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公开(公告)号:US20070186835A1
公开(公告)日:2007-08-16
申请号:US11355437
申请日:2006-02-16
申请人: Edward Follmer
发明人: Edward Follmer
IPC分类号: B63B21/00
CPC分类号: B63B21/54
摘要: A dock line server (1) attachable to a conventional line pole (3) for use in maintaining a loop (8) in a dock line (3) in a horizontal configuration to facilitate placement of the dock line over a mooring piling (9) or cleat when docking a boat. The frame of the server has a pair of prongs (5) which are connected at a proximal end (20) and spaced apart a predetermined distance to form an opening at a distal end (19). At least one pair of horseshoe-shaped clips (6) on top of each prong holds the dock line in a horizontal, open loop configuration during docking. A pair of spacers (7) on each prong may also be used to hold the middle of the loop in a fully open position. The dock line server is preferably hollow and made of lightweight material, such as aluminum.
摘要翻译: 一种可连接到传统的线极(3)的码头线路服务器(1),用于将水平配置中的一个环路(8)维持在码头线(3)中,以便于将码头线放置在系泊堆放(9)上, 或当对接船时防滑板。 服务器的框架具有一对插脚(5),它们在近端(20)处连接并间隔预定距离以在远端(19)处形成开口。 每个插脚顶部至少有一对马蹄形夹子(6)将对接线在对接期间保持在水平的开环结构中。 每个插脚上的一对隔片(7)也可用于将环的中间保持在完全打开的位置。 码头线服务器优选是中空的,并且由诸如铝的轻质材料制成。
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公开(公告)号:US20060017150A1
公开(公告)日:2006-01-26
申请号:US11183047
申请日:2005-07-15
申请人: Arthur Zingher , Bruce Guenin , Edward Follmer
发明人: Arthur Zingher , Bruce Guenin , Edward Follmer
CPC分类号: H04B5/0012 , H01L23/48 , H01L23/50 , H01L2224/32 , H01L2924/1461 , H01L2924/19041 , H01L2924/19104 , H01L2924/3011 , H01L2924/00
摘要: A single-chip module is described. The module includes a first semiconductor die having a first surface and a second surface. The first semiconductor die is configured to communicate by capacitive coupling using one or more of a plurality of proximity connectors coupled to the first semiconductor die. A cable coupled to the first semiconductor die is configured to couple power signals to the first semiconductor die. A flexibility compliance of at least one section of the cable is greater than a threshold value thereby allowing the module to be positioned in a mounting structure.
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3.
公开(公告)号:US20080018000A1
公开(公告)日:2008-01-24
申请号:US11243300
申请日:2005-10-03
IPC分类号: H01L23/544
CPC分类号: H01L25/0657 , H01L23/48 , H01L24/72 , H01L24/90 , H01L2224/13 , H01L2224/2919 , H01L2224/81136 , H01L2224/81138 , H01L2224/81141 , H01L2224/81801 , H01L2224/83136 , H01L2224/83194 , H01L2224/838 , H01L2224/83851 , H01L2225/06527 , H01L2225/06531 , H01L2225/06593 , H01L2924/01027 , H01L2924/01033 , H01L2924/01075 , H01L2924/01079 , H01L2924/0665 , H01L2924/10157 , H01L2924/10253 , H01L2924/14 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要: A system that facilitates precise inter-chip alignment. The system includes a first integrated circuit chip, whose surface has etch pit wells. The system also includes a second integrated circuit chip, whose surface has corresponding etch pit wells that mate with the etch pit wells of the first integrated circuit chip. Spherical balls are placed in the etch pit wells of the first integrated circuit chip such that when the corresponding etch pit wells of the second integrated circuit chip are substantially aligned with the spherical balls, the spherical balls mate with the etch well pits of the second integrated circuit chip, thereby precisely aligning the first integrated circuit chip with the second integrated circuit chip.
摘要翻译: 一种便于精确的芯片间对准的系统。 该系统包括第一集成电路芯片,其表面具有蚀刻凹坑。 该系统还包括第二集成电路芯片,其表面具有与第一集成电路芯片的蚀刻凹坑相配合的相应蚀刻凹坑。 球形球被放置在第一集成电路芯片的蚀刻凹坑中,使得当第二集成电路芯片的相应蚀刻凹坑基本上与球形球对准时,球形球与第二集成电路芯片的蚀刻井凹坑配合 从而将第一集成电路芯片与第二集成电路芯片精确对准。
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