Copper-nickel alloy electroplating device

    公开(公告)号:US10538854B2

    公开(公告)日:2020-01-21

    申请号:US15519474

    申请日:2015-06-25

    摘要: Provided is a copper-nickel alloy electroplating apparatus which is capable of stably forming a copper-nickel plated coating on a workpiece with a uniform composition and which enables a plating bath to be used for a long period. The present invention provides a copper-nickel alloy electroplating apparatus (1), comprising: a cathode chamber (4) in which a workpiece (5) is to be placed; an anode chamber (6); an anode (7) placed in the anode chamber; an electrically conductive diaphragm (14) placed to separate the cathode chamber and the anode chamber from each other; a cathode chamber oxidation-reduction potential adjusting tank (8) for adjusting the oxidation-reduction potential of a plating liquid in the cathode chamber; an anode chamber oxidation-reduction potential adjusting tank (10) for adjusting the oxidation-reduction potential of a plating liquid in the anode chamber; and a power supply unit (36) that provides an electric current to flow between the workpiece and the anode.

    COPPER-NICKEL ALLOY ELECTROPLATING DEVICE
    4.
    发明申请

    公开(公告)号:US20170241040A1

    公开(公告)日:2017-08-24

    申请号:US15519474

    申请日:2015-06-25

    摘要: Provided is a copper-nickel alloy electroplating apparatus which is capable of stably forming a copper-nickel plated coating on a workpiece with a uniform composition and which enables a plating bath to be used for a long period. The present invention provides a copper-nickel alloy electroplating apparatus (1), comprising: a cathode chamber (4) in which a workpiece (5) is to be placed; an anode chamber (6); an anode (7) placed in the anode chamber; an electrically conductive diaphragm (14) placed to separate the cathode chamber and the anode chamber from each other; a cathode chamber oxidation-reduction potential adjusting tank (8) for adjusting the oxidation-reduction potential of a plating liquid in the cathode chamber; an anode chamber oxidation-reduction potential adjusting tank (10) for adjusting the oxidation-reduction potential of a plating liquid in the anode chamber; and a power supply unit (36) that provides an electric current to flow between the workpiece and the anode.

    ZINC-NICKEL-SILICA COMPOSITE PLATING BATH AND METHOD FOR PLATING USING SAID PLATING BATH

    公开(公告)号:US20230041195A1

    公开(公告)日:2023-02-09

    申请号:US17787858

    申请日:2020-11-05

    IPC分类号: C25D3/56 C25D15/02

    摘要: The purpose of the present invention is to provide a zinc-nickel-silica composite plating bath that has been improved in terms of: covering power for articles having a complex shape; and corrosion resistance of a low current density portion where the film thickness is small. The present invention pertains to a zinc-nickel-silica composite plating bath, the plating bath having a pH of 3.5 to 6.9, and containing zinc ions, nickel ions, colloidal silica, and chloride ions. The colloidal silica is a cationic colloidal silica having on the surface thereon at least one species of metal cation selected from the group consisting of trivalent to heptavalent metal cations.