摘要:
A composition is prepared of a liquid vinyl monomer, a UV-activated photo-initiator, a thermal initiator, and an accelerator. The composition also preferably contains a free-radical scavenger and a vinyl oligomer. Upon exposure to ultraviolet light the photo-initiator initiates polymerization in the surface layer thereby generating sufficient heat to activate the thermal initiator and cause the polymerization to proceed throughout the bulk of the monomer.
摘要:
A tacky or sticky coating is provided on selected surface areas inside compressed gas-insulated systems to trap conducting and semiconducting particles which, if allowed to remain free, can promote breakdown between metallic parts or electrodes maintained at different potentials, or which may initiate tracking and flashover along insulating surfaces. The initially hard, dry coating is comprised of a binder component and an active component. The binder component is chemically inert to both the insulating gas within the apparatus and a solvent vapor, while the active component is capable of interacting with the solvent vapor to become tacky. The insulating coating, after exposure to the solvent vapor, becomes tacky on the surface to thereon entrap contamination particles, but the addition of the binder component prevents the coating from sagging but instead maintains its spatial position on the selected surface areas.
摘要:
A flexible resin adhesive coated substrate is made by: (A) coating a sheet material with a wet, heat reactive adhesive resin, containing a monomer and an amount of an ultraviolet radiation sensitive photoinitiator effective to cause polymerization of monomer in response to ultraviolet radiation, and (B) applying ultraviolet radiation to the adhesive resin coating on the sheet material to polymerize monomer without the application of heat, forming a dry, uncured coating of adhesive bonded to the sheet material.
摘要:
A photosensitive sag resistant composition is made containing cycloaliphatic epoxy resin, a flexibilizing agent, arc and track resistant filler, thixotroping agent, and an amount of a photosensitive compound effective to initiate gelation with ultraviolet light exposure, where the composition is resistant to sag upon application to a surface, and has chemical and physical resistance to arced SF.sub.6 upon cure.
摘要:
Disclosed is a solventless UV dryable B-stageable epoxy adhesive which comprises about 40 to about 70 pbw of a solid thermally curable epoxy having a molecular weight between about 650 and about 4000, a thermal curing agent for the thermally curable epoxy which is stable at room temperature and soluble on the adhesive in an amount of about stoichiometric to about 50% by weight in excess of stoichiometric, up to about 2 pbw of an accelerator for the thermal curing agent which is soluble in the adhesive, about 25 to about 60 pbw of a liquid UV curable resin having a molecular weight of less than about 700 which is either an epoxy, an acrylic, or a mixture thereof and which is a diluent for the thermally curable epoxy, about 1 to about 10 pbw of a UV photoinitiator for the UV curable resin, up to about 20 pbw of a reactive diluent, up to about 5 pbw of a flow control agent, up to about 1 pbw of a surfactant, and up to about 10 pbw of a tri or higher functional epoxy.
摘要:
A photosensitive, solventless, low viscosity, oil free coating composition is made by admixing: (A) about 40 wt.% to about 90 wt.% of an alkyd component, consisting essentially of a polyhydric alcohol and a dibasic aromatic and aliphatic acid mixture with (B) about 10 wt.% to about 60 wt.% of an acrylate monomer and (C) an effective amount of a photoinitiator; the composition characterized by having a viscosity of up to about 2,000 cps. at 25.degree. C., and being capable of forming an ultraviolet radiation cured, hard, pin hole free film, having a thickness of under about 5 mils.