公开(公告)号：US5580407A

公开(公告)日：1996-12-03

申请号：US275178

申请日：1994-07-13

申请人： Jan Haisma ,  Franciscus J. H. M. Van Der Kruis ,  Gijsbertus A. C. M. Spierings

发明人： Jan Haisma ,  Franciscus J. H. M. Van Der Kruis ,  Gijsbertus A. C. M. Spierings

IPC分类号： B29C65/00 ,  C08J5/12 ,  H01L21/304 ,  B32B31/12 ,  H01L21/302 ,  H01L21/461

CPC分类号： B29C66/73 ,  B29C66/73117 ,  B29C66/73161 ,  C08J5/12 ,  B29C65/02 ,  B29C66/71 ,  B29C66/73772 ,  B29C66/73774 ,  B29C66/73776 ,  B29C66/73921 ,  B29K2995/0072 ,  Y10T156/10

摘要： A first object, which comprises organic material, is bonded to a second object by a method whereby both objects are provided with complementary optically smooth surfaces, subsequent to which these surfaces are brought into substantial contact with one another, consequent upon which spontaneous atomic bonds are formed between atoms of the two objects. The strength of the atomic bonds thus formed can be increased by subsequently heating the region of contact of the two surfaces.

摘要翻译： 包括有机材料的第一个目的是通过一种方法将第二个物体结合到一个第二物体上，由此两个物体都具有互补的光学平滑表面，接着在这些表面上这些表面彼此实质上接触，由此自发的原子键是 形成在两个物体的原子之间。 通过随后加热两个表面的接触区域可以增加如此形成的原子键的强度。

公开(公告)号：US4994139A

公开(公告)日：1991-02-19

申请号：US504727

申请日：1990-04-03

申请人： Udo K. P. Biermann ,  Gijsbertus A. C. M. Spierings ,  Franciscus J. H. M. van der Kruis ,  Jan Haisma

发明人： Udo K. P. Biermann ,  Gijsbertus A. C. M. Spierings ,  Franciscus J. H. M. van der Kruis ,  Jan Haisma

IPC分类号： G02B6/13 ,  C03C19/00 ,  C03C27/00 ,  H01L21/20 ,  H01L31/0203

CPC分类号： H01L31/0203 ,  C03C19/00 ,  H01L21/2007 ,  Y10S438/977

摘要： An optical device is manufactured by providing a disc-shaped body of a light-conducting material on a plane surface of a disc-shaped carrier body, grinding the light-conducting material mechanically to a thickness which exceeds the desired ultimate layer thickness by at least 50 .mu.m, subjecting the light-conducting material to alternate tribochemical and mechanical polishing treatments until a thickness is obtained which exceeds the desired ultimate layer thickness by approximately 10 .mu.m, and subsequently polishing the light-conductor body tribochemically until the desired layer thickness is obtained.

公开(公告)号：US5441442A

公开(公告)日：1995-08-15

申请号：US71908

申请日：1993-06-03

申请人： Jan Haisma ,  Peter W. De Haas ,  Franciscus J. H. M. Van Der Kruis ,  Jakob Vijfvinkel

发明人： Jan Haisma ,  Peter W. De Haas ,  Franciscus J. H. M. Van Der Kruis ,  Jakob Vijfvinkel

IPC分类号： B24B7/17 ,  B24B37/08 ,  B24B37/12 ,  B24B7/04 ,  B24B7/22

CPC分类号： B24B37/08 ,  B24B37/12

摘要： Methods and device for manufacturing a plate with a plane main surface or with parallel main surfaces, whereby material is taken off from the edges of the plate and from the central portion of the plate alternately by means of polishing in order to obtain main surfaces having a convex, plane, or concave shape. Polishing is stopped after at least one transition from convex to concave or vice versa at the moment at which the main surface has a substantially plane shape or has substantially parallel main surfaces.

摘要翻译： 用于制造具有平面主表面或平行主表面的板的方法和装置，由此通过抛光交替地从板的边缘和板的中心部分剥离材料，以获得主表面具有 凸形，平面或凹形。 在主表面具有大致平面形状或具有基本上平行的主表面的时刻，在从凸到凹之间至少一次过渡之后停止抛光。

公开(公告)号：US5284803A

公开(公告)日：1994-02-08

申请号：US991691

申请日：1992-12-16

申请人： Jan Haisma ,  Franciscus J. H. M. Van Der Kruis

发明人： Jan Haisma ,  Franciscus J. H. M. Van Der Kruis

IPC分类号： B24B37/00 ,  H01L21/20 ,  H01L21/304 ,  H01L21/302

CPC分类号： H01L21/304 ,  H01L21/2007 ,  Y10S148/012

摘要： A method of manufacturing a semiconductor body (1), whereby a carrier wafer (2) with an optically smooth main surface (3) is provided with a semiconducting top layer (4) in that the main surface (3) is brought into contact with an optically smooth main surface (5) of a monocrystalline semiconductor wafer (6), a permanent bond being formed, after which the semiconductor wafer (6) is made thin by means of a grinding process and a polishing process in that order. The semiconductor wafer (6) is made thin in the polishing process in that the exposed main surface (9) of the carrier wafer (2) is made wear-resistant, and in that then the carrier wafer (2) bonded to the semiconductor wafer (6) is arranged between two plane polishing discs (10) and (11) provided with a polishing liquid, upon which these polishing discs (10, 11) and the exposed main surfaces (8, 9) are moved relative to one another. It is achieved by this that a semiconductor body (1) with a carrier wafer (2) and a top layer (4) can be manufactured in a simple manner suitable for mass production. It is also found that a top layer (4) with smaller layer thickness variations can be manufactured.

摘要翻译： 一种制造半导体本体（1）的方法，其中具有光学平滑主表面（3）的载体晶片（2）设置有半导体顶层（4），其中主表面（3）与 单晶半导体晶片（6）的光学平滑的主表面（5），形成永久性接合，之后通过研磨工艺和抛光工艺使半导体晶片（6）变薄。 在抛光工艺中半导体晶片（6）被制成薄，因为载体晶片（2）的暴露的主表面（9）被制成耐磨的，然后结合到半导体晶片的载体晶片（2） （6）布置在设置有抛光液体的两个平面抛光盘（10）和（11）之间，这些抛光盘（10,11）和暴露的主表面（8,9）相对于彼此移动。 通过这样做，可以以适合批量生产的简单方式制造具有载体晶片（2）和顶层（4）的半导体本体（1）。 还发现可以制造具有较小层厚变化的顶层（4）。