公开(公告)号：US06509063B1

公开(公告)日：2003-01-21

申请号：US09656430

申请日：2000-09-06

Applicant: Thomas Fitzgerald McCarthy ,  David Schwind ,  Gordon Smith

Inventor： Thomas Fitzgerald McCarthy ,  David Schwind ,  Gordon Smith

IPC: B05D302

CPC classification number: C08G61/02 ,  B32B27/04 ,  C07C39/17 ,  C07C2602/08 ,  C08G59/621 ,  C08L63/00 ,  H05K1/0326 ,  Y10T428/31511 ,  C08L2666/22

Abstract: Novel polyindanebisphenols or PIBPs for the preparation of new and improved thermosetting polymers having the general formula of are provided. Also disclosed are thermoplastic or thermoset compositions prepared using the novel compounds of the invention, as well as methods of making and using the same. When copolymerized or reactive with other commercial resins such as, e.g., epoxy compounds, PIBP based polymers are characterized by high glass transition temperature (“Tg”), low dielectric constant, low moisture absorption, low coefficient of expansion, low cost, and can be processed on equipment typically used for the production of epoxy based laminates.

Abstract translation: 用于制备具有通式的新的和改进的热固性聚合物的新型聚茚二酚双酚或PIBP。 还公开了使用本发明的新化合物制备的热塑性或热固性组合物，以及制备和使用本发明的方法。 当与其它商业树脂例如环氧化合物共聚或反应时，基于PIBP的聚合物的特征在于玻璃化转变温度（“Tg”）高，介电常数低，吸湿率低，膨胀系数低，成本低， 在通常用于生产环氧基层压板的设备上进行加工。

公开(公告)号：US06346296B1

公开(公告)日：2002-02-12

申请号：US09396106

申请日：1999-09-14

Applicant: Thomas McCarthy ,  Michael Wagaman ,  David Schwind

Inventor： Thomas McCarthy ,  Michael Wagaman ,  David Schwind

IPC: B05D302

CPC classification number: H01L23/293 ,  C08G61/00 ,  C08G61/02 ,  C08G61/08 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0313 ,  Y10T442/2057 ,  H01L2924/00

Abstract: A method of producing a highly stable packaging substrate in which are provided a first precursor having a first backbone and a first ethynyl group, and a second precursor having a second backbone and a second ethynyl group. Furthermore provided is a crosslinker having a first and a second reactive group. The first precursor, the second precursor, the crosslinker, and a solvent are applied onto a surface to form an electrically insulating layer. The first ethynyl group is reacted with the first reactive group in a first carbon-carbon bond formation reaction and the second ethynyl group is reacted with the second reactive group in a second carbon-carbon bond formation reaction to crosslink the first backbone with the second backbone, thereby forming the packaging substrate. The solvent is removed in a further step.

Abstract translation: 一种制备高度稳定的包装基材的方法，其中提供了具有第一主链和第一乙炔基的第一前体，以及具有第二主链和第二乙炔基的第二前体。 此外提供了具有第一和第二反应性基团的交联剂。 将第一前体，第二前体，交联剂和溶剂施加到表面上以形成电绝缘层。 第一个乙炔基与第一个碳 - 碳键形成反应中的第一个反应性基团反应，第二个乙炔基在第二个碳 - 碳键形成反应中与第二个反应性基团反应，使第一个主链与第二个主链交联 ，从而形成封装基板。 在另外的步骤中除去溶剂。

公开(公告)号：US20180084333A1

公开(公告)日：2018-03-22

申请号：US15713280

申请日：2017-09-22

Applicant: Amanda Anderson ,  David Schwind

Inventor： Amanda Anderson ,  David Schwind

IPC: H04R1/10

CPC classification number: H04R1/1091 ,  H04M1/05 ,  H04R1/1008 ,  H04R1/1041 ,  H04R1/345 ,  H04R2201/107 ,  H04R2420/07

Abstract: A speakerless headset apparatus has a first earpiece and a second earpiece, each earpiece configured to rest on, or over, the ear of a user. Each earpiece is coupled to a respective sound conduit (i.e., the first earpiece is coupled to a first sound conduit). Each conduit is removably coupleable to one or more speaker housings, the speaker housing having one or more speakers for outputting audio received from an audio device. The one or more speakers electrically coupled to an audio output device.

公开(公告)号：US06858304B2

公开(公告)日：2005-02-22

申请号：US10163834

申请日：2002-06-05

Applicant: Thomas F. McCarthy ,  David Schwind ,  Gordon Smith

Inventor： Thomas F. McCarthy ,  David Schwind ,  Gordon Smith

IPC: B32B27/04 ,  C07C39/17 ,  C08G59/62 ,  C08G61/02 ,  C08G85/00 ,  C08L63/00 ,  H05K1/03

CPC classification number: C08G61/02 ,  B32B27/04 ,  C07C39/17 ,  C07C2602/08 ,  C08G59/621 ,  C08L63/00 ,  H05K1/0326 ,  Y10T428/31511 ,  C08L2666/22

Abstract: Novel polyindanebisphenols or PIBPs for the preparation of new and improved thermosetting polymers having the general formula of are provided. Also disclosed are thermoplastic or thermoset compositions prepared using the novel compounds of the invention, as well as methods of making and using the same. When copolymerized or reactive with other commercial resins such as, e.g., epoxy compounds, PIBP based polymers are characterized by high glass transition temperature (“Tg”), low dielectric constant, low moisture absorption, low coefficient of expansion, low cost, and can be processed on equipment typically used for the production of epoxy based laminates.

Abstract translation: 用于制备具有通式的新的和改进的热固性聚合物的新型聚茚二酚双酚或PIBP。 还公开了使用本发明的新化合物制备的热塑性或热固性组合物，以及制备和使用本发明的方法。 当与其它商业树脂例如环氧化合物共聚或反应时，基于PIBP的聚合物的特征在于玻璃化转变温度（“Tg”）高，介电常数低，吸湿率低，膨胀系数低，成本低， 在通常用于生产环氧基层压板的设备上进行加工。

公开(公告)号：US06812311B2

公开(公告)日：2004-11-02

申请号：US10045998

申请日：2001-10-18

Applicant: Thomas McCarthy ,  Michael Wagaman ,  David Schwind

Inventor： Thomas McCarthy ,  Michael Wagaman ,  David Schwind

IPC: C08F1000

CPC classification number: H01L23/293 ,  C08G61/00 ,  C08G61/02 ,  C08G61/08 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0313 ,  Y10T442/2057 ,  H01L2924/00

Abstract: A method of producing a highly stable packaging substrate in which are provided a first precursor having a first backbone and a first ethynyl group, and a second precursor having a second backbone and a second ethynyl group. Furthermore provided is a crosslinker having a first and a second reactive group. The first precursor, the second precursor, the crosslinker, and a solvent are applied onto a surface to form an electrically insulating layer. The first ethynyl group is reacted with the first reactive group in a first carbon-carbon bond formation reaction and the second ethynyl group is reacted with the second reactive group in a second carbon-carbon bond formation reaction to crosslink the first backbone with the second backbone, thereby forming the packaging substrate. The solvent is removed in a further step.

Abstract translation: 一种制备高度稳定的包装基材的方法，其中提供了具有第一主链和第一乙炔基的第一前体，以及具有第二主链和第二乙炔基的第二前体。 此外提供了具有第一和第二反应性基团的交联剂。 将第一前体，第二前体，交联剂和溶剂施加到表面上以形成电绝缘层。 第一个乙炔基与第一个碳 - 碳键形成反应中的第一个反应性基团反应，第二个乙炔基在第二个碳 - 碳键形成反应中与第二个反应性基团反应，使第一个主链与第二个主链交联 ，从而形成封装基板。 在另外的步骤中除去溶剂。