公开(公告)号：US06404649B1

公开(公告)日：2002-06-11

申请号：US09518491

申请日：2000-03-03

Applicant: Michael Drake ,  Chris Tressler ,  Edward Guerrero ,  Greg Schelling ,  John Bennett

Inventor： Michael Drake ,  Chris Tressler ,  Edward Guerrero ,  Greg Schelling ,  John Bennett

IPC: H05K706

CPC classification number: H05K1/0231 ,  H01L23/642 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10734 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/00

Abstract: A printed circuit board assembly with improved bypass decoupling for BGA packages. In one embodiment, a capacitor may be interposed between a BGA package and a PCB within a perimeter of the contact pads that form a BGA footprint. The capacitor may have physical dimensions which allow a BGA package to be mounted such that there is no physical contact between the capacitor and the BGA.

Abstract translation: 一种具有改进的BGA封装旁路去耦的印刷电路板组件。 在一个实施例中，可以在形成BGA封装的接触焊盘的周边内的BGA封装和PCB之间插入电容器。 电容器可以具有允许安装BGA封装的物理尺寸，使得电容器和BGA之间不存在物理接触。