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公开(公告)号:US4336320A
公开(公告)日:1982-06-22
申请号:US243176
申请日:1981-03-12
IPC分类号: H05K3/10 , G03F7/00 , H05K1/03 , H05K1/09 , H05K3/00 , H05K3/12 , H05K3/40 , H05K3/46 , G03C7/00
CPC分类号: H05K3/4667 , G03F7/00 , H05K3/1258 , H05K1/0306 , H05K1/092 , H05K2203/0514 , H05K2203/0568 , H05K3/002 , H05K3/0023 , H05K3/10 , H05K3/107 , H05K3/4053 , H05K3/465
摘要: The present invention is directed to a process for complex, high density microcircuits in which thick film dielectric pastes are photolithography patterned into high resolution stencils to produce complementary conductor circuitry patterns, the voids of the developed dielectric stencil are filled with thick film conductor paste, and then there is a cofiring of the conductor and the dielectric. With this new process the number of separate firing operations is reduced. The reduction in the number of firings is important in multilevel hybrid structures.
摘要翻译: 本发明涉及一种复杂的高密度微电路的方法,其中厚膜电介质浆料被光刻图案化成高分辨率模板以产生互补导体电路图案,显影的电介质模板的空隙填充有厚膜导体膏,以及 那么导体和电介质的共烧。 通过这个新的过程,单独的点火操作的数量减少了。 在多级混合结构中,发射次数的减少很重要。