公开(公告)号：US20130258339A1

公开(公告)日：2013-10-03

申请号：US13485224

申请日：2012-05-31

申请人： Wei-Hsiang TSENG ,  Chin-Hsiang LIN ,  Heng-Hsin LIU ,  Jui-Chun PENG ,  Ho-Ping CHEN

发明人： Wei-Hsiang TSENG ,  Chin-Hsiang LIN ,  Heng-Hsin LIU ,  Jui-Chun PENG ,  Ho-Ping CHEN

IPC分类号： G01B11/02

CPC分类号： G01B11/02 ,  G03F9/7011 ,  G03F9/7084 ,  H01L23/544 ,  H01L2924/0002 ,  H01L2924/00

摘要： A wafer alignment apparatus includes a light source, a light detection device, and a rotation device configured to rotate a wafer. The light source is configured to provide light directed to a backside of the wafer. The light detection device is configured to detect reflected light intensity from the backside of the wafer to find a position of at least one wafer alignment mark formed on the back side of the wafer.

摘要翻译： 晶片对准装置包括光源，光检测装置和被配置为旋转晶片的旋转装置。 光源被配置为提供指向晶片背面的光。 光检测装置被配置为从晶片的背面检测反射光强度，以找到形成在晶片的背面上的至少一个晶片对准标记的位置。

公开(公告)号：US08616539B2

公开(公告)日：2013-12-31

申请号：US13328254

申请日：2011-12-16

申请人： Wei-Hsiang Tseng ,  Jui-Chun Peng ,  Kai-Fa Ho ,  Ho-Ping Chen ,  Chia-Yun Lee

发明人： Wei-Hsiang Tseng ,  Jui-Chun Peng ,  Kai-Fa Ho ,  Ho-Ping Chen ,  Chia-Yun Lee

IPC分类号： B25B11/00

CPC分类号： H01L21/6838

摘要： The present disclosure relates to a wafer chuck configured to provide a uniform photoresist layer on a workpiece. In some embodiments, the wafer chuck comprises a plurality of vacuum holes. The plurality of vacuum holes (i.e., more than one) are in fluid communication with a cavity that continuously extends along the top surface between the vacuum holes. A vacuum source, connected to each vacuum hole, is configured to remove gas molecules from the cavity located below the workpiece leaving behind a low pressure vacuum. The use of a plurality of vacuum holes increase the uniformity of the vacuum, thereby preventing the formation of high vacuum areas in close proximity to any specific vacuum hole. The reduction of high vacuum areas reduces wafer bending associated with the high vacuum areas.

摘要翻译： 本公开涉及一种配置成在工件上提供均匀光致抗蚀剂层的晶片卡盘。 在一些实施例中，晶片卡盘包括多个真空孔。 多个真空孔（即多于一个）与沿着真空孔之间的顶表面连续延伸的空腔流体连通。 连接到每个真空孔的真空源构造成从位于工件下方的空腔去除气体分子，留下低压真空。 使用多个真空孔增加真空的均匀性，从而防止在任何特定的真空孔附近形成高真空区域。 高真空区域的减少减少了与高真空区域相关联的晶片弯曲。

公开(公告)号：US20130156947A1

公开(公告)日：2013-06-20

申请号：US13328254

申请日：2011-12-16

申请人： Wei-Hsiang Tseng ,  Jui-Chun Peng ,  Kai-Fa Ho ,  Ho-Ping Chen ,  Chia-Yun Lee

发明人： Wei-Hsiang Tseng ,  Jui-Chun Peng ,  Kai-Fa Ho ,  Ho-Ping Chen ,  Chia-Yun Lee

IPC分类号： H01L21/683 ,  B05D3/12

CPC分类号： H01L21/6838

摘要： The present disclosure relates to a wafer chuck configured to provide a uniform photoresist layer on a workpiece. In some embodiments, the wafer chuck comprises a plurality of vacuum holes. The plurality of vacuum holes (i.e., more than one) are in fluid communication with a cavity that continuously extends along the top surface between the vacuum holes. A vacuum source, connected to each vacuum hole, is configured to remove gas molecules from the cavity located below the workpiece leaving behind a low pressure vacuum. The use of a plurality of vacuum holes increase the uniformity of the vacuum, thereby preventing the formation of high vacuum areas in close proximity to any specific vacuum hole. The reduction of high vacuum areas reduces wafer bending associated with the high vacuum areas.

摘要翻译： 本公开涉及一种配置成在工件上提供均匀光致抗蚀剂层的晶片卡盘。 在一些实施例中，晶片卡盘包括多个真空孔。 多个真空孔（即多于一个）与沿着真空孔之间的顶表面连续延伸的空腔流体连通。 连接到每个真空孔的真空源构造成从位于工件下方的空腔去除气体分子，留下低压真空。 使用多个真空孔增加真空的均匀性，从而防止在任何特定的真空孔附近形成高真空区域。 高真空区域的减少减少了与高真空区域相关联的晶片弯曲。