公开(公告)号：US20240128690A1

公开(公告)日：2024-04-18

申请号：US18393715

申请日：2023-12-22

申请人： GITech, Inc.

发明人： John Williams

IPC分类号： H01R13/6587 ,  H01R4/24 ,  H01R13/24

CPC分类号： H01R13/6587 ,  H01R4/24 ,  H01R13/2492

摘要： A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. One or more signal pins in a contact array are electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.

公开(公告)号：US11411351B2

公开(公告)日：2022-08-09

申请号：US17134449

申请日：2020-12-27

申请人： GITech, Inc.

发明人： John Williams

IPC分类号： H01R4/66 ,  H01R13/6471 ,  H01R13/24 ,  H01R13/05 ,  H01R13/6587 ,  H01R13/652

摘要： A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. Embodiments provide one or more signal pins in a contact array electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.

公开(公告)号：US11067603B2

公开(公告)日：2021-07-20

申请号：US16394247

申请日：2019-04-25

申请人： GITech Inc.

发明人： John Williams

IPC分类号： H01R12/71 ,  H01R13/66 ,  H01R13/24 ,  G01R1/073 ,  H05K1/11 ,  H01R13/502 ,  G01R1/067 ,  G01R31/28

摘要： An electrical connector comprises a bottom assembly extending in a first direction, a first contact assembly, a first substrate assembly, a second contact assembly, a second substrate assembly, a third contact assembly, a top assembly and a plurality of conductive vias. The bottom assembly, the first contact assembly, the first substrate assembly, the second contact assembly, the second substrate assembly, the third contact assembly, and the top assembly are arranged in a second direction. The plurality of conductive vias extends in the second direction to penetrate the bottom assembly, the first substrate assembly, the second substrate assembly, and the top assembly. Each of the contact member of the first contact assembly, the second contact assembly, and the third contact assembly are of a letter V shape.

公开(公告)号：US20210055329A9

公开(公告)日：2021-02-25

申请号：US16394247

申请日：2019-04-25

申请人： GITech Inc.

发明人： John Williams

IPC分类号： G01R1/073 ,  H05K1/11 ,  H01R12/71 ,  H01R13/24 ,  H01R13/66 ,  H01R13/502 ,  G01R1/067 ,  G01R31/28

摘要： An electrical connector comprises a bottom assembly, a first contact assembly, a first substrate assembly, a second contact assembly, a second substrate assembly, a third contact assembly, a top assembly and a plurality of conductive vias. The bottom assembly, the first contact assembly, the first substrate assembly, the second contact assembly, the second substrate assembly, the third contact assembly, and the top assembly are arranged in the given order. The plurality of conductive vias penetrate the bottom assembly, the first substrate assembly, the second substrate assembly, and the top assembly. Each of the contact member of the first contact assembly, the second contact assembly, and the third contact assembly are of a letter V shape.

公开(公告)号：US20190391180A1

公开(公告)日：2019-12-26

申请号：US16394247

申请日：2019-04-25

申请人： GITech Inc.

发明人： John Williams

IPC分类号： G01R1/073 ,  H05K1/11 ,  H01R12/71 ,  H01R13/24 ,  H01R13/66 ,  H01R13/502 ,  G01R1/067 ,  G01R31/28

摘要： An electrical connector comprises a bottom assembly, a first contact assembly, a first substrate assembly, a second contact assembly, a second substrate assembly, a third contact assembly, a top assembly and a plurality of conductive vias. The bottom assembly, the first contact assembly, the first substrate assembly, the second contact assembly, the second substrate assembly, the third contact assembly, and the top assembly are arranged in the given order. The plurality of conductive vias penetrate the bottom assembly, the first substrate assembly, the second substrate assembly, and the top assembly. Each of the contact member of the first contact assembly, the second contact assembly, and the third contact assembly are of a letter V shape.

公开(公告)号：US11996642B2

公开(公告)日：2024-05-28

申请号：US18055577

申请日：2022-11-15

申请人： GITech Inc.

发明人： John Williams

IPC分类号： H01R12/70 ,  H01R12/82 ,  H01R31/00

CPC分类号： H01R12/7076 ,  H01R12/82 ,  H01R31/005

摘要： An electrical connector including a substrate, a pitch transformation routing assembly formed on the substrate and including pitch transformation routing members, a first set of contact members where each contact member extends away from a first end of a corresponding pitch transformation routing member, and a second set of contact members where each contact member extends away from a second end of a corresponding pitch transformation routing member. Each pitch transformation routing member includes multiple routing sections, where each routing section extends in the first direction or the second direction. In a first subset of the pitch transformation routing members, the pitch transformation routing members have routing sections with different dimensions in the first direction and the second direction.

公开(公告)号：US11715912B2

公开(公告)日：2023-08-01

申请号：US17817006

申请日：2022-08-02

申请人： GITech, Inc.

发明人： John Williams

IPC分类号： H01R4/66 ,  H01R13/6471 ,  H01R13/24 ,  H01R13/05 ,  H01R13/6587 ,  H01R13/652

CPC分类号： H01R13/6471 ,  H01R13/052 ,  H01R13/2492 ,  H01R13/652 ,  H01R13/6587

摘要： A separable and reconnectable connector for semiconductor devices is provided that is scalable for devices having very small contact pitch. Connectors of the present disclosure include signal pins shielded by pins electrically-coupled to ground. Embodiments provide one or more signal pins in a contact array electrically-shielded by at least one ground pin coupled to a ground plane. Embodiments thereby provide signal pins, either single-ended or a differential pair, usable to transmit signals with reduced noise or cross-talk and thus improved signal integrity. Embodiments further provide inner ground planes coupled to connector ground pins to shield pairs of differential signal pins without increasing the size of the connector. Inner grounding layers can be formed within isolation substrates incorporated into connector embodiments between adjacent pairs of signal pins. These buried ground layers provide additional crosstalk isolation in close proximity to signal pins, resulting in improved signal integrity in a significantly reduced space.

公开(公告)号：US20230074818A1

公开(公告)日：2023-03-09

申请号：US18055577

申请日：2022-11-15

申请人： GITech Inc.

发明人： John Williams

IPC分类号： H01R12/70 ,  H01R12/82 ,  H01R31/00

摘要： An electrical connector including a substrate, a pitch transformation routing assembly formed on the substrate and including pitch transformation routing members, a first set of contact members where each contact member extends away from a first end of a corresponding pitch transformation routing member, and a second set of contact members where each contact member extends away from a second end of a corresponding pitch transformation routing member. Each pitch transformation routing member includes multiple routing sections, where each routing section extends in the first direction or the second direction. In a first subset of the pitch transformation routing members, the pitch transformation routing members have routing sections with different dimensions in the first direction and the second direction.

公开(公告)号：US10985480B2

公开(公告)日：2021-04-20

申请号：US16513188

申请日：2019-07-16

申请人： GITech Inc.

发明人： John Williams

IPC分类号： H01R12/70 ,  H01R12/82 ,  H01R31/00

摘要： An electrical connector comprises a plurality of substrates, a first plurality of spacers, a second plurality of spacers, a plurality of pitch transformation routing assemblies, and a plurality of contact assemblies. The plurality of substrates each extends along a first direction. Each of the second plurality of spacers and a respective spacer of the first plurality of spacers connect a respective substrate of the plurality of substrates to a respective adjacent substrate of the plurality of substrates. Each of the plurality of pitch transformation routing assemblies is surrounded by a corresponding substrate of the plurality of substrates, a corresponding spacer of the first plurality of spacers, a corresponding adjacent substrate of the plurality of substrates, and a corresponding spacer of the second plurality of spacers.

公开(公告)号：US11619653B2

公开(公告)日：2023-04-04

申请号：US17329134

申请日：2021-05-24

申请人： GITech Inc.

发明人： John Williams

IPC分类号： G01R1/04 ,  H01R13/24 ,  H01R33/74 ,  H01R13/631

摘要： A testing apparatus comprises a tester base, a supporting member, a frame, one or more electrical connectors and an upper cover. Each electrical connector includes a set of contact members that are positioned on a substrate and having first and second arm portions made of an electrically conductive material. The one or more electrical connectors are mounted on top of ribs in the supporting members and each of the electrical connectors is separated from an adjacent electrical connector by a respective pair of protrusions formed on opposite sides of the frame. Each of the second arm portions of the set of contact members of each electrical connector are disposed in a respective through hole formed in a panel of the supporting member.