公开(公告)号：US11647583B2

公开(公告)日：2023-05-09

申请号：US16095120

申请日：2017-04-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shimpei Obata ,  Ryuuji Takahashi ,  Yasunori Hoshino ,  Shigetoshi Fujita

IPC: H05K1/03 ,  B32B15/08 ,  B32B5/28 ,  C08J5/10 ,  C08J5/24 ,  H01L23/498 ,  H05K1/02

CPC classification number: H05K1/0373 ,  B32B5/28 ,  B32B15/08 ,  C08J5/10 ,  C08J5/244 ,  H01L23/49894 ,  H05K1/0271 ,  H05K1/03 ,  H05K1/0366 ,  B32B2262/101 ,  B32B2457/08 ,  C08J2361/06 ,  C08J2361/08 ,  C08J2363/00 ,  C08J2379/08 ,  C08J2425/12 ,  C08J2433/00 ,  C08J2433/04 ,  C08J2433/12 ,  C08J2433/20 ,  C08J2461/06 ,  C08J2461/08 ,  C08J2463/00 ,  C08J2475/00 ,  C08J2479/08 ,  C08J2483/04 ,  H05K2201/0218 ,  H05K2201/0227

Abstract: A prepreg contains a base material containing a reinforcing fiber and a semi-cured product of a resin composition impregnated into the base material containing a reinforcing fiber. The prepreg after cured has a glass transition temperature (Tg) which is higher than or equal to 150° C. and lower than or equal to 220° C. The resin composition contains (A) a thermosetting resin and (B) at least one compound selected from a group consisting of core shell rubber and a polymer component having a weight average molecular weight of 100000 or more. An amount of the (B) component is higher than or equal to 30 parts by mass and lower than or equal to 100 parts by mass with respect to 100 parts by mass of the (A) component.

公开(公告)号：US20170232510A1

公开(公告)日：2017-08-17

申请号：US15501880

申请日：2015-08-21

Applicant: Dowa Electronics Materials Co., Ltd.

Inventor： Noriaki Nogami ,  Hiroshi Kamiga

IPC: B22F1/02 ,  C25D3/48 ,  C25D5/34 ,  C25D7/00 ,  H01L31/0224 ,  C23C18/16 ,  B05D3/02 ,  B05D1/26 ,  B05D7/00 ,  B22F1/00 ,  C23C18/44

CPC classification number: B22F1/025 ,  B05D1/26 ,  B05D3/0254 ,  B05D7/00 ,  B22F1/0014 ,  B22F1/0059 ,  B22F2301/10 ,  B22F2301/255 ,  B22F2302/45 ,  B22F2303/01 ,  B22F2304/10 ,  B22F2998/10 ,  B22F2999/00 ,  C09D11/037 ,  C09D11/52 ,  C22C1/0425 ,  C23C18/1635 ,  C23C18/1637 ,  C23C18/1653 ,  C23C18/44 ,  C23C18/54 ,  C25D3/48 ,  C25D5/34 ,  C25D7/00 ,  H01L31/022425 ,  H01L31/068 ,  H05K1/095 ,  H05K3/4007 ,  H05K2201/0218 ,  Y02E10/547 ,  B22F9/082 ,  C22C5/00 ,  B22F9/24

Abstract: There is provided a silver-coated copper powder, which has excellent storage stability (reliability), and a method for producing the same. A silver-coated copper powder obtained by coating the surface of a copper powder, which is obtained by the atomizing method or the like, with 5 wt % or more (with respect to the silver-coated copper powder) of a silver containing layer of silver or a silver compound, is added to a gold plating solution, which is a potassium gold cyanide solution (to which at least one of tripotassium citrate monohydrate, anhydrous citric acid and L-aspartic acid is preferably added), to cause 0.01 wt % or more (with respect to the silver-coated copper powder) of gold to be supported on the surface of the copper powder coated with the silver containing layer.

公开(公告)号：US20160368105A1

公开(公告)日：2016-12-22

申请号：US15034194

申请日：2014-11-04

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Takahiro Hattori ,  Daisuke Soma ,  Takahiro Roppongi ,  Isamu Sato

IPC: B23K35/30 ,  C22C9/00 ,  C22C13/00 ,  B23K35/02 ,  B23K35/26

CPC classification number: B23K35/302 ,  B22F1/00 ,  B22F1/0048 ,  B22F1/025 ,  B23K35/0222 ,  B23K35/025 ,  B23K35/22 ,  B23K35/26 ,  B23K35/262 ,  C22C1/0483 ,  C22C9/00 ,  C22C13/00 ,  C23C28/021 ,  C25D3/60 ,  C25D7/00 ,  H01L23/556 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/11825 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/13311 ,  H01L2224/13347 ,  H01L2224/13411 ,  H01L2224/13455 ,  H01L2224/13457 ,  H01L2224/13561 ,  H01L2224/13611 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/81024 ,  H01L2224/81048 ,  H01L2224/81075 ,  H01L2224/81211 ,  H01L2224/81395 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/15311 ,  H01L2924/351 ,  H05K3/3463 ,  H05K2201/0218 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/0103 ,  H01L2924/01026 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01048 ,  H01L2924/01028 ,  H01L2924/01082 ,  H01L2924/01044 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01092 ,  H01L2924/0109 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/00012 ,  H01L2924/013

Abstract: Provided are a Cu core ball and a cu core column, which achieve dropping strength and strength against heat cycle. The Cu core ball (1) contains a Cu ball (2) made of Cu or a Cu alloy and a solder layer (3) which is made of a solder alloy composed of Sn and Cu and covers the Cu ball (2). The solder layer (3) contains not less than 0.1% through not more than 3.0% of Cu and the remainder is composed of Sn and impurities.

Abstract translation: 提供了一种Cu芯球和cu型核心柱，其实现了对热循环的降低强度和强度。 Cu芯球（1）包含由Cu或Cu合金制成的Cu球（2）和由Sn和Cu组成的焊料合金制成并覆盖Cu球（2）的焊料层（3）。 焊料层（3）含有不少于0.1％至不超过3.0％的Cu，其余由Sn和杂质构成。

公开(公告)号：US20160316554A1

公开(公告)日：2016-10-27

申请号：US15075064

申请日：2016-03-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： ARATA KISHI ,  TADASHI MAEDA ,  TADAHIKO SAKAI

IPC: H05K1/02 ,  B23K35/26 ,  H05K1/11 ,  B23K35/362 ,  H05K1/14 ,  B23K1/00 ,  B23K35/36

CPC classification number: H05K1/0274 ,  B23K1/0016 ,  B23K35/26 ,  B23K35/264 ,  B23K35/3613 ,  B23K35/362 ,  H01R12/714 ,  H05K1/09 ,  H05K1/092 ,  H05K1/097 ,  H05K1/11 ,  H05K1/111 ,  H05K1/14 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0108 ,  H05K2201/0133 ,  H05K2201/0218 ,  H05K2201/0326 ,  H05K2201/10136 ,  H05K2201/10909 ,  H05K2201/10916 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A connection structure of circuit members includes a first circuit member, a second circuit member, and a joint portion. The first circuit member has a first main surface on which a light-transparent electrode is provided. The second circuit member has a second main surface on which a metal electrode is provided. The joint portion is interposed between the first main surface and the second main surface. The joint portion includes a resin portion and a solder portion. The solder portion electrically connects the light-transparent electrode and the metal electrode. The light-transparent electrode contains an oxide that includes indium and tin, and the solder portion contains bismuth and indium.

Abstract translation: 电路构件的连接结构包括第一电路构件，第二电路构件和接头部分。 第一电路部件具有设置有透光性电极的第一主面。 第二电路部件具有设置有金属电极的第二主面。 接头部分介于第一主表面和第二主表面之间。 接头部分包括树脂部分和焊料部分。 焊料部分电连接透光电极和金属电极。 透光电极含有包含铟和锡的氧化物，焊料部分含有铋和铟。

公开(公告)号：US20160108266A1

公开(公告)日：2016-04-21

申请号：US14514463

申请日：2014-10-15

Applicant: Karen M. Kosydar ,  Gary L. Slater ,  Mary Christine Brick ,  Christine Joanne Landry-Coltrain ,  James Albert Reczek

Inventor： Karen M. Kosydar ,  Gary L. Slater ,  Mary Christine Brick ,  Christine Joanne Landry-Coltrain ,  James Albert Reczek

IPC: C09D11/38 ,  C09D133/14 ,  C09D179/04 ,  C09D179/08 ,  C09D179/02

CPC classification number: C09D11/38 ,  C08K9/02 ,  C09D4/00 ,  C09D11/037 ,  C09D11/10 ,  C09D11/101 ,  C09D11/52 ,  C09D133/14 ,  C09D179/02 ,  C09D179/04 ,  C09D179/08 ,  H05K1/095 ,  H05K3/185 ,  H05K2201/0218 ,  H05K2201/0323 ,  H05K2203/0709 ,  C08F222/10

Abstract: A non-aqueous composition contains dispersed carbon-coated metal particles in an organic diluent in an amount of at least 10 weight %. The dispersed carbon-coated metal particles have a median diameter equal to or less than 0.6 μm, and are dispersed using a particle dispersing agent that has a weight average molecular weight (Mw) of at least 2,000 and up to and including 100,000 and comprises nitrogen-containing units. The median diameter of the dispersed particles is determined using a dynamic light scattering method. Moreover, when the non-aqueous composition contains up to and including 25 weight % of the dispersed carbon-coated metal particles, it exhibits no visual settling when subjected to a settling test of at least 24 hours at 20° C. Such non-aqueous compositions can include photocurable components and are useful to prepare photocurable and photocured electrically-conductive patterns and layers in various articles, including touch screen devices having touch screen displays.

Abstract translation: 非水性组合物在有机稀释剂中含有至少10重量％的分散的碳涂覆的金属颗粒。 分散的碳涂覆的金属颗粒的中值直径等于或小于0.6μm，并且使用重均分子量（Mw）至少为2,000且至多并包括100,000的颗粒分散剂分散，并且包含氮 包含单位。 使用动态光散射法测定分散颗粒的中值粒径。 此外，当非水性组合物含有至多且包含25重量％的分散的碳涂覆的金属颗粒时，当在20℃进行至少24小时的沉降试验时，其表现出没有视觉沉降。这种非水性 组合物可以包括光固化组分，并且可用于制备各种制品中的光固化和光固化导电图案和层，包括具有触摸屏显示器的触摸屏装置。

公开(公告)号：US20160068964A1

公开(公告)日：2016-03-10

申请号：US14943861

申请日：2015-11-17

Applicant: BYD COMPANY LIMITED

Inventor： Qing GONG ,  Wei ZHOU ,  Weifeng MIAO

IPC: C23C18/16 ,  C23C18/38 ,  C23C18/28 ,  C09D11/03 ,  C08K3/22

CPC classification number: C23C18/1608 ,  B29C37/0025 ,  B29C2035/0838 ,  B29C2035/0872 ,  B29C2035/0877 ,  C01G19/006 ,  C01G19/02 ,  C01G30/002 ,  C01G31/00 ,  C01G39/00 ,  C01P2002/50 ,  C01P2002/52 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  C08K3/22 ,  C08K2003/2231 ,  C08K2003/2255 ,  C09D11/03 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/285 ,  C23C18/38 ,  H05K1/0373 ,  H05K3/107 ,  H05K3/185 ,  H05K2201/0215 ,  H05K2201/0218 ,  H05K2201/0236 ,  H05K2203/107

Abstract: Embodiments of the present disclosure are directed to a doped tin oxide. The doped tin oxide includes a tin oxide and at least one oxide of a doping element. The doping element includes at least one of vanadium and molybdenum. The doped tin oxide includes an amount of the tin oxide ranging from 90 mol % to 99 mol %, and an amount of the at least one oxide ranging from 1 mol % to 10 mol %.

Abstract translation: 本公开的实施方案涉及掺杂的氧化锡。 掺杂的氧化锡包括氧化锡和掺杂元素的至少一种氧化物。 掺杂元素包括钒和钼中的至少一种。 掺杂的氧化锡包括氧化锡的量为90mol％至99mol％，并且至少一种氧化物的量为1mol％至10mol％。

公开(公告)号：US09208931B2

公开(公告)日：2015-12-08

申请号：US12638360

申请日：2009-12-15

Applicant: Lex Kosowsky ,  Robert Fleming ,  Junjun Wu ,  Pragnya Saraf ,  Thangamani Ranganathan

Inventor： Lex Kosowsky ,  Robert Fleming ,  Junjun Wu ,  Pragnya Saraf ,  Thangamani Ranganathan

IPC: H01B1/22 ,  H01C7/108 ,  H01B1/20 ,  H01B1/24 ,  H05K1/02 ,  H05K1/03

CPC classification number: H01C7/108 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K2201/0218 ,  H05K2201/0738 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: A composition of voltage switchable dielectric (VSD) material that comprises a concentration of core shelled particles that individually comprise a conductor core and a conductor shell, so as to form a conductor-on-conductor core shell particle constituent for the VSD material.

Abstract translation: 可变压电介质（VSD）材料的组合物，其包含单独包含导体芯和导体壳的芯壳颗粒的浓度，以形成用于VSD材料的导体导体芯壳颗粒成分。

公开(公告)号：US20150107765A1

公开(公告)日：2015-04-23

申请号：US14512535

申请日：2014-10-13

Applicant: SunRay Scientific LLC

Inventor： S. Kumar Khanna

IPC: C09J9/02 ,  H05K3/30 ,  H05K13/04 ,  C09J9/00

CPC classification number: C09J9/02 ,  C08K9/02 ,  C08K2201/001 ,  C08K2201/01 ,  C09J9/00 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/29562 ,  H01L2224/2957 ,  H01L2224/29639 ,  H01L2224/29644 ,  H01L2224/32013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/75253 ,  H01L2224/75265 ,  H01L2224/75266 ,  H01L2224/75734 ,  H01L2224/75735 ,  H01L2224/81193 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83874 ,  H01L2224/8393 ,  H01L2924/00014 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0323 ,  H05K2201/083 ,  H05K2203/104 ,  H01L2924/2064 ,  H01L2924/0665 ,  H01L2224/0401

Abstract: Illustrative embodiments of anisotropic conductive adhesive (ACA) and associated methods are disclosed. In one illustrative embodiment, the ACA may comprise a binder curable using UV light and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material. The electrically conducting material may form electrically conductive and isolated parallel paths when the ACA is cured using UV light after being subjected to a magnetic field.

Abstract translation: 公开了各向异性导电粘合剂（ACA）和相关方法的说明性实施方案。 在一个说明性实施方案中，ACA可以包括可使用UV光固化的粘合剂和悬浮在粘合剂中的多个颗粒。 多个颗粒中的每一个可以包括涂覆有导电材料层的铁磁材料。 当ACA在经受磁场后用UV光固化时，导电材料可以形成导电和隔离的平行路径。

公开(公告)号：US20150024120A1

公开(公告)日：2015-01-22

申请号：US14359958

申请日：2012-11-26

Applicant: SHOWA DENKO K.K.

Inventor： Hiroshi Uchida

IPC: H01B13/00 ,  C09D11/52

CPC classification number: H01B13/003 ,  C09D11/037 ,  C09D11/52 ,  C09D17/00 ,  H01B1/22 ,  H05K1/095 ,  H05K3/1283 ,  H05K2201/0218 ,  H05K2201/0257

Abstract: Provided are a conductive pattern forming method and a composition for forming a conductive pattern by photo irradiation or microwave heating, capable of increasing the conductivity of the conductive pattern. A conductive pattern is formed by preparing a composition for forming a conductive pattern comprising, copper particles each having a copper oxide thin film on the entirety or a part of the surface thereof, copper oxide particles, a reducing agent such as a polyhydric alcohol, a carboxylic acid, or a polyalkylene glycol, and a binder resin; forming a printed pattern having any selected shape on a substrate using this composition for forming a conductive pattern; and subjecting the printed pattern to photo irradiation or microwave heating to generate a sintered body of copper.

Abstract translation: 提供一种导电图案形成方法和通过光照射或微波加热形成导电图案的组合物，其能够增加导电图案的导电性。 通过制备形成导电图案的组合物形成导电图案，所述组合物包括在其整个或部分表面上各自具有氧化铜薄膜的铜颗粒，氧化铜颗粒，还原剂如多元醇， 羧酸或聚亚烷基二醇，和粘合剂树脂; 使用该用于形成导电图案的组合物在基板上形成具有任何选定形状的印刷图案; 并对印刷图案进行光照射或微波加热以产生铜烧结体。

公开(公告)号：US20140183733A1

公开(公告)日：2014-07-03

申请号：US14082339

申请日：2013-11-18

Applicant: Yong Cheol CHU ,  Hyun Kyu LEE ,  Jung Ug KWAK ,  Seung Jin LEE ,  Sang Ho JEON ,  Yong Sik CHOI

Inventor： Yong Cheol CHU ,  Hyun Kyu LEE ,  Jung Ug KWAK ,  Seung Jin LEE ,  Sang Ho JEON ,  Yong Sik CHOI

IPC: B23K35/02 ,  H01L23/34 ,  H01L23/00

CPC classification number: B23K35/0244 ,  B23K35/282 ,  B23K35/286 ,  B23K35/30 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/302 ,  B23K35/3033 ,  B23K2101/36 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13561 ,  H01L2224/13582 ,  H01L2224/13611 ,  H01L2224/13655 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/81447 ,  H01L2924/3656 ,  H05K3/3478 ,  H05K2201/0218 ,  H05K2203/041 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01012 ,  H01L2924/01013

Abstract: Disclosed is a metal core solder ball having improved heat conductivity, including a metal core having a diameter of 40˜600 μm, a first plating layer formed on the outer surface of the metal core, and a second plating layer formed on the outer surface of the first plating layer.

Abstract translation: 公开了一种具有改善导热性的金属芯焊球，包括直径为40〜600μm的金属芯，形成在金属芯的外表面上的第一镀层和形成在金属芯的外表面上的第二镀层 第一镀层。