公开(公告)号：US06683260B2

公开(公告)日：2004-01-27

申请号：US09897127

申请日：2001-07-03

申请人： Takeshi Shimamoto ,  Kazufumi Yamaguchi ,  Masahide Tsukamoto ,  Fumikazu Tateishii ,  Yutaka Taguchi

发明人： Takeshi Shimamoto ,  Kazufumi Yamaguchi ,  Masahide Tsukamoto ,  Fumikazu Tateishii ,  Yutaka Taguchi

IPC分类号： H05K100

CPC分类号： H05K1/0245 ,  H01P3/08 ,  H05K1/0219 ,  H05K1/0242 ,  H05K1/09 ,  H05K3/107 ,  H05K2201/0305 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/098 ,  H05K2201/09981 ,  Y10T29/49126

摘要： Transmission line structure is composed of a pair of signal conductors which are embedded in one wiring region of a dielectric layer and a thickness in height of the signal conductor is larger than a width, and is constituted so that a coupling impedance between the adjacent signal conductors is lower than a coupling impedance between the signal conductor and another conductor formed in another wiring region, and thus to provide a multi-layer wiring board having a transmission line structure of high wiring density and excellent transmission characteristic.

摘要翻译： 传输线结构由嵌入在电介质层的一个布线区域中的一对信号导体组成，信号导体的高度大于宽度，并且构成为使得相邻信号导体之间的耦合阻抗 低于在另一布线区域中形成的信号导体和另一导体之间的耦合阻抗，从而提供具有高布线密度和优良传输特性的传输线结构的多层布线板。