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    High-frequency hermetically-sealed circuit package
    1.
    发明授权
    High-frequency hermetically-sealed circuit package 有权
    高频气密电路封装

    公开(公告)号：US07838990B2

    公开(公告)日：2010-11-23

    申请号：US12353100

    申请日：2009-01-13

    申请人： Fumio Yamamoto

    发明人： Fumio Yamamoto

    IPC分类号： H01L23/04

    CPC分类号： H05K9/0056 ,  H01L23/047 ,  H01L23/66 ,  H01L2223/6611 ,  H01L2223/6655 ,  H01L2224/48195 ,  H01L2924/15192 ,  H01L2924/16195

    摘要： A semiconductor package includes a base substrate on which semiconductor elements are disposed; a covering member which is provided to the base substrate, which covers the semiconductor elements, and which includes an opening at an end thereof at the side of the base substrate; and a connector substrate which is provided on the base substrate in a manner that the connector substrate closes the opening, which includes a first high-frequency signal line in an area located inside the covering member for a first surface, and which includes a second high-frequency signal line on a second surface being a surface on the opposite side of the first surface, the second high-frequency signal line being electrically connected to the first high-frequency signal line; wherein the base substrate is formed in a manner that the base substrate is located away from the second high-frequency signal line.

    摘要翻译： 半导体封装包括其上设置有半导体元件的基底基板; 覆盖部件，其设置在覆盖所述半导体元件的所述基底基板上，所述覆盖部件在所述基底侧的一端具有开口部; 以及连接器基板，其以连接器基板封闭开口的方式设置在基底基板上，该开口在位于第一表面的覆盖部件内的区域中包括第一高频信号线，并且包括第二高度 所述第二高频信号线与所述第一高频信号线电连接，所述第二高频信号线与所述第一高频信号线电连接。 其特征在于，所述基底基板以所述基底基板位于远离所述第二高频信号线的方式形成。

    SEMICONDUCTOR PACKAGE
    2.
    发明申请
    SEMICONDUCTOR PACKAGE 审中-公开
    半导体封装

    公开(公告)号：US20070230145A1

    公开(公告)日：2007-10-04

    申请号：US11535311

    申请日：2006-09-26

    申请人： Fumio Yamamoto

    发明人： Fumio Yamamoto

    IPC分类号： H05K7/00

    CPC分类号： H05K9/0056 ,  H01L23/047 ,  H01L23/66 ,  H01L2223/6611 ,  H01L2223/6655 ,  H01L2224/48195 ,  H01L2924/15192 ,  H01L2924/16195

    摘要： A semiconductor package includes a base substrate on which semiconductor elements are disposed; a covering member which is provided to the base substrate, which covers the semiconductor elements, and which includes an opening at an end thereof at the side of the base substrate; and a connector substrate which is provided on the base substrate in a manner that the connector substrate closes the opening, which includes a first high-frequency signal line in an area located inside the covering member for a first surface, and which includes a second high-frequency signal line on a second surface being a surface on the opposite side of the first surface, the second high-frequency signal line being electrically connected to the first high-frequency signal line; wherein the base substrate is formed in a manner that the base substrate is located away from the second high-frequency signal line.

    摘要翻译： 半导体封装包括其上设置有半导体元件的基底基板; 覆盖部件，其设置在覆盖所述半导体元件的所述基底基板上，所述覆盖部件在所述基底侧的一端具有开口部; 以及连接器基板，其以连接器基板封闭开口的方式设置在基底基板上，该开口在位于第一表面的覆盖部件内的区域中包括第一高频信号线，并且包括第二高度 所述第二高频信号线与所述第一高频信号线电连接，所述第二高频信号线与所述第一高频信号线电连接。 其特征在于，所述基底基板以所述基底基板位于远离所述第二高频信号线的方式形成。

    Numerical controller
    4.
    发明授权
    Numerical controller 失效
    数控机

    公开(公告)号：US5477118A

    公开(公告)日：1995-12-19

    申请号：US658581

    申请日：1991-02-21

    申请人： Takao Yoneda ,  Fumio Yamamoto ,  Yasuji Sakakibara ,  Naoki Arimoto ,  Yoji Yoshida ,  Chisato Banno

    发明人： Takao Yoneda ,  Fumio Yamamoto ,  Yasuji Sakakibara ,  Naoki Arimoto ,  Yoji Yoshida ,  Chisato Banno

    IPC分类号： G05B19/408 ,  G05B19/416 ,  G05B19/18

    CPC分类号： G05B19/408 ,  G05B19/4166 ,  G05B2219/33268 ,  G05B2219/35312 ,  G05B2219/37345 ,  G05B2219/37617 ,  G05B2219/41362

    摘要： A numerical controller for a grinding machine, wherein one of plural reference sizing points is selected according to the contents of a numerical control program. Measured analog data indicating the diameter of a workpiece is received continuously to determine if the size of the machined workpiece coincides with the selected reference sizing point. Upon the coincidence of the size of the machined workpiece with the reference sizing point, a sizing signal is provided, and then machining control is changed in response to the sizing signal. An analog signal provided by a measuring device is sampled at a predetermined interval in a predetermined time. The analog signal is tested to see if the analog signal is in a predetermined range, which is decided based upon the temperature variation or vibrations of the grinding machine. And the result of the test is displayed to facilitate checking the output characteristics of the measuring device. The analog signal is compared with a predetermined reference value, and then the result of the comparison is displayed together with a predetermined reference value.

    摘要翻译： 一种用于研磨机的数值控制器，其中根据数字控制程序的内容选择多个参考尺寸点中的一个。 连续接收指示工件直径的测量模拟数据，以确定加工的工件的尺寸是否与选定的参考上浆点重合。 当加工的工件的尺寸与参考尺寸点重合时，提供尺寸信号，然后响应于尺寸信号改变加工控制。 在预定时间内以预定间隔对由测量装置提供的模拟信号进行采样。 测试模拟信号以查看模拟信号是否在基于磨机的温度变化或振动的预定范围内。 并且显示测试结果以便于检查测量装置的输出特性。 将模拟信号与预定的参考值进行比较，然后将比较结果与预定的参考值一起显示。

    MEDICAL TRAY
    8.
    发明申请
    MEDICAL TRAY 有权
    医用托盘

    公开(公告)号：US20130056387A1

    公开(公告)日：2013-03-07

    申请号：US13601580

    申请日：2012-08-31

    申请人： Shigeki NUMATA ,  Fumio Yamamoto ,  Toshihiko Asao

    发明人： Shigeki NUMATA ,  Fumio Yamamoto ,  Toshihiko Asao

    IPC分类号： B65D6/04

    CPC分类号： A61M25/002 ,  A61B50/30 ,  A61B50/33 ,  A61B50/36 ,  A61B2017/0023

    摘要： To provide a medical tray which can be made more compact upon discarding, the medical tray has a bottom portion, a side wall provided along an outer periphery of the bottom portion, and a pair of side wall deformation guiding portions provided at opposing positions of the side wall for guiding the side wall when the side wall is deformed into a convex state toward the bottom portion.

    摘要翻译： 为了提供一种在丢弃时可以制造得更紧凑的医疗托盘，医疗托盘具有底部，沿着底部的外周设置的侧壁和设置在底部的相对位置的一对侧壁变形引导部 所述侧壁在所述侧壁朝向所述底部变形为凸状时引导所述侧壁。

    Oil tempered steel wire excellent in coiling workability and method for production thereof
    9.
    发明申请
    Oil tempered steel wire excellent in coiling workability and method for production thereof 审中-公开
    卷取加工性优良的回火钢丝及其制造方法

    公开(公告)号：US20060088710A1

    公开(公告)日：2006-04-27

    申请号：US10543627

    申请日：2003-12-26

    申请人： Tadayoshi Fujiwara ,  Tetsuo Jinbo ,  Fumio Yamamoto

    发明人： Tadayoshi Fujiwara ,  Tetsuo Jinbo ,  Fumio Yamamoto

    IPC分类号： D02G3/00

    CPC分类号： B21C37/04 ,  C23C22/62 ,  C23C28/00 ,  C23C30/00 ,  Y10T428/2913

    摘要： An oil tempered wire, characterized in that it comprises a wire material and, formed on the surface thereof, a coating film comprising one or more inorganic salts selected from the group consisting of a sulfate, a silicate and a borate. The coating film optionally further comprises fats and oils and/or a soap exhibiting lubricity. The oil tempered wire has a coating film exhibiting satisfactory heat resistance and good lubricity and thus can secure good coiling workability even in the case of a high strength wire or a wire having a heteromorphic section.

    摘要翻译： 一种油回火丝，其特征在于，其包括线材，并且在其表面上形成包含一种或多种选自硫酸盐，硅酸盐和硼酸盐的无机盐的涂膜。 涂膜任选地还包含油脂和/或表现出润滑性的皂。 油回火丝具有表现出良好的耐热性和良好润滑性的涂膜，因此即使在高强度丝线或具有异型部分的丝线的情况下，也可以确保良好的卷取加工性。