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公开(公告)号：US09935422B2
公开(公告)日：2018-04-03
申请号：US15281443
申请日：2016-09-30
CPC分类号： H01S5/02272 , H01S5/02476
摘要： A multi-layer laser diode mount is configured with a submount made from thermo- and electro-conductive material. One of the opposite surfaces of the submount supports a laser diode. The other surface of the submount faces and is spaced from a heatsink. The submount and heatsink are configured with respective thermal expansion coefficients (“TEC”) which are different from one another. The opposite surfaces of the submount are electroplated with respective metal layers one of which is bonded to a soft solder layer.In one aspect of the disclosure, the mount is further configured with a spacer having the same TEC as that of the submount and bonded to the soft solder layer. A layer of hard solder bonds the spacer and heatsink to one another.In a further aspect of the disclosure, the electroplated metal layer in contact with the other surface of the submount is hundred- or more micron thick. The soft solder is directly bonded to the heatsink.In both aspects of the disclosure, a temperature of a p-n junction of the laser diode remains substantially constant within a 0 to 2° C. temperature range through a predetermined amount of several hundred of repeated thermo-cycles which is indicative of uncompromised integrity of the soft solder.
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公开(公告)号：US20170018906A1
公开(公告)日：2017-01-19
申请号：US15281443
申请日：2016-09-30
CPC分类号： H01S5/02272 , H01S5/02476
摘要： A multi-layer laser diode mount is configured with a submount made from thermo- and electro-conductive material. One of the opposite surfaces of the submount supports a laser diode. The other surface of the submount faces and is spaced from a heatsink. The submount and heatsink are configured with respective thermal expansion coefficients (“TEC”) which are different from one another. The opposite surfaces of the submount are electroplated with respective metal layers one of which is bonded to a soft solder layer.In one aspect of the disclosure, the mount is further configured with a spacer having the same TEC as that of the submount and bonded to the soft solder layer. A layer of hard solder bonds the spacer and heatsink to one another.In a further aspect of the disclosure, the electroplated metal layer in contact with the other surface of the submount is hundred- or more micron thick. The soft solder is directly bonded to the heatsink.In both aspects of the disclosure, a temperature of a p-n junction of the laser diode remains substantially constant within a 0 to 2° C. temperature range through a predetermined amount of several hundred of repeated thermo-cycles which is indicative of uncompromised integrity of the soft solder.
摘要翻译： 在本公开的两个方面，激光二极管的pn结的温度在0至2℃的温度范围内保持基本上恒定，通过预定量的数百次重复的热循环，这表明不可靠的完整性 软焊料。
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3.发明申请公开(公告)号：US20150124848A1
公开(公告)日：2015-05-07
申请号：US14060682
申请日：2013-10-23
IPC分类号： H01S5/026
CPC分类号： H01S5/141 , H01S5/0064 , H01S5/02248 , H01S5/02284
摘要： A module is configured with a housing enclosing a diode laser. Fast and slow axes collimators are located behind the rear facet of the laser, which along with a front facet, defines an intra-cavity cavity of the laser. The facets are partially transmissive to light and therefore emit laser light. A wavelength selective optical element is aligned with the collimators and configured to reflect light emitted through the back facet and processed by collimators back into the intra-cavity. As a result, the laser beam is emitted through the front facet at a wavelength locked on the desired wavelength of the optical element. A delivery fiber is mechanically coupled to the front facet of diode laser and configured to receive and guide the emitted laser beam along the path of light.
摘要翻译： 模块配置有封装二极管激光器的外壳。 快轴和慢轴准直器位于激光器的后面后面，其与前刻面一起限定激光器的腔内空腔。 小面对光部分透射，因此发射激光。 波长选择光学元件与准直器对准，并且被配置为反射通过后刻面发射并由准直器处理的光返回到腔内。 结果，激光束以锁定在光学元件的期望波长上的波长通过前端面发射。 输送光纤机械地耦合到二极管激光器的前刻面并且被配置为沿着光路接收和引导发射的激光束。
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