。 在一个示例情况下，可以将晶片载体配置为板，以允许将晶片接合到其上，以在一些处理操作期间为晶片提供支撑。 在完成这样的操作时，处理的晶片可以与支撑板分离，以便进一步处理。 公开了与用于晶片的有效处理的这种晶片载体相关的各种装置和方法。

公开(公告)号：US20120080132A1

公开(公告)日：2012-04-05

申请号：US12898643

申请日：2010-10-05

申请人： Steve Canale ,  David J. Zapp

发明人： Steve Canale ,  David J. Zapp

IPC分类号： B32B37/10 ,  E05C19/00 ,  B32B37/12

CPC分类号： B32B37/1009 ,  B32B38/0004 ,  B32B38/1858 ,  B32B2310/0843 ,  B32B2457/14 ,  H01L21/67092 ,  H01L21/673 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/76898 ,  H01L22/10 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68372 ,  Y10T156/10 ,  Y10T292/45

摘要： Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer.

摘要翻译： 公开了与晶片接合机的固定机构相关联的各种特征。 在某些情况下，固定机构的操作可能产生不期望的颗粒和碎屑，并且其中一些可以被引入被粘合的晶片。 在某些实施方案中，固定机构可被配置成减少将这种颗粒和碎屑引入晶片的可能性。

公开(公告)号：US08888085B2

公开(公告)日：2014-11-18

申请号：US12898627

申请日：2010-10-05

申请人： Steve Canale ,  David J. Zapp

发明人： Steve Canale ,  David J. Zapp

IPC分类号： B23Q3/00 ,  B23Q3/08 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L21/02076 ,  B23Q3/084 ,  H01L21/6838 ,  H01L21/68735 ,  Y10S269/90 ,  Y10S269/903 ,  Y10T428/21

摘要： Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations such as solvent and plasma cleaning. In an example situation, a wafer that has been separated from a support plate can be cleaned. The wafer still needs to be handled carefully during such a cleaning operation. Various devices and methodologies that facilitate efficient handling of wafers and wafer-cleaning operations are disclosed.

摘要翻译： 公开了用于在诸如溶剂和等离子体清洗的晶片加工操作中处理晶片的系统，装置和方法。 在示例情况下，可以清洁已经与支撑板分离的晶片。 在这样的清洁操作期间，晶片仍然需要小心处理。 公开了有助于晶片和晶片清洁操作的有效处理的各种装置和方法。

公开(公告)号：US20120080150A1

公开(公告)日：2012-04-05

申请号：US12898648

申请日：2010-10-05

申请人： Jens A. Riege ,  Steve Canale ,  David J. Zapp

发明人： Jens A. Riege ,  Steve Canale ,  David J. Zapp

IPC分类号： B32B38/10

CPC分类号： H01L21/6838 ,  B32B38/10 ,  B32B2457/14 ,  H01L21/67092

摘要： Disclosed are systems, devices and methodologies for separating wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be separated or unbonded from the carrier plate. Such a separation process can be achieved by applying a mechanical shear force to the wafer-carrier plate assembly. Various devices and methodologies, and related features, are disclosed.

摘要翻译： 公开了用于从载板分离晶片的系统，装置和方法。 在某些晶片处理操作中，期望将晶片临时安装在载体板上用于支撑和易于处理。 这种安装可以通过用粘合剂粘合晶片和载体板来实现。 一旦这样的操作完成，晶片需要与载体板分离或未粘合。 这种分离过程可以通过对晶片载体板组件施加机械剪切力来实现。 公开了各种装置和方法以及相关特征。

公开(公告)号：US20110297329A1

公开(公告)日：2011-12-08

申请号：US12898623

申请日：2010-10-05

申请人： Steve Canale ,  David J. Zapp ,  Daniel E. Sanchez ,  Hung V. Phan ,  Hyong Y. Lee

发明人： Steve Canale ,  David J. Zapp ,  Daniel E. Sanchez ,  Hung V. Phan ,  Hyong Y. Lee

IPC分类号： H01L21/687

CPC分类号： B32B43/006 ,  H01L21/67005 ,  H01L21/67092 ,  H01L21/67253 ,  H01L21/6835 ,  H01L21/6838 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T156/1132 ,  Y10T156/1933 ,  Y10T156/1944 ,  Y10T156/1961 ,  Y10T156/1978

摘要： Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.

摘要翻译： 公开了用于从载板剥离晶片的系统，装置和方法。 在某些晶片处理操作中，期望将晶片临时安装在载体板上用于支撑和易于处理。 这种安装可以通过用粘合剂粘合晶片和载体板来实现。 一旦这样的操作完成，晶片需要从载板脱离。 这种脱粘工艺可以通过对晶片载体板组件施加吸力来实现。 公开了各种脱粘系统，装置和方法以及相关特征。