公开(公告)号：US06188130B1

公开(公告)日：2001-02-13

申请号：US09332306

申请日：1999-06-14

Applicant: German Ramirez ,  Serafin Padilla Pedron, Jr.

Inventor： German Ramirez ,  Serafin Padilla Pedron, Jr.

IPC: H01L2310

CPC classification number: H01L23/4334 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A semiconductor package comprising: (a) at least one semiconductor device; (b) a metal heat spreader that has at least one surface exposed to ambient and the perimeter of that exposed surface having a seal ring border; (c) a leadframe having a plurality of inner and outer leads, said inner leads interconnected to said semiconductor device; and (d) a molding resin encapsulating said semiconductor device, said inner leads of said leadframe and all of the heat spreader except that exposed surface having the seal ring border.

Abstract translation: 一种半导体封装，包括：（a）至少一个半导体器件; （b）金属散热器，其具有暴露于环境的至少一个表面，并且该暴露表面的周边具有密封圈边界; （c）具有多个内引线和外引线的引线框架，所述内引线互连到所述半导体器件; 和（d）封装所述半导体器件的所述成型树脂，所述引线框架的所述内引线和所有所述散热器除了具有所述密封环边界的暴露表面之外。

公开(公告)号：US5477008A

公开(公告)日：1995-12-19

申请号：US33919

申请日：1993-03-19

Applicant: Anthony M. Pasqualoni ,  Deepak Mahulikar ,  Francis S. Jewell ,  Paul R. Hoffman ,  George Brathwaite ,  Richard McNabb ,  German Ramirez

Inventor： Anthony M. Pasqualoni ,  Deepak Mahulikar ,  Francis S. Jewell ,  Paul R. Hoffman ,  George Brathwaite ,  Richard McNabb ,  German Ramirez

IPC: H01L23/04 ,  H01L23/10 ,  H05K5/06

CPC classification number: H01L23/10 ,  H01L23/04 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01025 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/16151 ,  H01L2924/16152 ,  Y10T29/49146

Abstract: There are provided polymer plugs for sealing the vent hole of an adhesively sealed electronic package. The polymer vent hole plug is selected to be either an ultraviolet curable polymer or a thermosetting polymer resin. One effective vent hole plug is a cylindrical plug having a diameter under 1.4 millimeters formed from a UV-curable epoxy.

Abstract translation: 提供了用于密封粘合密封电子封装的通气孔的聚合物塞。 聚合物排气孔塞被选择为紫外线固化聚合物或热固性聚合物树脂。 一个有效的通气孔塞是由UV可固化环氧树脂形成的直径小于1.4毫米的圆柱塞。