公开(公告)号：US07304276B2

公开(公告)日：2007-12-04

申请号：US09681891

申请日：2001-06-21

Applicant: Hongy Lin ,  Thomas M. Laskowski ,  Louis P. Steinhauser

Inventor： Hongy Lin ,  Thomas M. Laskowski ,  Louis P. Steinhauser

IPC: H05B3/22

CPC classification number: H05B3/146 ,  H05B3/22 ,  H05B2203/013 ,  H05B2203/017 ,  Y10T29/49099

Abstract: A thick film heater is shown wherein the thick film resistive circuit, as the heating element, is applied directly to a target object to be heated for very low temperature applications. The thick film used is polymer-based (preferably epoxy). The thick film resistive circuit is applied using conventional means. However, it is cured at higher temperatures and longer cycles than conventional thick film circuits, and preferably in multiple stages.

Abstract translation: 示出了一种厚膜加热器，其中作为加热元件的厚膜电阻电路直接施加到待加热的目标物体用于非常低温的应用。 使用的厚膜是基于聚合物的（优选环氧树脂）。 厚膜电阻电路采用常规手段应用。 然而，它在比常规厚膜电路更高的温度和更长的循环下固化，并且优选在多个阶段中固化。

公开(公告)号：US20100154203A1

公开(公告)日：2010-06-24

申请号：US12715141

申请日：2010-03-01

Applicant: Hongy Lin ,  Thomas M. Laskowski ,  Jason E. Smith

Inventor： Hongy Lin ,  Thomas M. Laskowski ,  Jason E. Smith

IPC: H01C17/28

CPC classification number: H05B3/283 ,  H01R43/02 ,  H01R43/0263 ,  H05B3/265 ,  H05B2203/003 ,  H05B2203/013 ,  H05B2203/016 ,  Y10T29/49098 ,  Y10T29/49101

Abstract: A method of securing a terminal to a ceramic heater is provided by the present disclosure. The ceramic heater includes a ceramic substrate and a resistive heating element, and the method includes exposing a portion of the resistive heating element, forming an intermediate layer on at least one of the portion of the resistive heating element and the ceramic substrate proximate the portion of the resistive heating element, the intermediate layer being selected from a group consisting of Mo/AlN and W/AlN, and bonding the terminal to the intermediate layer.

Abstract translation: 通过本公开提供了将端子固定到陶瓷加热器的方法。 陶瓷加热器包括陶瓷基片和电阻加热元件，该方法包括将电阻加热元件的一部分暴露在电阻加热元件的部分和陶瓷基片的至少一部分上， 所述电阻加热元件，所述中间层选自由Mo / AlN和W / AlN组成的组，并将所述端子键合到所述中间层。

公开(公告)号：US08242416B2

公开(公告)日：2012-08-14

申请号：US12715141

申请日：2010-03-01

Applicant: Hongy Lin ,  Thomas Laskowski ,  Jason E. Smith

Inventor： Hongy Lin ,  Thomas Laskowski ,  Jason E. Smith

IPC: H05B3/68 ,  H05B3/08 ,  H01C17/28

CPC classification number: H05B3/283 ,  H01R43/02 ,  H01R43/0263 ,  H05B3/265 ,  H05B2203/003 ,  H05B2203/013 ,  H05B2203/016 ,  Y10T29/49098 ,  Y10T29/49101

Abstract: A method of securing a terminal to a ceramic heater is provided by the present disclosure. The ceramic heater includes a ceramic substrate and a resistive heating element, and the method includes exposing a portion of the resistive heating element, forming an intermediate layer on at least one of the portion of the resistive heating element and the ceramic substrate proximate the portion of the resistive heating element, the intermediate layer being selected from a group consisting of Mo/AlN and W/AlN, and bonding the terminal to the intermediate layer.

Abstract translation: 通过本公开提供了将端子固定到陶瓷加热器的方法。 陶瓷加热器包括陶瓷基片和电阻加热元件，该方法包括将电阻加热元件的一部分暴露在电阻加热元件的部分和陶瓷基片的至少一部分上， 所述电阻加热元件，所述中间层选自由Mo / AlN和W / AlN组成的组，并将所述端子键合到所述中间层。

公开(公告)号：US07832616B2

公开(公告)日：2010-11-16

申请号：US11970541

申请日：2008-01-08

Applicant: Hongy Lin ,  Jason E. Smith ,  Daniel J. Block

Inventor： Hongy Lin ,  Jason E. Smith ,  Daniel J. Block

IPC: B23K31/02

CPC classification number: H05B3/143 ,  H05B3/265

Abstract: Methods of securing a thermocouple to a ceramic substrate are provided. The thermocouple includes a pair of wires that define a junction, and the method comprises directly bonding the junction of the thermocouple to the ceramic substrate. In one form, the junction is directly bonded using an active brazing material.

Abstract translation: 提供了将热电偶固定在陶瓷基板上的方法。 热电偶包括限定结的一对导线，并且该方法包括将热电偶的接合部直接结合到陶瓷基板。 在一种形式中，使用活性钎焊材料直接接合结。

公开(公告)号：US07696455B2

公开(公告)日：2010-04-13

申请号：US11416836

申请日：2006-05-03

Applicant: Hongy Lin ,  Thomas M. Laskowski ,  Jason E. Smith

Inventor： Hongy Lin ,  Thomas M. Laskowski ,  Jason E. Smith

IPC: H05B3/68 ,  H05B3/08

CPC classification number: H05B3/283 ,  H01R43/02 ,  H01R43/0263 ,  H05B3/265 ,  H05B2203/003 ,  H05B2203/013 ,  H05B2203/016 ,  Y10T29/49098 ,  Y10T29/49101

Abstract: A ceramic heater is provided that includes a power terminal for connecting a resistive heating element to a power source. An intermediate layer is disposed on an AlN ceramic substrate proximate the resistive heating element. The power terminal is bonded to the intermediate layer by an active brazing material. The intermediate layer is formed of Mo/AlN or W/AlN and has a coefficient of thermal expansion between that of the active brazing material and that of the AlN ceramic substrate so that thermal stress generated in the ceramic substrate can be reduced.

Abstract translation: 提供陶瓷加热器，其包括用于将电阻加热元件连接到电源的电源端子。 在靠近电阻加热元件的AlN陶瓷基片上设置中间层。 电源端子通过活性钎焊材料结合到中间层。 中间层由Mo / AlN或W / AlN形成，并且具有活性钎焊材料与AlN陶瓷基板的热膨胀系数之间的热膨胀系数，从而能够降低在陶瓷基板中产生的热应力。

公开(公告)号：US06986865B2

公开(公告)日：2006-01-17

申请号：US10192803

申请日：2002-07-10

Applicant: Hongy Lin ,  Jason Eugene Smith ,  Thomas Michael Laskowski

Inventor： Hongy Lin ,  Jason Eugene Smith ,  Thomas Michael Laskowski

IPC: C04B33/32

CPC classification number: C04B35/645 ,  B32B2315/02 ,  C04B35/117 ,  C04B2235/3886 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/604 ,  C04B2235/658 ,  C04B2235/77 ,  C04B2235/94 ,  C04B2237/343

Abstract: A method for manufacturing an electrostatic chuck is disclosed wherein a sintered ceramic body having a dielectric layer made from Alumina (Al2O2) and Titanium Nitride (TiN) having a specific range of particle size is heat treated in an oxygen-rich environment in order to produce a uniform dielectric layer having no pores or micro-cracks.

Abstract translation: 公开了一种用于制造静电卡盘的方法，其中在富氧环境中对具有特定粒度范围的氧化铝（Al 2 O 2）和氮化钛（TiN）制成的电介质层的烧结陶瓷体进行热处理，以便产生 没有孔或微裂纹的均匀介电层。

公开(公告)号：US20080110963A1

公开(公告)日：2008-05-15

申请号：US11970541

申请日：2008-01-08

Applicant: Hongy Lin ,  Jason Smith ,  Daniel Block

Inventor： Hongy Lin ,  Jason Smith ,  Daniel Block

IPC: B23K31/02 ,  B23K1/00

CPC classification number: H05B3/143 ,  H05B3/265

Abstract: Methods of securing a thermocouple to a ceramic substrate are provided. The thermocouple includes a pair of wires that define a junction, and the method comprises directly bonding the junction of the thermocouple to the ceramic substrate. In one form, the junction is directly bonded using an active brazing material.

Abstract translation: 提供了将热电偶固定在陶瓷基板上的方法。 热电偶包括限定结的一对导线，并且该方法包括将热电偶的接合部直接结合到陶瓷基板。 在一种形式中，使用活性钎焊材料直接接合结。

公开(公告)号：US20070251938A1

公开(公告)日：2007-11-01

申请号：US11411579

申请日：2006-04-26

Applicant: Hongy Lin ,  Jason Smith ,  Daniel Block

Inventor： Hongy Lin ,  Jason Smith ,  Daniel Block

IPC: H05B3/68

CPC classification number: H05B3/143 ,  H05B3/265

Abstract: A ceramic heater is provided that includes a thermocouple having a hot or measuring junction in a form of a bead directly bonded to a ceramic substrate by an active brazing material. Alternatively, a metallized layer is provided on the ceramic substrate and the bead of the thermocouple is directly bonded to the metallized layer by an ordinary brazing material. Due to the direct bonding of the bead to a ceramic substrate, the temperature of the bead reflects the temperature of the ceramic heater almost instantaneously so that the thermocouple can more accurately measure the temperature of the ceramic heater.

Abstract translation: 提供了一种陶瓷加热器，其包括热电偶，其具有通过活性钎焊材料直接结合到陶瓷基底的珠形式的热或测量接头。 或者，在陶瓷基板上设置金属化层，并且通过普通钎焊材料将热电偶的珠粒直接结合到金属化层。 由于珠子与陶瓷基板的直接接合，珠的温度几乎瞬间反映陶瓷加热器的温度，使得热电偶能够更准确地测量陶瓷加热器的温度。

公开(公告)号：US07126092B2

公开(公告)日：2006-10-24

申请号：US11035258

申请日：2005-01-13

Applicant: Hongy Lin ,  Yun Wang

Inventor： Hongy Lin ,  Yun Wang

IPC: H05B3/68 ,  C23C16/00

CPC classification number: H01L21/67109 ,  H01L21/67103

Abstract: A heater for wafer processing, such as thin film deposition, includes a first heating unit and a second heating unit. The first heating unit includes a substrate with a top surface for supporting a wafer thereon and a back surface. The second heating unit is disposed proximate the back surface of the substrate and is preferably disposed inside an inner space of a shaft supporting the first heating unit in a processing chamber. The first heating unit and the second heating unit are independently controlled. The second heating unit is designed based on the actual temperature profile and heat loss on the top surface. Therefore, the second heating unit can more effectively compensate the heat loss to achieve a more uniform temperature profile on the top surface.

Abstract translation: 用于晶片加工的加热器，例如薄膜沉积，包括第一加热单元和第二加热单元。 第一加热单元包括具有用于在其上支撑晶片的顶表面和背面的基板。 第二加热单元设置在基板的后表面附近，并且优选地设置在处理室中支撑第一加热单元的轴的内部空间内。 第一加热单元和第二加热单元是独立控制的。 第二个加热单元是根据实际的温度曲线和顶部表面的热损失进行设计的。 因此，第二加热单元可以更有效地补偿热损失，以在顶表面上实现更均匀的温度分布。

公开(公告)号：US20050274714A1

公开(公告)日：2005-12-15

申请号：US10867108

申请日：2004-06-14

Applicant: Hongy Lin

Inventor： Hongy Lin

IPC: C23C4/16 ,  C23C14/18 ,  C23C16/06 ,  H01L21/00 ,  H05B3/16 ,  H05B3/26 ,  H05B3/28 ,  H05B3/78 ,  F24H1/10

CPC classification number: C23C16/06 ,  C23C14/18 ,  H01L21/67098 ,  H05B2203/003

Abstract: An in-line heater for use in semiconductor wet chemical processing comprises a single crystal alumina substrate, a resistive heating element disposed on the single crystal alumina substrate, and a protective layer disposed over the resistive heating element. The single crystal alumina substrate has a moderate coefficient of thermal expansion (CTE) that is substantially equivalent to the CTEs of the resistive heating element and the protective layer. Therefore, cracking between the substrate and the protective layer can be minimized. The in-line heater in accordance with this invention exhibits an excellent corrosion-resistance capability even at high temperature and can carry a wide variety of corrosive chemicals including hydrofluoride solution.

Abstract translation: 用于半导体湿化学处理的在线加热器包括单晶氧化铝基板，设置在单晶氧化铝基板上的电阻加热元件和设置在电阻加热元件上的保护层。 单晶氧化铝基板具有基本上等于电阻加热元件和保护层的CTE的中等热膨胀系数（CTE）。 因此，可以使基板和保护层之间的裂纹最小化。 根据本发明的在线加热器即使在高温下表现出优异的耐腐蚀性能，并且可以携带各种各样的腐蚀性化学品，包括氢氟酸溶液。