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公开(公告)号：US06556418B2
公开(公告)日：2003-04-29
申请号：US09795098
申请日：2001-02-28
IPC分类号： H01G700
CPC分类号： G01L9/0073 , B81B2201/0264 , B81B2207/053 , B81C1/00158 , G01L9/0042
摘要： A micromechanical component placed on a substrate face includes at least one cell. A counter-electrode of a cell capacitor is placed under a cavity. The counter-electrode can be made from a first part of a lower conductive layer. An optionally circular membrane used as an electrode of the capacitor is placed above the cavity. The membrane is homogeneous, has a substantially uniform thickness, and can be part of an upper conductive layer preferably supported by a second part of the lower conductive layer. A caustic channel used to remove the sacrificial coating in order to form the cavity is laterally connected thereto. The channel has a vertical dimension equal to the vertical dimension of the cavity. A closure is adjacent to the channel and disposed outside the membrane. The component can be used as a pressure sensor, and can have several cells each adjacent to six other cells. A process for fabricating a micromechanical component is also provided.
摘要翻译： 放置在基板面上的微机械部件包括至少一个电池。 将电池电容器的对电极放置在空腔下方。 对电极可以由下导电层的第一部分制成。 用作电容器电极的可选圆形膜放置在空腔上方。 膜是均匀的，具有基本均匀的厚度，并且可以是优选由下导电层的第二部分支撑的上导电层的一部分。 用于去除牺牲涂层以形成空腔的苛性通道横向连接到其上。 通道的垂直尺寸等于腔体的垂直尺寸。 闭合件与通道相邻并且设置在膜外部。 该组件可用作压力传感器，并且可以具有几个相邻于六个其它单元的单元。 还提供了一种用于制造微机械部件的工艺。
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公开(公告)号：US06406933B1
公开(公告)日：2002-06-18
申请号：US09708295
申请日：2000-11-08
IPC分类号： H01L2100
CPC分类号： G01P15/0802 , G01L9/0042
摘要： Etching openings are provided in a membrane above an etched-out cavity, only at a distance of at most one tenth of the diameter of the member away from the edge of the cavity. For production, a poly layer is applied to a sacrificial layer composed of SiO2 and is provided with rows of etching holes, through which channels are etched out in the sacrificial layer. The poly layer is oxidized and is made smooth by means of a planarization layer. Etching holes are produced in the edge region of the membrane layer. The sacrificial layer is removed over the entire area of the cavity which is to be produced, with the etching medium propagating sufficiently quickly through the channels.
摘要翻译： 蚀刻开口设置在蚀刻出的空腔上方的膜上，仅在远离腔的边缘的构件直径的十分之一处。 为了制造，将多层施加到由SiO 2构成的牺牲层，并且设置有一排蚀刻孔，在牺牲层中蚀刻通道。 多层被氧化并通过平坦化层变得光滑。 在膜层的边缘区域产生蚀刻孔。 牺牲层在待生产的空腔的整个区域上移除，其中蚀刻介质通过通道足够快地传播。
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公开(公告)号：US06346429B1
公开(公告)日：2002-02-12
申请号：US09648938
申请日：2000-08-28
IPC分类号： H01L2700
CPC分类号： H01L27/0617 , B81B2201/0292 , B81C1/00246 , B81C2203/0735
摘要： An integrated sensor is fabricated by etching recesses or depressions into the top side of a semiconductor body and by fabricating sensor components in the recesses or depressions. The sensor components are lowered in the recesses or depressions by approximately half of their height. Electronic components are fabricated in the remaining regions of the top side of the semiconductor body. The remaining regions may be covered with a protective layer if the recesses or depressions are fabricated after the electronic components.
摘要翻译： 通过将凹陷或凹陷蚀刻到半导体本体的顶侧并通过在凹部或凹部中制造传感器部件来制造集成传感器。 传感器部件在凹部或凹部中降低其高度的大约一半。 在半导体本体的顶侧的其余区域中制造电子部件。 如果在电子部件之后制造凹陷或凹陷，则其余区域可以被保护层覆盖。
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公开(公告)号：US06401544B2
公开(公告)日：2002-06-11
申请号：US09794664
申请日：2001-02-27
申请人： Robert Aigner , Christofer Hierold , Hergen Kapels , Stefan Kolb , Dieter Maier-Schneider , Klaus-Günter Oppermann , Hans-Jörg Timme , Thomas Scheiter , Wolfgang Werner
发明人： Robert Aigner , Christofer Hierold , Hergen Kapels , Stefan Kolb , Dieter Maier-Schneider , Klaus-Günter Oppermann , Hans-Jörg Timme , Thomas Scheiter , Wolfgang Werner
IPC分类号： G01L900
CPC分类号： G01L9/0042 , B81B2201/0235 , B81B2201/0257 , B81B2201/0264 , B81C1/00896 , B81C2201/053 , H01L2924/0002 , H01L2924/00
摘要： A method is disclosed for producing a micromechanical component. The micromechanical component has sensor holes, wherein at least one component protective layer and/or a spacer coating is applied on the component before separating the wafer into chips. The component protective layer sealingly covers at least the walls of the holes extending parallel to the surface of the wafer and perpendicular to the surface of the wafer and the spacer coating sealingly covers at least the walls of the holes extending parallel to the surface of the wafer.
摘要翻译： 公开了一种用于制造微机械部件的方法。 微机械部件具有传感器孔，其中在将晶片分成芯片之前，在部件上施加至少一个部件保护层和/或间隔涂层。 部件保护层至少密封地覆盖平行于晶片表面延伸的垂直于晶片表面的孔的壁，间隔件涂层至少密封地覆盖平行于晶片表面延伸的孔的壁 。
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公开(公告)号：US6094985A
公开(公告)日：2000-08-01
申请号：US308730
申请日：1999-05-24
申请人： Hergen Kapels , Christofer Hierold , Max Steger , Thomas Scheiter , Reinhold Noe , Ulrich Naher
发明人： Hergen Kapels , Christofer Hierold , Max Steger , Thomas Scheiter , Reinhold Noe , Ulrich Naher
CPC分类号： G01C19/5712
摘要： Rotation rate sensor as a micromechanical component in silicon, in which a ring with a rigid strut along a diameter is so suspended at elastic braces and anchoring arrangements on a substrate as to be able to perform rotation oscillations about its center axis and to be able to be tilted about the strut under the influence of outer torques. There are electrodes present at the ring and at the substrate, at which electrodes electrical voltages can be applied such that rotary oscillations of the ring about its center axis can be excited and rotary oscillations about the strut can be detected. To stabilize the position of the ring in the neutral position, additional electrodes can be provided at the ring and at the substrate for the generation of electrostatic forces.
摘要翻译： PCT No.PCT / DE97 / 02671 Sec。 371日期1999年5月24日 102（e）1999年5月24日PCT 1997年11月14日PCT PCT。 第WO98 / 23917号公报 日期1998年6月4日作为硅中的微机械部件的转速传感器，其中沿着直径的刚性支柱的环悬挂在基板上的弹性支架和锚定装置上，以便能够围绕其中心轴线执行旋转振荡 并且能够在外部扭矩的影响下围绕支柱倾斜。 存在于环和基板处的电极，电极可以施加电压，使得环绕其中心轴的旋转振荡可被激发，并且可以检测到围绕支柱的旋转振荡。 为了稳定环在中性位置的位置，可以在环和基板处设置附加电极以产生静电力。
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