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公开(公告)号：US06824391B2
公开(公告)日：2004-11-30
申请号：US09498268
申请日：2000-02-03
IPC分类号： H01R13648
CPC分类号： H01R13/6658 , H01R12/724 , H01R13/514 , H01R13/6471 , H01R13/6477 , H01R13/6586 , H05K1/0218 , H05K1/0286 , H05K1/144
摘要： An electrical connector includes a housing (12) and circuit boards (13) carried by the housing. The circuit boards extend parallel to each other in spaced-apart relationship. The circuit boards include signal tracks (14) that provide electrical paths through the connector. The electrical paths extend from a mating interface (16) at one end of the connector to a mounting interface (17) at another end of the connector. The circuit boards include a first type (1) and a second type (2), the first type having circuitry arranged in a first pattern, and the second type having circuitry arranged in a second pattern which is different than the first pattern.
摘要翻译： 电连接器包括壳体（12）和由壳体承载的电路板（13）。 电路板以间隔的关系彼此平行地延伸。 电路板包括提供通过连接器的电路径的信号轨道（14）。 电气路径从连接器一端的配合接口（16）延伸到连接器另一端的安装接口（17）。 电路板包括第一类型（1）和第二类型（2），第一类型具有以第一图案布置的电路，并且第二类型具有以与第一图案不同的第二图案布置的电路。
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2.发明授权公开(公告)号：US06267604B1
公开(公告)日：2001-07-31
申请号：US09498266
申请日：2000-02-03
IPC分类号： H01R13502
CPC分类号： H01R13/6587 , H01R13/514 , H01R13/6471
摘要： An electrical connector includes a housing (12) including a front housing portion (20) having a front wall (21) and a plurality of parallel apertures (22) extending through the front wall. A plurality of circuit boards (13) extend through respective ones of the apertures. Each of the circuit boards has a mating edge (42), and the mating edges are aligned forwardly of the front wall for connection with a mating electrical connector. The housing includes a separate organizer (30) attached to the front housing portion. The organizer has a plurality of slots (33) that are spaced-apart in correspondence with the plurality of apertures, and the circuit boards have mounting edges that are received in respective ones of the slots. The front housing portion comprises upper and lower grooved shrouds extending forwardly from the front wall. The circuit boards comprise a notch in the top edge which receives a corresponding projection. The front housing portion and the organizer are assembled by a post interference fitted in a hole.
摘要翻译： 电连接器包括壳体（12），其包括具有前壁（21）的前壳体部分（20）和延伸穿过前壁的多个平行孔（22）。 多个电路板（13）延伸穿过相应的一个孔。 每个电路板具有配合边缘（42），并且配合边缘与前壁的前方对准以与配合的电连接器连接。 壳体包括附接到前壳体部分的单独的组织器（30）。 组织器具有与多个孔相对应的间隔开的多个槽（33），并且电路板具有容纳在相应槽中的安装边缘。 前壳体部分包括从前壁向前延伸的上和下沟槽护罩。 电路板包括在顶部边缘中的凹口，其接收相应的突起。 前壳体部分和组织器通过安装在孔中的柱干涉组装。
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3.发明授权Electrical connector having circuit boards and keying for different types of circuit boards 有权具有电路板和不同类型电路板键盘的电连接器公开(公告)号：US06171115B2
公开(公告)日：2001-01-09
申请号：US09498263
申请日：2000-02-03
IPC分类号： H01R13648
CPC分类号： H01R13/6658 , H01R13/514 , H01R13/64 , H01R13/6471 , H01R13/6587
摘要： An electrical connector includes a housing (12) that carries a plurality of circuit boards (13) in a parallel, spaced-apart array. The circuit boards are of two different types. One type has a keying recess (60) that is keyed to a land (39) in the housing, and the other type has a keying recess (62) that is keyed to a web (40) in the housing.
摘要翻译： 电连接器包括承载多个平行间隔排列的多个电路板（13）的壳体（12）。 电路板有两种不同的类型。 一种类型具有键合凹槽（60），其键接到壳体中的平台（39），另一种类型具有键合到壳体中的网（40）的键槽（62）。
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公开(公告)号：US06663442B1
公开(公告)日：2003-12-16
申请号：US09491658
申请日：2000-01-27
申请人： David W. Helster , Scott K. Mickievicz , Howard W. Andrews , George R. Defibaugh , Lynn R. Sipe , John J. Consoli , James L. Fedder , Chad W. Morgan , Alexander M. Sharf , Matthew R. McAlonis
发明人： David W. Helster , Scott K. Mickievicz , Howard W. Andrews , George R. Defibaugh , Lynn R. Sipe , John J. Consoli , James L. Fedder , Chad W. Morgan , Alexander M. Sharf , Matthew R. McAlonis
IPC分类号： H05K111
CPC分类号： H01R12/58 , H05K1/115 , H05K3/0047 , H05K3/429 , H05K2201/09509 , H05K2201/09627 , H05K2201/09845 , H05K2201/10189 , H05K2203/0242
摘要： A printed circuit board includes a bore having a perimeter and a total depth. An electrically conductive barrel extends around at least a portion of the perimeter of the bore and along a predetermined depth of the bore, the predetermined depth being less than the total depth of the bore. The barrel has an end that terminates at a countersunk portion of the bore. A contact includes a body having first and second ends. The first end includes a compliant section that is positioned in the barrel, thereby forming a separable interface between the contact and the circuit board. The second end extends out of the barrel and interfaces with an electrical component. Protrusion of the first end out of the barrel is minimized. The above relationships are used to decrease capacitive loading.
摘要翻译： 印刷电路板包括具有周长和总深度的孔。 导电筒围绕孔的周边的至少一部分延伸并且沿着孔的预定深度延伸，预定深度小于孔的总深度。 枪管的端部终止于孔的沉头部分。 触点包括具有第一端和第二端的本体。 第一端包括位于筒中的柔顺部分，从而在接触件和电路板之间形成可分离的界面。 第二端延伸出筒体并与电气部件接合。 桶的第一端突出最小化。 上述关系用于降低电容负载。
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公开(公告)号：US20100144201A1
公开(公告)日：2010-06-10
申请号：US12474587
申请日：2009-05-29
申请人： George R. Defibaugh , James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan C. Wickes
发明人： George R. Defibaugh , James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan C. Wickes
IPC分类号： H01R13/648
CPC分类号： H01R13/514 , H01R12/58 , H01R13/6471 , H01R13/6586 , H01R13/6587
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
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公开(公告)号：US07651373B2
公开(公告)日：2010-01-26
申请号：US12055854
申请日：2008-03-26
IPC分类号： H01R13/648
CPC分类号： H01R13/6471 , H01R13/6477 , H01R13/6587
摘要： An electrical connector includes a housing defining a connector mating interface. The housing holds a plurality of contact modules that cooperate to define a connector mounting interface. Each contact module contains signal leads and ground leads arranged in an alternating pattern of individual ground leads and pairs of signal leads positioned side-by-side with respect to a thickness of the contact module. The signal and ground leads have respective mating contacts proximate the mating interface and respective mounting contacts proximate the mounting interface. The mating and mounting contacts within each contact module are arranged in one of first and second contact patterns different from the pattern of the signal and ground leads. The mating and mounting contacts in adjacent contact modules are arranged in respective different ones of the first and second contact patterns.
摘要翻译： 电连接器包括限定连接器配合接口的壳体。 壳体保持多个接触模块，其协作以限定连接器安装界面。 每个接触模块包含信号引线和接地引线，它们以相对于接触模块的厚度并排定位的各个接地引线和信号引线的交替模式布置。 信号和接地引线具有靠近配合接口的相应匹配触头和靠近安装界面的相应安装触头。 每个触点模块内的配合和安装触头布置在与信号和接地引线图案不同的第一和第二触点图案之一中。 相邻接触模块中的配合和安装触点分别设置在第一和第二接触图形中的不同的接触图形中。
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公开(公告)号：US20090246980A1
公开(公告)日：2009-10-01
申请号：US12055854
申请日：2008-03-26
CPC分类号： H01R13/6471 , H01R13/6477 , H01R13/6587
摘要： An electrical connector includes a housing defining a connector mating interface. The housing holds a plurality of contact modules that cooperate to define a connector mounting interface. Each contact module contains signal leads and ground leads arranged in an alternating pattern of individual ground leads and pairs of signal leads positioned side-by-side with respect to a thickness of the contact module. The signal and ground leads have respective mating contacts proximate the mating interface and respective mounting contacts proximate the mounting interface. The mating and mounting contacts within each contact module are arranged in one of first and second contact patterns different from the pattern of the signal and ground leads. The mating and mounting contacts in adjacent contact modules are arranged in respective different ones of the first and second contact patterns.
摘要翻译： 电连接器包括限定连接器配合接口的壳体。 壳体保持多个接触模块，其协作以限定连接器安装界面。 每个接触模块包含信号引线和接地引线，它们以相对于接触模块的厚度并排定位的各个接地引线和信号引线的交替模式布置。 信号和接地引线具有靠近配合接口的相应匹配触头和靠近安装界面的相应安装触头。 每个触点模块内的配合和安装触头布置在与信号和接地引线图案不同的第一和第二触点图案之一中。 相邻接触模块中的配合和安装触点分别设置在第一和第二接触图形中的不同的接触图形中。
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公开(公告)号：US07775802B2
公开(公告)日：2010-08-17
申请号：US12474587
申请日：2009-05-29
申请人： George R. Defibaugh , James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan C. Wickes
发明人： George R. Defibaugh , James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan C. Wickes
IPC分类号： H01R12/00
CPC分类号： H01R13/514 , H01R12/58 , H01R13/6471 , H01R13/6586 , H01R13/6587
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or other ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
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公开(公告)号：US08382522B2
公开(公告)日：2013-02-26
申请号：US13191695
申请日：2011-07-27
IPC分类号： H01R13/648
CPC分类号： H01R12/585 , H01R12/725 , H01R13/6471 , H01R13/6587
摘要： A substrate is disclosed that is configured to receive an electrical component. The substrate comprises a plurality of first vias and a plurality of second vias. The plurality of first vias is arranges in the substrate in a matrix of rows and columns and is configured to provide mounting of the electric component, each first via associated with one of its closest neighbor first via to form a pair. The plurality of second vias is capable of being electrically commoned to one another and is positioned amongst the plurality of first vias such that there is at least one second via positioned directly between each first via and any of the closest non-pair first via neighbors.
摘要翻译： 公开了一种被配置为接收电气部件的基板。 衬底包括多个第一通孔和多个第二通孔。 多个第一通孔以行和列的矩阵形式布置在基板中，并且被配置为提供电气部件的安装，每个第一通孔与其最近邻近的第一通孔相关联地形成一对。 多个第二通孔能够彼此电气共用并且位于多个第一通孔之间，使得存在至少一个第二通孔，其直接位于每个第一通路和任何最接近的非对第一通孔邻近件之间。
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公开(公告)号：US20100144167A1
公开(公告)日：2010-06-10
申请号：US12474568
申请日：2009-05-29
申请人： James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan Charles Wickes
发明人： James L. Fedder , Douglas W. Glover , David W. Helster , John E. Knaub , Timothy R. Minnick , Chad W. Morgan , Alex M. Sharf , Lynn R. Sipe , Evan Charles Wickes
CPC分类号： H01R13/514 , H01R12/585 , H01R12/725 , H01R13/6477 , H01R13/6587 , H01R13/6599
摘要： High-speed backplane connectors systems for mounting a substrate that are capable of operating at speeds of up to at least 25 Gbps, while in some implementations also providing pin densities of at least 50 pairs of electrical connectors per inch are disclosed. Implementations of the high-speed connector systems may provide ground shields and/or ground structures that substantially encapsulate electrical connector pairs, which may be differential electrical connector pairs, in a three-dimensional manner throughout a backplane footprint, a backplane connector, and a daughtercard footprint. These encapsulating ground shields and/or ground structures prevent undesirable propagation of non-traverse, longitudinal, and higher-order modes when the high-speed backplane connector systems operates at frequencies up to at least 30 GHz.
摘要翻译： 公开了用于安装能够以高达至少25Gbps的速度运行的基板的高速背板连接器系统，而在一些实施方式中还提供了每英寸至少50对电连接器的销密度。 高速连接器系统的实现可以提供接地屏蔽和/或接地结构，其基本上封装整个背板占用面积，背板连接器和子卡内部的三维方式的可能是差分电连接器对的电连接器对 脚印。 当高速背板连接器系统在高达至少30GHz的频率下工作时，这些封装接地屏蔽和/或接地结构防止非横向，纵向和高阶模式的不期望的传播。
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