公开(公告)号：US06621151B1

公开(公告)日：2003-09-16

申请号：US09497421

申请日：2000-02-07

申请人： Tai Chong Chai ,  Thiam Beng Lim ,  Yong Chua Teo ,  James Tan ,  Raymundo Camenforte ,  Eric Neo ,  Daniel Yap

发明人： Tai Chong Chai ,  Thiam Beng Lim ,  Yong Chua Teo ,  James Tan ,  Raymundo Camenforte ,  Eric Neo ,  Daniel Yap

IPC分类号： H01L2348

CPC分类号： H01L23/49503 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead-frame for connecting and supporting an integrated circuit having an apertured frame with dimensions smaller than the corresponding dimensions of the chip so that chip-pad shoulder can be eliminated and the chip attach fillet is made remote from the chip corner.

摘要翻译： 一种用于连接和支撑集成电路的引线框架，该集成电路具有尺寸小于芯片的相应尺寸的有孔框架，使得可以消除芯片焊盘肩部并且芯片附接圆角远离芯片角落。

公开(公告)号：US06583501B2

公开(公告)日：2003-06-24

申请号：US09499021

申请日：2000-02-07

申请人： Tai Chong Chai ,  Thiam Beng Lim ,  Yong Chua Teo ,  James Tan ,  Ray Camenforte ,  Eric Neo ,  Daniel Yap

发明人： Tai Chong Chai ,  Thiam Beng Lim ,  Yong Chua Teo ,  James Tan ,  Ray Camenforte ,  Eric Neo ,  Daniel Yap

IPC分类号： H01L23495

CPC分类号： H01L23/49503 ,  H01L23/3107 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead-frame for connecting and supporting an integrated circuit chip with a chip accommodating zone with inwardly extending ears for supporting the chip including minimum shoulder area, and having open crack and delamination stopping regions.