公开(公告)号：US20120021170A1

公开(公告)日：2012-01-26

申请号：US13248660

申请日：2011-09-29

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, JR.

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, JR.

IPC分类号： B32B3/22

CPC分类号： B81C1/00666 ,  G01R1/06755 ,  G01R1/07357 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/4092 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T428/13 ,  Y10T428/1317 ,  Y10T428/24174 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

摘要翻译： 微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。 封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材​​料形成。 封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

公开(公告)号：US08080293B2

公开(公告)日：2011-12-20

申请号：US12728047

申请日：2010-03-19

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, Jr.

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, Jr.

IPC分类号： H01R12/00

CPC分类号： B81C1/00666 ,  G01R1/06755 ,  G01R1/07357 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/4092 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T428/13 ,  Y10T428/1317 ,  Y10T428/24174 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

摘要翻译： 微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。 封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材​​料形成。 封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

公开(公告)号：US10163242B2

公开(公告)日：2018-12-25

申请号：US15465413

申请日：2017-03-21

申请人： Gordon Todd Jagerson, Jr.

发明人： Gordon Todd Jagerson, Jr.

IPC分类号： G06T11/60 ,  G06K9/00 ,  G06F17/50 ,  G06Q10/00 ,  G06Q50/06 ,  G06F3/0484 ,  H04L29/08

摘要： Techniques are disclosed for an energy grid data platform through which information associated with an electrical grid can be accessed by one or more entities. In some embodiments, an energy grid data platform includes one or more modeling engines configured to receive data associated with an electrical grid and generate data models describing various aspects of the electrical grid. For example an electrical grid model describing the state of the electrical grid at one or more points of connection may be based at least in part on data received from sensors at the edge of the electrical grid. As another example, a physical grid model describing the physical arrangement and logical relationships between physical objects associated with the electrical grid can be generated based at least in part on received imagery data. In some embodiments, aspects of an electrical grid model and physical grid model can be combined into an operational grid model that associates real-time operating information with the certain identified physical objects associated with the electrical grid. Information based on the one or more generated models of the electrical grid can be accessed via the energy grid platform as a cloud-based service, for example, via a web interface or an augmented reality display device.

公开(公告)号：US08435612B2

公开(公告)日：2013-05-07

申请号：US13248660

申请日：2011-09-29

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, Jr.

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, Jr.

IPC分类号： B32B3/22

CPC分类号： B81C1/00666 ,  G01R1/06755 ,  G01R1/07357 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/4092 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T428/13 ,  Y10T428/1317 ,  Y10T428/24174 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

摘要翻译： 微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。 封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材​​料形成。 封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

公开(公告)号：US20100184311A1

公开(公告)日：2010-07-22

申请号：US12728047

申请日：2010-03-19

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, JR.

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, JR.

IPC分类号： H01R12/00

CPC分类号： B81C1/00666 ,  G01R1/06755 ,  G01R1/07357 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/4092 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T428/13 ,  Y10T428/1317 ,  Y10T428/24174 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

摘要翻译： 微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。 封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材​​料形成。 封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

公开(公告)号：US07730615B2

公开(公告)日：2010-06-08

申请号：US12037890

申请日：2008-02-26

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, Jr.

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, Jr.

IPC分类号： H01R43/16

CPC分类号： B81C1/00666 ,  G01R1/06755 ,  G01R1/07357 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/4092 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T428/13 ,  Y10T428/1317 ,  Y10T428/24174 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

摘要翻译： 微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。 封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材​​料形成。 封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。

公开(公告)号：US20180218525A1

公开(公告)日：2018-08-02

申请号：US15465413

申请日：2017-03-21

申请人： Gordon Todd Jagerson, JR.

发明人： Gordon Todd Jagerson, JR.

IPC分类号： G06T11/60 ,  G06K9/00 ,  G06F17/50

CPC分类号： G06T11/60 ,  G06F3/0484 ,  G06F17/50 ,  G06K9/00671 ,  G06Q10/00 ,  G06Q50/06 ,  H02J2003/007 ,  H04L67/18 ,  Y04S10/54

摘要： Techniques are disclosed for an energy grid data platform through which information associated with an electrical grid can be accessed by one or more entities. In some embodiments, an energy grid data platform includes one or more modeling engines configured to receive data associated with an electrical grid and generate data models describing various aspects of the electrical grid. For example an electrical grid model describing the state of the electrical grid at one or more points of connection may be based at least in part on data received from sensors at the edge of the electrical grid. As another example, a physical grid model describing the physical arrangement and logical relationships between physical objects associated with the electrical grid can be generated based at least in part on received imagery data. In some embodiments, aspects of an electrical grid model and physical grid model can be combined into an operational grid model that associates real-time operating information with the certain identified physical objects associated with the electrical grid. Information based on the one or more generated models of the electrical grid can be accessed via the energy grid platform as a cloud-based service, for example, via a web interface or an augmented reality display device.

公开(公告)号：US07356920B2

公开(公告)日：2008-04-15

申请号：US10986712

申请日：2004-11-12

申请人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, Jr.

发明人： Thomas Hantschel ,  Sven Kosgalwies ,  Eugene M. Chow ,  Gordon Todd Jagerson, Jr.

IPC分类号： H05K3/30

CPC分类号： B81C1/00666 ,  G01R1/06755 ,  G01R1/07357 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H05K3/4092 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T428/13 ,  Y10T428/1317 ,  Y10T428/24174 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

摘要： Micro-machined (e.g., stress-engineered spring) structures are produced by forming a release layer, forming a partially or fully encapsulated beam/spring structure, and then releasing the beam/spring structure by etching the release layer. The encapsulation structure protects the beam/spring during release, so both the release layer and the beam/spring can be formed using plating and/or using the same material. The encapsulation structure can be metal, resist, polymer, oxide, or nitride, and may be removed after the release process, or retained as part of the completed micro-machined structure.

摘要翻译： 微加工（例如，应力工程弹簧）结构通过形成剥离层，形成部分或完全封装的梁/弹簧结构，然后通过蚀刻释放层来释放梁/弹簧结构来制造。 封装结构在释放期间保护梁/弹簧，因此释放层和梁/弹簧都可以使用电镀和/或使用相同的材​​料形成。 封装结构可以是金属，抗蚀剂，聚合物，氧化物或氮化物，并且可以在释放过程之后被去除，或者作为完成的微加工结构的一部分保留。