公开(公告)号：US20060151110A1

公开(公告)日：2006-07-13

申请号：US11276803

申请日：2006-03-15

申请人： Thomas Laursen ,  Guangying Zhang

发明人： Thomas Laursen ,  Guangying Zhang

IPC分类号： H01L21/306 ,  C23F1/00

CPC分类号： B24B57/02 ,  B24B37/26 ,  B24B55/02 ,  C23F3/00 ,  G11B5/8404 ,  H01L21/30625 ,  H01L21/67219

摘要： A method and apparatus for ‘through-the-pad’ delivery of slurry polishing agents directly to the land areas of a polishing pad is disclosed. The present invention further provides for improved control of the chemical composition of the slurry to address loss of chemical reactivity of the slurry during the polishing cycle. Additionally, various groove modifications to the polishing surface of the pad are also disclosed for improved slurry retention over substantially the entire surface of the polishing pad and reduction of the slow band effect. The present invention thus provides for a higher degree of planarization and uniformity of material removed from the surface of a processed workpiece in order to eliminate, or otherwise reduce, small-scale roughness and large-scale topographic differentials as well as to reduce the Cost-of-Ownership associated with slurry costs.

摘要翻译： 公开了一种用于将浆料抛光剂直接输送到抛光垫的陆地区域的方法和装置。 本发明还提供改进的浆料化学成分的控制，以解决在抛光循环期间浆料的化学反应性的损失。 此外，还公开了对抛光垫的抛光表面的各种凹槽修改，以改善在抛光垫的基本上整个表面上的浆料保留并减少慢带效应。 因此，本发明提供了从加工的工件的表面去除的材料的更高程度的平坦化和均匀性，以便消除或以其他方式减小小尺度粗糙度和大规模地形差异，以及降低成本 - 与浆料成本相关的所有权。

公开(公告)号：US07314402B2

公开(公告)日：2008-01-01

申请号：US09999401

申请日：2001-11-15

申请人： Thomas Laursen ,  Guangying Zhang

发明人： Thomas Laursen ,  Guangying Zhang

IPC分类号： B24B1/00

CPC分类号： B24B57/02 ,  B24B37/26 ,  B24B55/02 ,  C23F3/00 ,  G11B5/8404 ,  H01L21/30625 ,  H01L21/67219

摘要： A method and apparatus for ‘through-the-pad’ delivery of slurry polishing agents directly to the land areas of a polishing pad is disclosed. The present invention further provides for improved control of the chemical composition of the slurry to address loss of chemical reactivity of the slurry during the polishing cycle. Additionally, various groove modifications to the polishing surface of the pad are also disclosed for improved slurry retention over substantially the entire surface of the polishing pad and reduction of the slow band effect. The present invention thus provides for a higher degree of planarization and uniformity of material removed from the surface of a processed workpiece in order to eliminate, or otherwise reduce, small-scale roughness and large-scale topographic differentials as well as to reduce the Cost-of-Ownership associated with slurry costs.

摘要翻译： 公开了一种用于将浆料抛光剂直接输送到抛光垫的陆地区域的方法和装置。 本发明还提供改进的浆料化学成分的控制，以解决在抛光循环期间浆料的化学反应性的损失。 此外，还公开了对抛光垫的抛光表面的各种凹槽修改，以改善在抛光垫的基本上整个表面上的浆料保留并减少慢带效应。 因此，本发明提供了从加工的工件的表面去除的材料的更高程度的平坦化和均匀性，以便消除或以其他方式减小小尺度粗糙度和大规模地形差异，以及降低成本 - 与浆料成本相关的所有权。

公开(公告)号：US07887396B2

公开(公告)日：2011-02-15

申请号：US11276803

申请日：2006-03-15

申请人： Thomas Laursen ,  Guangying Zhang

发明人： Thomas Laursen ,  Guangying Zhang

IPC分类号： B24B29/02

CPC分类号： B24B57/02 ,  B24B37/26 ,  B24B55/02 ,  C23F3/00 ,  G11B5/8404 ,  H01L21/30625 ,  H01L21/67219

摘要： A method and apparatus for ‘through-the-pad’ delivery of slurry polishing agents directly to the land areas of a polishing pad is disclosed. The present invention further provides for improved control of the chemical composition of the slurry to address loss of chemical reactivity of the slurry during the polishing cycle. Additionally, various groove modifications to the polishing surface of the pad are also disclosed for improved slurry retention over substantially the entire surface of the polishing pad and reduction of the slow band effect. The present invention thus provides for a higher degree of planarization and uniformity of material removed from the surface of a processed workpiece in order to eliminate, or otherwise reduce, small-scale roughness and large-scale topographic differentials as well as to reduce the Cost-of-Ownership associated with slurry costs.

摘要翻译： 公开了一种用于将浆料抛光剂直接输送到抛光垫的陆地区域的方法和装置。 本发明还提供改进的浆料化学成分的控制，以解决在抛光循环期间浆料的化学反应性的损失。 此外，还公开了对抛光垫的抛光表面的各种凹槽修改，以改善在抛光垫的基本上整个表面上的浆料保留并减少慢带效应。 因此，本发明提供了从加工的工件的表面去除的材料的更高程度的平坦化和均匀性，以便消除或以其他方式减小小尺度粗糙度和大尺寸地形差异，以及降低成本 - 与浆料成本相关的所有权。

公开(公告)号：US20090061630A1

公开(公告)日：2009-03-05

申请号：US12195840

申请日：2008-08-21

申请人： Bentley J. Palmer ,  Ann Marie Meyers ,  Suresh Shrauti ,  Guangying Zhang ,  Ajoy Zutshi

发明人： Bentley J. Palmer ,  Ann Marie Meyers ,  Suresh Shrauti ,  Guangying Zhang ,  Ajoy Zutshi

IPC分类号： H01L21/304

CPC分类号： H01L21/3212 ,  C09G1/02

摘要： A method using an associated composition for chemical mechanical planarization of a metal-containing substrate (e.g., a copper substrate) is described. This method affords low dishing and local erosion levels on the metal during CMP processing of the metal-containing substrate.

摘要翻译： 描述了使用用于含金属的衬底（例如，铜衬底）的化学机械平坦化的相关组合物的方法。 该方法在含金属衬底的CMP处理期间在金属上提供低的凹陷和局部侵蚀水平。

公开(公告)号：US06390891B1

公开(公告)日：2002-05-21

申请号：US09559905

申请日：2000-04-26

申请人： Sumit K. Guha ,  Guangying Zhang

发明人： Sumit K. Guha ,  Guangying Zhang

IPC分类号： B24B100

CPC分类号： B24B37/26 ,  B24B37/042 ,  B24B57/02 ,  Y10S451/921

摘要： A single-layer polishing pad is grooved in a pattern having relatively large turn radius bends (i.e., greater than the 90° bends of conventional rectangular grid grooving) to improve stability. The large radius bends allow slurry to be more easily and uniformly distributed across the surface of the polishing pad than conventional rectangular grooving. This improvement in slurry distribution tends to improve RR uniformity and WIWNU. In one embodiment, the polishing pad is grooved in a hexagonal pattern, which produces a grooving pattern with 120° bends. The grooves do not penetrate all of the way through the upper layer, thereby maintaining the “stiffness” of the polishing pad, which tends to improve planarization. When used in conjunction with standard pad conditioning techniques, polishing pads with groove patterns having large radius bends has yielded startling and unexpected improvement in stability. The improved fluid distribution provided by the groove pattern is believed to allow the pad conditioning process to clean the polishing pad of residual slurry, polishing debris and polishing by-products more thoroughly than polishing pads with conventional rectangular groove patterns.

摘要翻译： 单层抛光垫以具有相对大的转弯半径弯曲（即，大于常规矩形网格槽的90°弯曲）的图案开槽，以提高稳定性。 大的半径弯曲使得浆料比传统的矩形槽更容易和均匀地分布在抛光垫的表面上。 这种浆料分布的改善倾向于改善RR均匀性和WIWNU。 在一个实施例中，抛光垫以六边形图案开槽，其产生具有120°弯曲的切槽图案。 沟槽不穿透上层，从而保持抛光垫的“刚度”，这倾向于改善平面化。 当与标准焊盘调节技术结合使用时，具有大半径弯曲的凹槽图案的抛光垫已经产生了令人惊奇的惊人的稳定性的改善。 认为通过凹槽图案提供的改进的流体分布被认为允许垫调节过程比具有常规矩形凹槽图案的抛光垫更彻底地清洁残留浆料的抛光垫，抛光碎片和抛光副产物。