Release film
    1.
    发明授权
    Release film 有权
    释放胶片

    公开(公告)号:US07407712B2

    公开(公告)日:2008-08-05

    申请号:US10549115

    申请日:2003-12-26

    IPC分类号: B32B27/36 C08L67/00

    摘要: It is an object of the present invention to provide a release film which is superior in the flexibility at high temperature, the conformability to circuit patterns, the heat resistance, the releasing property and the non-contaminative property, and easily discarded after use.The present invention relates to a release film, which is used in a manufacturing process of a printed-circuit board, a flexible printed-circuit board or a multilayer printed-circuit board, having a layer comprising a resin composition comprising a resin having a polar group in a main chain as a matrix and having a halogen content of 5% by weight or less on at least one surface.

    摘要翻译: 本发明的目的是提供一种在高温下的柔韧性,电路图案的一致性,耐热性,脱模性和非污染性方面优异的剥离膜,使用后容易丢弃。 本发明涉及一种脱模膜,其用于印刷电路板,柔性印刷电路板或多层印刷电路板的制造过程中,其具有包括树脂组合物的层,所述树脂组合物包含具有极性的树脂 在主链中作为基质,并且在至少一个表面上具有5重量%以下的卤素含量。

    Mold release film
    2.
    发明申请
    Mold release film 有权
    脱模膜

    公开(公告)号:US20060154095A1

    公开(公告)日:2006-07-13

    申请号:US10549115

    申请日:2003-12-26

    IPC分类号: B32B27/36 C08L67/00

    摘要: It is an object of the present invention to provide a release film which is superior in the flexibility at high temperature, the conformability to circuit patterns, the heat resistance, the releasing property and the non-contaminative property, and easily discarded after use. The present invention relates to a release film, which is used in a manufacturing process of a printed-circuit board, a flexible printed-circuit board or a multilayer printed-circuit board, having a layer comprising a resin composition comprising a resin having a polar group in a main chain as a matrix and having a halogen content of 5% by weight or less on at least one surface.

    摘要翻译: 本发明的目的是提供一种在高温下的柔韧性,电路图案的一致性,耐热性,脱模性和非污染性方面优异的剥离膜,使用后容易丢弃。 本发明涉及一种脱模膜,其用于印刷电路板,柔性印刷电路板或多层印刷电路板的制造过程中,其具有包括树脂组合物的层,所述树脂组合物包含具有极性的树脂 在主链中作为基质,并且在至少一个表面上具有5重量%以下的卤素含量。