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公开(公告)号：US20140001361A1
公开(公告)日：2014-01-02
申请号：US14014510
申请日：2013-08-30
CPC分类号： B25J7/00 , B25J19/007 , B81C99/002 , H01J37/20
摘要： A method is described for producing a micro-gripper, which comprises a base body and a gripping body connected integrally to the base body, which projects beyond the base body and provides a receptacle slot on a free end area in such a way that a micrometer-scale or sub-micrometer-scale object may be clamped in the receptacle slot for gripping and holding, as well as a micro-gripper according to the species.
摘要翻译： 描述了一种用于生产微型夹具的方法，该微型夹具包括基体和与基体一体地连接的夹持体，该基体突出超过基体并且在自由端部区域上提供容纳槽，使得千分尺 尺寸或亚微米尺度的物体可以夹持在用于夹持和保持的容器槽中，以及根据该种类的微型夹具。
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公开(公告)号：US20110297829A1
公开(公告)日：2011-12-08
申请号：US13156289
申请日：2011-06-08
CPC分类号： G01J5/0066 , G01J2005/0077 , G01J2005/0085 , G01N1/00 , G01N21/35 , G01N21/88 , G01N25/00 , G01N2021/8461 , G01R31/311
摘要： A non-destructive approach for the 3D localization of buried hot spots in electronic device architectures by use of Lock-in Thermography (LIT). The 3D analysis is based on the principles of thermal wave propagation through different material layers and the resulting phase shift/thermal time delay. With more complex multi level stacked die architectures it is necessary to acquire multiple LIT results at different excitation frequencies for precise hot spot depth localization. Additionally, the use of multiple time-resolved thermal waveforms, measured in a minimized field of view on top of the hot spot location, can be used to speed up the data acquisition. The shape of the resulting waveforms can be analyzed to further increase the detection accuracy and confidence level.
摘要翻译： 通过使用锁定热成像（LIT）在电子设备架构中对埋藏热点的3D定位的非破坏性方法。 3D分析基于通过不同材料层的热波传播的原理以及由此产生的相移/热时间延迟。 使用更复杂的多级堆叠管芯结构，需要在不同的激发频率下获取多个LIT结果，以实现精确的热点深度定位。 此外，可以使用在热点位置顶部的最小视场内测量的多个时间分辨热波形来加速数据采集。 可以分析所得波形的形状，以进一步提高检测精度和置信度。
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公开(公告)号：US08742347B2
公开(公告)日：2014-06-03
申请号：US13156289
申请日：2011-06-08
CPC分类号： G01J5/0066 , G01J2005/0077 , G01J2005/0085 , G01N1/00 , G01N21/35 , G01N21/88 , G01N25/00 , G01N2021/8461 , G01R31/311
摘要： A non-destructive approach for the 3D localization of buried hot spots in electronic device architectures by use of Lock-in Thermography (LIT). The 3D analysis is based on the principles of thermal wave propagation through different material layers and the resulting phase shift/thermal time delay. With more complex multi level stacked die architectures it is necessary to acquire multiple LIT results at different excitation frequencies for precise hot spot depth localization. Additionally, the use of multiple time-resolved thermal waveforms, measured in a minimized field of view on top of the hot spot location, can be used to speed up the data acquisition. The shape of the resulting waveforms can be analyzed to further increase the detection accuracy and confidence level.
摘要翻译： 通过使用锁定热成像（LIT）在电子设备架构中对埋藏热点的3D定位的非破坏性方法。 3D分析基于通过不同材料层的热波传播的原理以及由此产生的相移/热时间延迟。 使用更复杂的多级堆叠管芯结构，需要在不同的激发频率下获取多个LIT结果，以实现精确的热点深度定位。 此外，可以使用在热点位置顶部的最小视场内测量的多个时间分辨热波形来加速数据采集。 可以分析所得波形的形状，以进一步提高检测精度和置信度。
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公开(公告)号：US08530855B2
公开(公告)日：2013-09-10
申请号：US12301641
申请日：2007-03-09
CPC分类号： B25J7/00 , B25J19/007 , B81C99/002 , H01J37/20
摘要： A method is described for producing a micro-gripper, which comprises a base body and a gripping body connected integrally to the base body, which projects beyond the base body and provides a receptacle slot on a free end area in such a way that a micrometer-scale or sub-micrometer-scale object may be clamped in the receptacle slot for gripping and holding, as well as a micro-gripper according to the species.
摘要翻译： 描述了一种用于生产微型夹具的方法，该微型夹具包括基体和与基体一体地连接的夹持体，该基体突出超过基体并且在自由端部区域上提供容纳槽，使得千分尺 尺寸或亚微米尺度的物体可以夹持在用于夹持和保持的容器槽中，以及根据该种类的微型夹具。
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公开(公告)号：US20100032581A1
公开(公告)日：2010-02-11
申请号：US12301641
申请日：2007-03-09
IPC分类号： B25J7/00 , H01J37/26 , B05D3/00 , B44C1/22 , C23C16/44 , C23C16/50 , C23C14/34 , C23C14/46 , C23C14/32
CPC分类号： B25J7/00 , B25J19/007 , B81C99/002 , H01J37/20
摘要： A method is described for producing a micro-gripper, which comprises a base body and a gripping body connected integrally to the base body, which projects beyond the base body and provides a receptacle slot on a free end area in such a way that a micrometer-scale or sub-micrometer-scale object may be clamped in the receptacle slot for gripping and holding, as well as a micro-gripper according to the species.
摘要翻译： 描述了一种用于生产微型夹具的方法，该微型夹具包括基体和与基体一体地连接的夹持体，该基体突出超过基体并且在自由端部区域上提供容纳槽，使得千分尺 尺寸或亚微米尺度的物体可以夹持在用于夹持和保持的容器槽中，以及根据该种类的微型夹具。
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