Abstract:
An anisotropic conductive adhesive composite and film include a binder and conductive particles dispersed in the binder. The conductive particles include a copper core particle and a metal coating layer coated on a surface of the corresponding copper core particle.
Abstract:
An anisotropic conductive film composition includes a polymer resin, a first epoxy resin including at least one of a bisphenol epoxy resin, a novolac epoxy resin, a glycidyl epoxy resin, an aliphatic epoxy resin, and an alicyclic epoxy resin, a second epoxy resin including an acetal epoxy resin, an epoxy resin curing agent, and conductive particles.
Abstract:
An anisotropic conductive adhesive composite and film includes a binder and conductive particles dispersed in the binder. The conductive particles include a copper core particle and a metal coating layer coated on a surface of the corresponding copper core particle.
Abstract:
An anisotropic conductive film composition includes a polymer resin, a first epoxy resin including at least one of a bisphenol epoxy resin, a novolac epoxy resin, a glycidyl epoxy resin, an aliphatic epoxy resin, and an alicyclic epoxy resin, a second epoxy resin including an acetal epoxy resin, an epoxy resin curing agent, and conductive particles.
Abstract:
An apparatus for processing options of electronic equipment models and a method therefor, and more particularly, an apparatus for controlling optional functions of electronic equipment models, in which various functions are executed by the same hardware circuit structure for each model, and a method therefor are provided. According to the present invention, it is possible to improve productivity by using one standardized hardware circuit, thus selectively realizing various optional functions and to singularizing the number of the PCBs needed to perform the optional functions, thus preventing a specification accident in which the optional function is changed by mistake during production.