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公开(公告)号：US08792238B2
公开(公告)日：2014-07-29
申请号：US13365739
申请日：2012-02-03
IPC分类号： F28D15/04 , H05K7/20 , F28D15/02 , H01L23/427 , H01L23/473 , F28F13/00
CPC分类号： F28D15/04 , F28D15/0233 , F28D15/0275 , F28D15/046 , F28F2013/006 , F28F2275/02 , F28F2275/04 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K7/20254 , H05K7/2029 , H01L2924/00
摘要： A heat-dissipating module having a loop-type vapor chamber includes a heat-dissipating body, a loop-type vapor chamber, and a heat-conducting medium. The loop-type vapor chamber is completely covered by the heat-dissipating body. The loop-type vapor chamber includes a loop body, a wick structure and a supporting structure. The loop body includes a bottom plate and a cover plate. A vacuum chamber is formed between the bottom plate and the cover plate. The wick structure is arranged on inner surfaces of the cover plate and the bottom plate. The supporting structure abuts the wick structure toward the cover plate and the bottom plate. The loop-type vapor chamber is tightly connected to the heat-dissipating body via the heat-conducting medium.
摘要翻译： 具有环型蒸气室的散热模块包括散热体，环型蒸气室和导热介质。 环形蒸气室被散热体完全覆盖。 环型蒸气室包括环体，芯结构和支撑结构。 环体包括底板和盖板。 在底板和盖板之间形成真空室。 芯体结构布置在盖板和底板的内表面上。 支撑结构朝向盖板和底板抵接芯体结构。 环形蒸汽室经由导热介质与散热体紧密连接。
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公开(公告)号：US20130199757A1
公开(公告)日：2013-08-08
申请号：US13365739
申请日：2012-02-03
IPC分类号： F28D15/04
CPC分类号： F28D15/04 , F28D15/0233 , F28D15/0275 , F28D15/046 , F28F2013/006 , F28F2275/02 , F28F2275/04 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K7/20254 , H05K7/2029 , H01L2924/00
摘要： A heat-dissipating module having a loop-type vapor chamber includes a heat-dissipating body, a loop-type vapor chamber, and a heat-conducting medium. The loop-type vapor chamber is completely covered by the heat-dissipating body. The loop-type vapor chamber includes a loop body, a wick structure and a supporting structure. The loop body includes a bottom plate and a cover plate. A vacuum chamber is formed between the bottom plate and the cover plate. The wick structure is arranged on inner surfaces of the cover plate and the bottom plate. The supporting structure abuts the wick structure toward the cover plate and the bottom plate. The loop-type vapor chamber is tightly connected to the heat-dissipating body via the heat-conducting medium.
摘要翻译： 具有环型蒸气室的散热模块包括散热体，环型蒸气室和导热介质。 环形蒸气室被散热体完全覆盖。 环型蒸气室包括环体，芯结构和支撑结构。 环体包括底板和盖板。 在底板和盖板之间形成真空室。 芯体结构布置在盖板和底板的内表面上。 支撑结构朝向盖板和底板抵接芯体结构。 环形蒸汽室经由导热介质与散热体紧密连接。
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公开(公告)号：US20110310563A1
公开(公告)日：2011-12-22
申请号：US12818341
申请日：2010-06-18
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0275 , F28F1/20 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A clamp-type heat sink for a memory includes two heat conducting modules, a pivot shaft, and an elastic element. The heat conducting module includes an isothermal vapor chamber plate and a heat dissipating body coupled to the isothermal vapor chamber plate. The heat dissipating body includes a base plate and heat dissipating fins extended from the base plate. The base plate includes a shaft hole for passing the pivot shaft, such that each heat dissipating body is installed serially, and the elastic element is sheathed onto the pivot shaft and includes two elastic arms extended from the elastic element and abutted against each heat dissipating body, such that each isothermal vapor chamber plate is clamped and attached onto an external side of the memory to improve the convenience and integrity of the assembling and removal process to achieve a quick assembling or removal effect and prevent the components from missing.
摘要翻译： 用于存储器的夹式散热器包括两个导热模块，枢转轴和弹性元件。 导热模块包括等温蒸气室板和耦合到等温蒸气室板的散热体。 散热体包括基板和从基板延伸的散热片。 基板包括用于使枢轴穿过的轴孔，使得每个散热体串联安装，并且弹性元件被套在枢轴上，并且包括从弹性元件延伸并抵靠每个散热体的两个弹性臂 使得每个等温蒸气室板被夹紧并附接到存储器的外部侧，以提高组装和移除过程的便利性和完整性，以实现快速组装或去除效果并防止部件丢失。
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公开(公告)号：US08011361B2
公开(公告)日：2011-09-06
申请号：US12411702
申请日：2009-03-26
IPC分类号： F24J2/10
CPC分类号： F28F1/34 , F24S10/90 , F24S23/31 , F24S23/72 , F24S40/55 , F24S2010/752 , F28D15/0233 , F28D15/0275 , H01L31/052 , Y02E10/43 , Y02E10/44 , Y02E10/50
摘要： A tower type heat dissipating structure is applied to dissipate the heat of a solar power system. The solar power system is provided with a reflector having a hemispheric surface for reflecting the sunlight to a solar cell. The heat dissipating structure comprises a heat-conducting plate, a plate type heat pipe and a plurality of heat dissipating fins. One side of the heat-conducting plate is connected with the solar cell, and the other side is provided with a groove for being embedded an end of the plate type heat pipe. The heat dissipating fins is arranged with an inclination angle against the plate type heat pipe that can promote the heated air within the gaps to rise. The heat is rapidly conduced to prevent the solar cell from being destroyed by overheating for reducing the repairing costs.
摘要翻译： 应用塔式散热结构来散发太阳能发电系统的热量。 太阳能发电系统设置有具有用于将太阳光反射到太阳能电池的半球面的反射器。 散热结构包括导热板，板式热管和多个散热片。 导热板的一侧与太阳能电池连接，另一侧设置有用于嵌入板式热管的端部的凹槽。 散热翅片布置成与板式热管倾斜的角度，其能够促使间隙内的加热空气升高。 快速地进行热量以防止太阳能电池被过热破坏以降低维修成本。
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公开(公告)号：US20100309671A1
公开(公告)日：2010-12-09
申请号：US12480833
申请日：2009-06-09
IPC分类号： F21V29/00
CPC分类号： F21V29/51 , F21K9/00 , F21V29/773 , F21V29/89 , F21Y2115/10
摘要： A heat dissipating module embedded into an LED lamp house for dissipating heat of an LED light emitting element includes two flat heat pipes, a heat dissipating body and a conducting base. The heat dissipating body includes a cylindrical pillar, heat sinks radially formed around the cylindrical pillar, two longitudinal through grooves at the cylindrical pillar for passing a condensation section of the flat heat pipe. The conducting base includes corresponding first and second surfaces, and the first surface is attached to an evaporation section of the flat heat pipe, and the second surface is attached to the LED light emitting element. The conducting base perpendicular to an axis of the cylindrical pillar includes an embedding slot for embedding the heat dissipating module into an internal wall of the lamp house, such that the heat dissipating module can quickly dissipate the heat generated by the LED light emitting element.
摘要翻译： 嵌入到LED灯室中的用于散发LED发光元件的散热模块的散热模块包括两个平坦的热管，散热体和导电基座。 散热体包括圆柱形柱体，围绕圆柱形柱状径向形成的散热片，圆柱形柱体上的两个纵向通孔，用于使扁平热管的冷凝部分通过。 导电基座包括相应的第一和第二表面，并且第一表面附接到平坦热管的蒸发部分，并且第二表面附接到LED发光元件。 垂直于圆柱形柱的轴的导电底座包括用于将散热模块嵌入灯室的内壁的嵌入槽，使得散热模块可以快速消散由LED发光元件产生的热量。
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公开(公告)号：US20100133553A1
公开(公告)日：2010-06-03
申请号：US12325554
申请日：2008-12-01
CPC分类号： H05K1/0203 , F21K9/00 , F21V29/51 , F21V29/75 , F21V29/763 , F21Y2103/10 , F21Y2115/10 , H05K1/0272 , H05K1/056 , H05K1/181 , H05K2201/10106 , H05K2203/088
摘要： A thermally conductive structure of a light emitting diode (LED) includes a vapor chamber, an insulating layer, an electrically conductive layer and a plurality of LEDs. In the invention, the insulating layer is plated over a surface of the vapor chamber; the electrically conductive layer disposed on the insulating layer is electrically separated from the vapor chamber and has a first electrode and a second electrode; and the LEDs arranged on the insulating layer respectively have a first leg connected to the first electrode and a second leg connected to the second electrode; thereby, the invention has an excellent performance of thermal conduction and heat dissipation, which is capable of prolonging the lifespan of LED.
摘要翻译： 发光二极管（LED）的导热结构包括蒸气室，绝缘层，导电层和多个LED。 在本发明中，绝缘层被镀在蒸气室的表面上; 设置在绝缘层上的导电层与蒸气室电分离并具有第一电极和第二电极; 布置在绝缘层上的LED分别具有连接到第一电极的第一支脚和连接到第二电极的第二支脚; 因此，本发明具有优异的热传导和散热性能，能够延长LED的寿命。
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公开(公告)号：US07599185B2
公开(公告)日：2009-10-06
申请号：US12170556
申请日：2008-07-10
CPC分类号： H01L23/427 , H01L23/4006 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A cooling device for dissipating heat generated by an electronic element includes a fixing seat, a cooling body, and a vapor chamber. The fixing seat is arranged an opening. The cooling body includes a bottom plate attached onto the fixing seat and a plurality of cooling fins that are interspaced to each other and are attached to the bottom plate, in which a fixing hole is arranged at one side of the bottom plate, and an accommodating space is configured at the cooling fins in corresponding to the fixing hole. The vapor chamber is accommodated in the opening of the fixing seat, and one side of the vapor chamber contacts a bottom part of the cooling body, while another side contacts the electronic element.
摘要翻译： 用于散发由电子元件产生的热量的冷却装置包括固定座，冷却体和蒸气室。 固定座设置开口。 所述冷却体包括安装在所述固定座上的底板和多个相互间隔的冷却翅片，并且安装在所述底板上，所述底板在所述底板的一侧配置有固定孔， 在与固定孔对应的冷却翅片处构成空间。 蒸气室容纳在固定座的开口中，蒸气室的一侧与冷却体的底部接触，另一侧接触电子元件。
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公开(公告)号：US20120279687A1
公开(公告)日：2012-11-08
申请号：US13101180
申请日：2011-05-05
IPC分类号： F28D15/04
CPC分类号： F28D15/046
摘要： The present invention provides a flat-type heat pipe and a wick structure thereof. The flat-type heat pipe has a flat tube. The wick structure is arranged inside the flat tube along an axial line of the flat tube. The wick structure comprises a first wick portion and two second wick portions connected on both sides of the first wick portion. The thickness of the first wick portion is larger than that of the second wick portion. The first wick portion abuts against an upper inner wall of the flat tube. An air channel is formed between each of the second wick portions and the upper inner wall of the flat tube. The wick structure supports the inner wall of the flat-type heat pipe without providing additional supporting structure, so that the heat pipe can be made more compact.
摘要翻译： 本发明提供一种扁平型热管及其灯芯结构。 扁平型热管具有扁平管。 芯体结构沿着扁平管的轴线布置在扁平管内。 芯体结构包括连接在第一芯部两侧的第一芯部和两个第二芯部。 第一灯芯部分的厚度大于第二灯芯部分的厚度。 第一个芯部分靠在扁平管的上部内壁上。 在第二芯体部分和扁平管的上内壁之间形成空气通道。 芯体结构支撑扁平型热管的内壁，而不需要额外的支撑结构，从而使热管更加紧凑。
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公开(公告)号：US20120097371A1
公开(公告)日：2012-04-26
申请号：US12910207
申请日：2010-10-22
CPC分类号： F28F1/30 , F28D15/02 , F28F2275/10
摘要： A serially-connected heat-dissipating fin assembly includes a plurality of heat-dissipating fins and a thermal-conducting element. Each of the heat-dissipating fins is provided with a hollow connecting portion for allowing the thermal-conducting element to be disposed through. The inner edge of the connecting portion of the respective heat-dissipating fins is provided with a protruding wall. The protruding wall is provided with a plurality of abutting portions slightly protruding toward the connecting portions. The surface of the thermal-conducting element is brought into frictional contact with the abutting portions to thereby tightly fit into the connecting portions of the respective heat-dissipating fins. With the interference fit between the respective abutting portions and the surface of the thermal-conducting element, it is unnecessary to use solders.
摘要翻译： 串联连接的散热片组件包括多个散热翅片和导热元件。 每个散热翅片设置有用于允许导热元件穿过的中空连接部分。 各散热片的连接部的内缘设有突出壁。 突出壁设置有多个朝向连接部分稍微突出的邻接部分。 导热元件的表面与邻接部分摩擦接触，从而紧密地配合到相应的散热片的连接部分。 通过相应的邻接部分和导热元件的表面之间的过盈配合，不需要使用焊料。
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10.发明申请HEAT-DISSIPATING BODY HAVING RADIAL FIN ASSEMBLY AND HEAT-DISSIPATING DEVICE HAVING THE SAME 审中-公开具有径向熔融组件的散热体和具有该散热装置的散热装置公开(公告)号：US20110315356A1
公开(公告)日：2011-12-29
申请号：US12822294
申请日：2010-06-24
CPC分类号： H01L23/467 , F28D15/0233 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat-dissipating device includes a heat-dissipating body, a vapor chamber and a fan assembly. The heat-dissipating body includes a thermal-conductive element and a radial fin assembly. The thermal-conductive element includes a solid post and extending arms extending therefrom. The radial fin assembly includes radially-arranged heat-dissipating fins that form a central hole to enclose the sold post, engaging troughs inserted by the extending arms, and an airflow space. An air channel is formed between any two heat-dissipating fins. The vapor chamber is provided at one end of the solid post, while the fan assembly is arranged on the other end and received in the airflow space to correspond to the respective air channels. Thus, the mobility of air and the heat-dissipating efficiency can be increased, thereby conforming to the requirements for compact design.
摘要翻译： 散热装置包括散热体，蒸气室和风扇组件。 散热体包括导热元件和径向翅片组件。 导热元件包括固体柱和从其延伸的延伸臂。 径向翅片组件包括径向布置的散热翅片，其形成用于封闭销售柱的中心孔，由延伸臂插入的接合槽和气流空间。 在任何两个散热翅片之间形成空气通道。 蒸气室设置在固体柱的一端，而风扇组件布置在另一端并且容纳在气流空间中以对应于相应的空气通道。 因此，可以提高空气的流动性和散热效率，从而符合紧凑设计的要求。
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