Laser processing
    1.
    发明授权
    Laser processing 有权
    激光加工

    公开(公告)号:US06300590B1

    公开(公告)日:2001-10-09

    申请号:US09212974

    申请日:1998-12-16

    IPC分类号: B23K2600

    摘要: The invention provides a system and method for vaporizing a target structure on a substrate. According to the invention, a calculation is performed, as a function of wavelength, of an incident beam energy necessary to deposit unit energy in the target structure. Then, for the incident beam energy, the energy expected to be deposited in the substrate as a function of wavelength is calculated. A wavelength is identified that corresponds to a relatively low value of the energy expected to be deposited in the substrate, the low value being substantially less than a value of the energy expected to be deposited in the substrate at a higher wavelength. A laser system is provided configured to produce a laser output at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate. The laser output is directed at the target structure on the substrate at the wavelength corresponding to the relatively low value of the energy expected to be deposited in the substrate, in order to vaporize the target structure.

    摘要翻译: 本发明提供了一种用于在衬底上蒸发靶结构的系统和方法。 根据本发明,对目标结构中存储单元能量所需的入射光束能量进行与波长有关的计算。 然后,对于入射光束能量,计算预期沉积在衬底中作为波长的函数的能量。 识别出对应于预期沉积在衬底中的能量的较低值的波长,该低值基本上小于预期在较高波长下沉积在衬底中的能量的值。 提供的激光系统被配置为产生在预期沉积在衬底中的能量的相对较低值的波长处的激光输出。 激光输出以对应于期望沉积在衬底中的能量的相对较低值的波长指向衬底上的靶结构,以便蒸发靶结构。