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公开(公告)号：US06503335B2
公开(公告)日：2003-01-07
申请号：US09426916
申请日：1999-10-26
申请人： Georg-Friedrich Hohl , Roland Brunner , Susanne Bauer-Mayer , Günther Brunner , Hans-Joachim Luthe , Franz Sollinger
发明人： Georg-Friedrich Hohl , Roland Brunner , Susanne Bauer-Mayer , Günther Brunner , Hans-Joachim Luthe , Franz Sollinger
IPC分类号： B08B700
CPC分类号： H01L21/67034 , C30B33/00 , Y10S134/902
摘要： A centrifuge for a semiconductor wafer has a centrifuge plate for holding a semiconductor wafer, has a drive for setting the centrifuge plate in rotation, and has a device for supplying a medium to a front side and a rear side of the semiconductor wafer. The centrifuge has a housing which separates a centrifuging area and the semiconductor wafer from the environment, and a device for generating a laminar gas flow in the housing. A method for centrifuging a semiconductor wafer has the semiconductor wafer being centrifuged in a laminar gas flow.
摘要翻译： 用于半导体晶片的离心机具有用于保持半导体晶片的离心机板，具有用于将离心机板旋转的驱动装置，并且具有用于向半导体晶片的前侧和后侧供给介质的装置。 离心机具有将离心区域和半导体晶片与环境分离的壳体，以及用于在壳体中产生层流气体的装置。 用于离心半导体晶片的方法使半导体晶片以层流气流离心。
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公开(公告)号：US08372213B2
公开(公告)日：2013-02-12
申请号：US12630005
申请日：2009-12-03
IPC分类号： B08B3/00
CPC分类号： B08B3/08 , H01L21/02052 , H01L21/67028
摘要： Semiconductor wafers are treated in a liquid container filled at least partly with a solution containing hydrogen fluoride, such that surface oxide dissolves, are transported out of the solution along a transport direction and dried, and are then treated with an ozone-containing gas to oxidize the surface of the semiconductor wafer, wherein part of the semiconductor wafer surface comes into contact with the ozone-containing gas while another part of the surface is still in contact with the solution, and wherein the solution and the ozone-containing gas are spatially separated such that they do not come into contact with one another.
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公开(公告)号：US20120248068A1
公开(公告)日：2012-10-04
申请号：US13378357
申请日：2010-06-14
申请人： Frank Schienle , Mario Schwab , Rahim Hamid , Lothar Hermann , Günter Schwab , Thomas Buschhardt , Diego Feijóo , Konrad Kaltenbach , Franz Sollinger
发明人： Frank Schienle , Mario Schwab , Rahim Hamid , Lothar Hermann , Günter Schwab , Thomas Buschhardt , Diego Feijóo , Konrad Kaltenbach , Franz Sollinger
CPC分类号： H01L21/6776 , H01L21/67057 , H01L21/67086 , H01L21/67784
摘要： The present invention relates to an apparatus and a method for the fluidic inline-treatment of flat substrates with at least one process module. In particular, the invention relates to such a treatment during the gentle and controlled transport of the substrates, wherein the treatment can also just relate to the transport of the substrates.According to the invention, a process module 1 is provided which comprises a treatment chamber 2 having at least one treatment surface 7A being substantially horizontally arranged in a treatment plane 5 and being designed for the formation of a lower fluid cushion 6A, wherein two openings in the form of entry 3 and exit 4 for the linear feed-through of the substrates 22 in the same plane are assigned to the treatment surface 7A, and at least one feed device with at least one catch 10 for the controlled feed 9 of the substrates 22 within the treatment chamber 2. Furthermore, the invention provides a method using the apparatus according to the invention.
摘要翻译： 本发明涉及一种用至少一个工艺模块进行流体在线处理平板基板的设备和方法。 特别地，本发明涉及在基材的温和和受控的输送过程中的这种处理，其中处理也可以仅涉及基材的输送。 根据本发明，提供了一种处理模块1，其包括具有至少一个处理表面7A的处理室2，处理表面7A基本上水平地布置在处理平面5中，并且被设计成用于形成下部流体衬垫6A，其中两个开口 用于在相同平面中的基板22的线性馈通的入口3和出口4的形式被分配给处理表面7A，并且至少一个进给装置具有用于基板的受控进料9的至少一个捕集件10 此外，本发明提供了一种使用根据本发明的装置的方法。
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公开(公告)号：US20100139706A1
公开(公告)日：2010-06-10
申请号：US12630005
申请日：2009-12-03
IPC分类号： B08B3/00
CPC分类号： B08B3/08 , H01L21/02052 , H01L21/67028
摘要： Semiconductor wafers are treated in a liquid container filled at least partly with a solution containing hydrogen fluoride, such that surface oxide dissolves, are transported out of the solution along a transport direction and dried, and are then treated with an ozone-containing gas to oxidize the surface of the semiconductor wafer, wherein part of the semiconductor wafer surface comes into contact with the ozone-containing gas while another part of the surface is still in contact with the solution, and wherein the solution and the ozone-containing gas are spatially separated such that they do not come into contact with one another.
摘要翻译： 半导体晶片在至少部分填充有含氟化氢的溶液的液体容器中处理，使得表面氧化物溶解，沿输送方向输送出溶液并干燥，然后用含臭氧气体处理以氧化 半导体晶片的表面，其中半导体晶片表面的一部分与含臭氧气体接触，而另一部分表面仍然与溶液接触，并且其中溶液和含臭氧气体在空间上分离 使他们不相互接触。
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公开(公告)号：US06412500B1
公开(公告)日：2002-07-02
申请号：US09480594
申请日：2000-01-07
IPC分类号： B08B300
CPC分类号： H01L21/02052 , B08B3/041 , H01L21/67046 , Y10S134/902
摘要： A device for cleaning semiconductor wafers with a cleaning liquid, includes a cleaning station with a plurality of rotating pairs of rollers which are arranged one behind another and to which the cleaning liquid is applied. Each pair of rollers is formed by a top roller and a bottom roller, and the semiconductor wafer is conveyed between the pairs of rollers. There is also a conveyor means for conveying the semiconductor wafer to and from the cleaning station. The conveyor means has a film of conveyor liquid which is provided by the conveyor and on which the semiconductor wafer is conveyed. A supplying container provides the cleaning liquid to the top rollers in the form of a falling liquid which migrates over the rollers. There is also a method for cleaning semiconductor wafers in which such a device is used.
摘要翻译： 一种用清洗液清洗半导体晶片的装置，包括一个具有多个旋转辊对的清洗台，它们一个接一个地布置并且被施加清洁液体。 每对辊由顶辊和底辊形成，并且半导体晶片在成对的辊之间输送。 还存在用于将半导体晶片传送到清洁站和从清洁站传送半导体晶片的传送装置。 输送装置具有由输送机提供并且半导体晶片被输送到该输送机液体的薄膜。 供应容器将清洗液体以向上滚动的下降液体的形式提供给顶辊。 还有一种清洁使用这种装置的半导体晶片的方法。
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