公开(公告)号：US09869392B2

公开(公告)日：2018-01-16

申请号：US13528194

申请日：2012-06-20

Applicant: David Schaefer ,  Ambarish Chhatre ,  Keith William Gaff ,  Sung Lee ,  Brooke Mesler Lai

Inventor： David Schaefer ,  Ambarish Chhatre ,  Keith William Gaff ,  Sung Lee ,  Brooke Mesler Lai

IPC: F16J15/02 ,  H02N13/00 ,  H01L21/683 ,  H01J37/32

CPC classification number: F16J15/021 ,  H01J37/32495 ,  H01J37/32532 ,  H01J37/3255 ,  H01J37/32568 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/6831 ,  H01L21/6833 ,  H01L21/6838 ,  H02N13/00 ,  Y10T29/49908

Abstract: A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled lower base plate, an upper plate, a mounting groove surrounding a bond layer and an edge seal comprising an elastomeric band having an outer concave surface in an uncompressed state, the band mounted in the groove such that upper and lower ends of the band are axially compressed and a maximum outward bulging of the band is no greater than a predetermined distance.

公开(公告)号：US09054148B2

公开(公告)日：2015-06-09

申请号：US13219540

申请日：2011-08-26

Applicant: Hong Shih ,  Tuochuan Huang ,  David Schaefer ,  Ambarish Chhatre ,  John Daugherty ,  MingHang Wu ,  Clifford La Croix

Inventor： Hong Shih ,  Tuochuan Huang ,  David Schaefer ,  Ambarish Chhatre ,  John Daugherty ,  MingHang Wu ,  Clifford La Croix

IPC: B05D5/12 ,  H01L21/683 ,  B05D7/00 ,  C23C22/66 ,  C23C8/02

CPC classification number: H01L21/6831 ,  B05D5/12 ,  B05D7/52 ,  C23C8/02 ,  C23C22/66 ,  H01L21/6833

Abstract: A method is provided for treating a bipolar ESC having a front surface and a back surface, the front surface including an anodized layer. The method includes eliminating the anodized layer, disposing a new anodized layer onto the front surface, and treating the new anodized layer with water to seal the new anodized layer.

Abstract translation: 提供了一种用于处理具有前表面和后表面的双极ESC的方法，前表面包括阳极氧化层。 该方法包括消除阳极氧化层，将新的阳极氧化层设置在前表面上，以及用水处理新的阳极氧化层以密封新的阳极氧化层。

公开(公告)号：US20130097840A1

公开(公告)日：2013-04-25

申请号：US13277873

申请日：2011-10-20

Applicant: David Schaefer ,  Ambarish Chhatre ,  Keith William Gaff ,  Sung Lee

Inventor： David Schaefer ,  Ambarish Chhatre ,  Keith William Gaff ,  Sung Lee

IPC: B23P11/00 ,  H01L21/3065

CPC classification number: H01L21/6833 ,  H01J37/32513 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/68757 ,  Y10T29/49826

Abstract: A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled lower base plate, an upper plate, a mounting groove surrounding a bond layer and an edge seal comprising an elastomeric band having an outer concave surface in an uncompressed state, the band mounted in the groove such that upper and lower ends of the band are axially compressed and a maximum outward bulging of the band is no greater than a predetermined distance.

公开(公告)号：US20130052339A1

公开(公告)日：2013-02-28

申请号：US13219540

申请日：2011-08-26

Applicant: Hong Shih ,  Tuochuan Huang ,  David Schaefer ,  Ambarish Chhatre ,  John Daugherty ,  MingHang Wu ,  Clifford La Croix

Inventor： Hong Shih ,  Tuochuan Huang ,  David Schaefer ,  Ambarish Chhatre ,  John Daugherty ,  MingHang Wu ,  Clifford La Croix

IPC: B05D5/12

CPC classification number: H01L21/6831 ,  B05D5/12 ,  B05D7/52 ,  C23C8/02 ,  C23C22/66 ,  H01L21/6833

Abstract: A method is provided for treating a bipolar ESC having a front surface and a back surface, the front surface including an anodized layer. The method includes eliminating the anodized layer, disposing a new anodized layer onto the front surface, and treating the new anodized layer with water to seal the new anodized layer.

公开(公告)号：USD664631S1

公开(公告)日：2012-07-31

申请号：US29415024

申请日：2012-03-06

Applicant: David Schaefer

Designer： David Schaefer

公开(公告)号：USD658271S1

公开(公告)日：2012-04-24

申请号：US29369873

申请日：2010-09-14

Applicant: David Schaefer

Designer： David Schaefer

公开(公告)号：US20080103451A1

公开(公告)日：2008-05-01

申请号：US11929530

申请日：2007-10-30

Applicant: Donald Schaefer ,  David Schaefer

Inventor： Donald Schaefer ,  David Schaefer

IPC: A61M25/02

CPC classification number: A61F13/022 ,  A61F2013/00412 ,  A61F2013/00536 ,  A61F2013/00553 ,  A61F2013/00727

Abstract: The present invention includes methods, kits and bandages that accommodate a medical device extending from an incision in a patient. The bandage includes an outer surface, inner absorbent layer and one or more closure mechanisms. The outer surface includes a slit extending from an outer peripheral edge to an inner peripheral edge that forms an aperture to accommodate a medical device. The inner absorbent layer is in contact with the outer surface and at least partially spans the aperture to accommodate the medical device. The one or more closure mechanisms are used to substantially seal the slit. The bandage is positioned about the incision and secured about the medical device for absorption.

Abstract translation: 本发明包括容纳从患者的切口延伸的医疗装置的方法，套件和绷带。 绷带包括外表面，内吸收层和一个或多个闭合机构。 外表面包括从外围边缘延伸到形成孔以容纳医疗装置的内周边缘的狭缝。 内吸收层与外表面接触并且至少部分地跨过孔以容纳医疗装置。 一个或多个闭合机构用于基本上密封狭缝。 绷带围绕切口定位并围绕医疗装置固定以进行吸收。

公开(公告)号：US20070217642A1

公开(公告)日：2007-09-20

申请号：US11366092

申请日：2006-03-02

Applicant: Timothy Wickstrom ,  William Ballad ,  David Schaefer

Inventor： Timothy Wickstrom ,  William Ballad ,  David Schaefer

IPC: H04R25/00 ,  H04R25/02

CPC classification number: H04R1/1016

Abstract: An insert earphone comprises a housing and at least one transducer that is located in the housing. The transducer is adapted to receive electrical energy and to responsively convert the electrical energy into acoustic energy for presentation to an eardrum of a user. The transducer is positioned within the housing so as to be in close proximity to the eardrum of the user when the housing is inserted into the ear canal. At least one sealing member is coupled to the housing. The at least one sealing member is adapted to provide an acoustic seal within the ear canal of the user.

Abstract translation: 插入式耳机包括壳体和位于壳体中的至少一个换能器。 换能器适于接收电能并且将电能响应地转换成声能以呈现给用户的鼓膜。 当外壳插入到耳道中时，换能器定位在壳体内，以便靠近使用者的鼓膜。 至少一个密封构件联接到壳体。 所述至少一个密封构件适于在使用者的耳道内提供声学密封。

公开(公告)号：US20060158034A1

公开(公告)日：2006-07-20

申请号：US11328568

申请日：2006-01-10

Applicant: Michael Standish ,  James Hollister ,  Margaret Lamb ,  Roy Maguire ,  Thomas Oertley ,  Roger Recker ,  David Schaefer

Inventor： Michael Standish ,  James Hollister ,  Margaret Lamb ,  Roy Maguire ,  Thomas Oertley ,  Roger Recker ,  David Schaefer

IPC: B62D55/14

CPC classification number: B62D55/14 ,  B62D55/096 ,  B62D55/305

Abstract: An apparatus and method for reducing vibrational effects of track chain assembly catenary hang is disclosed. A work machine includes a pair of track roller assemblies one positioned on each side of the work machine. The vibration reducing apparatus and method includes repositioning undercarriage components to vary the catenary hang from one side of the work machine to the other.

Abstract translation: 公开了一种用于减少履带链组装悬链的振动效应的装置和方法。 工作机器包括一对定位在作业机的每一侧上的履带轮组件。 减振装置和方法包括重新定位底盘部件，以使悬臂从工作机的一侧改变到另一侧。

公开(公告)号：US09859142B2

公开(公告)日：2018-01-02

申请号：US13277873

申请日：2011-10-20

Applicant: David Schaefer ,  Ambarish Chhatre ,  Keith William Gaff ,  Sung Lee

Inventor： David Schaefer ,  Ambarish Chhatre ,  Keith William Gaff ,  Sung Lee

IPC: F16J15/02 ,  H01L21/683 ,  H01J37/32 ,  H01L21/687

CPC classification number: H01L21/6833 ,  H01J37/32513 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/68757 ,  Y10T29/49826

Abstract: A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled lower base plate, an upper plate, a mounting groove surrounding a bond layer and an edge seal comprising an elastomeric band having an outer concave surface in an uncompressed state, the band mounted in the groove such that upper and lower ends of the band are axially compressed and a maximum outward bulging of the band is no greater than a predetermined distance.