METHOD AND APPARATUS FOR SURFACE PROCESSING OF A SUBSTRATE
    1.
    发明申请
    METHOD AND APPARATUS FOR SURFACE PROCESSING OF A SUBSTRATE 审中-公开
    基板表面处理的方法和装置

    公开(公告)号:US20110089022A1

    公开(公告)日:2011-04-21

    申请号:US12977430

    申请日:2010-12-23

    IPC分类号: C23C14/34 C23C14/46 C23C14/35

    CPC分类号: C23C14/044 C23C14/221

    摘要: Method and apparatus for processing a substrate with a beam of energetic particles. The beam is directed from a source through a rectangular aperture in a shield positioned between the source and substrate to a treatment zone in a plane of substrate movement. Features on the substrate are aligned parallel to a major dimension of the rectangular aperture and the substrate is moved orthogonally to the aperture's major dimension. The beam impinges the substrate through the aperture during movement. The substrate may be periodically rotated by approximately 180° to reorient the features relative to the major dimension of the rectangular aperture. The resulting treatment profile is symmetrical about the sides of the features oriented toward the major dimension of the rectangular aperture.

    摘要翻译: 用高能粒子束处理衬底的方法和装置。 光束从源极通过定位在源极和衬底之间的屏蔽件中的矩形孔引导到衬底移动平面中的处理区域。 衬底上的特征与矩形孔的主要尺寸平行排列,并且衬底与孔的主要尺寸正交地移动。 光束在运动过程中通过光圈撞击基板。 衬底可以周期性地旋转大约180°以重新定向相对于矩形孔的主要尺寸的特征。 所得到的处理轮廓关于朝向矩形孔的主要尺寸的特征的侧面对称。

    Method and apparatus for surface processing of a substrate
    2.
    发明授权
    Method and apparatus for surface processing of a substrate 有权
    用于表面处理基板的方法和装置

    公开(公告)号:US07879201B2

    公开(公告)日:2011-02-01

    申请号:US10915745

    申请日:2004-08-11

    CPC分类号: C23C14/044 C23C14/221

    摘要: Method and apparatus for processing a substrate with a beam of energetic particles. The beam is directed from a source through a rectangular aperture in a shield positioned between the source and substrate to a treatment zone in a plane of substrate movement. Features on the substrate are aligned parallel to a major dimension of the rectangular aperture and the substrate is moved orthogonally to the aperture's major dimension. The beam impinges the substrate through the aperture during movement. The substrate may be periodically rotated by approximately 180° to reorient the features relative to the major dimension of the rectangular aperture. The resulting treatment profile is symmetrical about the sides of the features oriented toward the major dimension of the rectangular aperture.

    摘要翻译: 用高能粒子束处理衬底的方法和装置。 光束从源极通过定位在源极和衬底之间的屏蔽件中的矩形孔引导到衬底移动平面中的处理区域。 衬底上的特征与矩形孔的主要尺寸平行排列,并且衬底与孔的主要尺寸正交地移动。 光束在运动过程中通过光圈撞击基板。 衬底可以周期性地旋转大约180°以重新定向相对于矩形孔的主要尺寸的特征。 所得到的处理轮廓关于朝向矩形孔的主要尺寸的特征的侧面对称。