Encapsulated photomultiplier device of semiconductor material, for use, for example, in machines for performing positron-emission tomography
    2.
    发明授权
    Encapsulated photomultiplier device of semiconductor material, for use, for example, in machines for performing positron-emission tomography 有权
    半导体材料的封装光电倍增器装置,例如用于进行正电子发射断层摄影的机器中

    公开(公告)号:US09188683B2

    公开(公告)日:2015-11-17

    申请号:US13303731

    申请日:2011-11-23

    IPC分类号: G01T1/20 H01L27/146

    摘要: An embodiment of a photomultiplier device is formed by a base substrate of insulating organic material forming a plurality of conductive paths and carrying a plurality of chips of semiconductor material. Each chip integrates a plurality of photon detecting elements, such as Geiger-mode avalanche diodes, and is bonded on a first side of the base substrate. Couplings for photon-counting and image-reconstruction units are formed on a second side of the base substrate. The first side of the base substrate is covered with a transparent encapsulating layer of silicone resin, which, together with the base substrate, bestows stiffness on the photomultiplier device, preventing warpage, and covers and protects the chips.

    摘要翻译: 光电倍增器装置的一个实施例由形成多个导电路径并承载多个半导体材料芯片的绝缘有机材料的基底形成。 每个芯片集成了多个光子检测元件,例如盖革模式雪崩二极管,并且被结合在基底基板的第一侧上。 用于光子计数和图像重建单元的耦合器形成在基底衬底的第二侧上。 基底基板的第一面覆盖有硅树脂的透明封装层,其与基底基板一起在光电倍增器装置上赋予刚度,防止翘曲,并且覆盖和保护芯片。

    Assembly of an integrated device enabling a facilitated fluidic connection to regions of the device
    3.
    发明授权
    Assembly of an integrated device enabling a facilitated fluidic connection to regions of the device 有权
    一种集成的装置,其能够实现与设备的区域的便利的流体连接

    公开(公告)号:US07421904B2

    公开(公告)日:2008-09-09

    申请号:US11768090

    申请日:2007-06-25

    IPC分类号: B01L3/00

    CPC分类号: G01L19/0038

    摘要: Described herein is an assembly of an integrated device and of a cap coupled to the integrated device; the integrated device is provided with at least a first and a second region to be fluidically accessed from outside, and the cap has an outer portion provided with at least a first and a second inlet port in fluid communication with the first and second regions. In particular, the first and second regions are arranged on a first outer face, or on respective adjacent outer faces, of the integrated device, and an interface structure is set between the integrated device and the outer portion of the cap, and is provided with a channel arrangement for routing the first and second regions towards the first and second inlets.

    摘要翻译: 这里描述的是集成装置和联接到集成装置的盖的组件; 集成装置设置有至少第一和第二区域以从外部流体地访问,并且帽具有至少设置有与第一和第二区域流体连通的第一入口和第二入口的外部。 特别地,第一和第二区域布置在集成装置的第一外表面或相应的相邻外表面上,并且界面结构设置在集成装置和盖的外部之间,并且设置有 用于将第一和第二区域朝向第一和第二入口路由的通道布置。

    INTEGRATED CHEMICAL SENSOR FOR DETECTING ODOROUS MATTERS
    7.
    发明申请
    INTEGRATED CHEMICAL SENSOR FOR DETECTING ODOROUS MATTERS 有权
    用于检测气味的综合化学传感器

    公开(公告)号:US20110209524A1

    公开(公告)日:2011-09-01

    申请号:US13016086

    申请日:2011-01-28

    IPC分类号: G01N33/00

    CPC分类号: G01N33/0009

    摘要: A cartridge-like chemical sensor is formed by a housing having a base and a cover fixed to the base and provided with an input opening, an output hole and a channel for a gas to be analyzed. The channel extends in the cover between the input opening and the output hole and faces a printed circuit board carrying an integrated circuit having a sensitive region open toward the channel and of a material capable to bind with target chemicals in the gas to be analyzed. A fan is arranged in the housing, downstream of the integrated device, for sucking the gas after being analyzed, and is part of a thermal control system for the integrated circuit.

    摘要翻译: 盒式化学传感器由壳体形成,壳体具有固定到基座的基部和盖,并且设置有用于待分析气体的输入开口,输出孔和通道。 通道在输入开口和输出孔之间的盖中延伸,并且面向承载具有朝向通道开口的敏感区域的集成电路的印刷电路板和能够与要分析的气体中的目标化学物质结合的材料。 在集成装置的下游的壳体内设置风扇,用于在分析后吸入气体,并且是集成电路的热控制系统的一部分。

    MANUFACTURING METHOD OF AN ELECTRONIC DEVICE INCLUDING OVERMOLDED MEMS DEVICES
    9.
    发明申请
    MANUFACTURING METHOD OF AN ELECTRONIC DEVICE INCLUDING OVERMOLDED MEMS DEVICES 审中-公开
    包括过度MEMS器件的电子器件的制造方法

    公开(公告)号:US20090115008A1

    公开(公告)日:2009-05-07

    申请号:US12260910

    申请日:2008-10-29

    IPC分类号: H01L29/84 H01L21/50 H01L23/00

    摘要: A method manufactures an electronic device comprising a MEMS device overmolded in a protective casing. The MEMS device includes an active surface wherein a portion of the MEMS device is integrated, and is sensitive, through a membrane, to chemical/physical variations of a fluid. Prior to the molding step, at least one resin layer is formed on at least one region overlying the active surface in correspondence with the membrane. After, at least one portion of at least one resin layer is removed from at least one region, so that in the region an opening is formed, through which the MEMS device is activated from the outside of the protective casing.

    摘要翻译: 一种方法制造包括在保护壳体中包覆成型的MEMS器件的电子器件。 MEMS器件包括活性表面,其中MEMS器件的一部分通过膜整合并且对于液体的化学/物理变化是敏感的。 在模塑步骤之前,在与膜相对应的至少一个覆盖有源表面的区域上形成至少一个树脂层。 之后,从至少一个区域去除至少一个树脂层的至少一部分,使得在该区域中形成开口,通过该开口,MEMS器件从保护壳体的外部被激活。