CMOS semiconductor device and method of fabricating the same
    2.
    发明授权
    CMOS semiconductor device and method of fabricating the same 有权
    CMOS半导体器件及其制造方法

    公开(公告)号:US07919820B2

    公开(公告)日:2011-04-05

    申请号:US12007433

    申请日:2008-01-10

    IPC分类号: H01L29/00

    摘要: Example embodiments provide a complementary metal-oxide semiconductor (CMOS) semiconductor device and a method of fabricating the CMOS semiconductor device. The CMOS semiconductor device may include gates in the nMOS and pMOS areas, polycrystalline silicon (poly-Si) capping layers, metal nitride layers underneath the poly-Si capping layers, and a gate insulating layer underneath the gate. The metal nitride layers of the nMOS and pMOS areas may be formed of the same type of material and may have different work functions. Since a metal gate is formed of identical types of metal nitride layers, a process may be simplified, yield may be increased, and a higher-performance CMOS semiconductor device may be obtained.

    摘要翻译: 示例性实施例提供互补金属氧化物半导体(CMOS)半导体器件和制造CMOS半导体器件的方法。 CMOS半导体器件可以包括nMOS和pMOS区域中的栅极,多晶硅(多晶硅)覆盖层,多晶硅覆盖层下面的金属氮化物层以及栅极下方的栅极绝缘层。 nMOS和pMOS区域的金属氮化物层可以由相同类型的材料形成,并且可以具有不同的功函数。 由于金属栅极由相同类型的金属氮化物层形成,所以可以简化工艺,可以提高产率,并且可以获得更高性能的CMOS半导体器件。

    Transistors with Multilayered Dielectric Films and Methods of Manufacturing Such Transistors
    4.
    发明申请
    Transistors with Multilayered Dielectric Films and Methods of Manufacturing Such Transistors 有权
    具有多层介质膜的晶体管及其制造方法

    公开(公告)号:US20100025781A1

    公开(公告)日:2010-02-04

    申请号:US12574912

    申请日:2009-10-07

    IPC分类号: H01L29/78 H01L21/31

    摘要: Transistors that include multilayered dielectric films on a channel region are provided. The multilayered dielectric comprises a lower dielectric film that may have a thickness that is at least 50% the thickness of the multilayered dielectric film and that comprises a metal oxide, a metal silicate, an aluminate, or a mixture thereof, and an upper dielectric film on the lower dielectric film, the upper dielectric film comprising a Group III metal oxide, Group III metal nitride, Group XIII metal oxide or Group XIII metal nitride. A gate electrode is provided on the multilayered dielectric film.

    摘要翻译: 提供了在通道区​​域上包括多层电介质膜的晶体管。 多层电介质包括下电介质膜,该电介质膜的厚度至少为多层电介质膜的厚度的50%,并且包括金属氧化物,金属硅酸盐,铝酸盐或其混合物,以及上电介质膜 在下介电膜上,上电介质膜包含III族金属氧化物,III族金属氮化物,第ⅩⅢ族金属氧化物或第ⅩⅢ族金属氮化物。 在多层电介质膜上设置栅电极。

    Transistors with multilayered dielectric films
    5.
    发明授权
    Transistors with multilayered dielectric films 有权
    具有多层介电膜的晶体管

    公开(公告)号:US07615830B2

    公开(公告)日:2009-11-10

    申请号:US11252514

    申请日:2005-10-18

    IPC分类号: H01L21/8238

    摘要: Transistors that include multilayered dielectric films on a channel region are provided. The multilayered dielectric comprises a lower dielectric film that may have a thickness that is at least 50% the thickness of the multilayered dielectric film and that comprises a metal oxide, a metal silicate, an aluminate, or a mixture thereof, and an upper dielectric film on the lower dielectric film, the upper dielectric film comprising a Group III metal oxide, Group III metal nitride, Group XIII metal oxide or Group XIII metal nitride. A gate electrode is provided on the multilayered dielectric film.

    摘要翻译: 提供了在通道区​​域上包括多层电介质膜的晶体管。 多层电介质包括下电介质膜,该电介质膜的厚度至少为多层电介质膜的厚度的50%,并且包括金属氧化物,金属硅酸盐,铝酸盐或其混合物,以及上电介质膜 在下介电膜上,上电介质膜包含III族金属氧化物,III族金属氮化物,第ⅩⅢ族金属氧化物或第ⅩⅢ族金属氮化物。 在多层电介质膜上设置栅电极。

    Semiconductor devices having nitrogen-incorporated active region and methods of fabricating the same
    6.
    发明授权
    Semiconductor devices having nitrogen-incorporated active region and methods of fabricating the same 有权
    具有氮结合有源区的半导体器件及其制造方法

    公开(公告)号:US07547951B2

    公开(公告)日:2009-06-16

    申请号:US11396702

    申请日:2006-04-04

    IPC分类号: H01L29/78

    摘要: A semiconductor device may include a semiconductor substrate having a first region and a second region. The nitrogen-incorporated active region may be formed within the first region. A first gate electrode may be formed on the nitrogen-incorporated active region. A first gate dielectric layer may be interposed between the nitrogen-incorporated active region and the first gate electrode. The first gate dielectric layer may include a first dielectric layer and a second dielectric layer. The second dielectric layer may be a nitrogen contained dielectric layer. A second gate electrode may be formed on the second region. A second gate dielectric layer may be interposed between the second region and the second gate electrode. The first gate dielectric layer may have the same or substantially the same thickness as the second gate dielectric layer, and the nitrogen contained dielectric layer may contact with the nitrogen-incorporated active region.

    摘要翻译: 半导体器件可以包括具有第一区域和第二区域的半导体衬底。 可以在第一区域内形成含氮的有源区。 可以在引入氮的有源区上形成第一栅电极。 第一栅极电介质层可插入在引入氮的有源区和第一栅电极之间。 第一栅介质层可以包括第一介电层和第二介电层。 第二电介质层可以是含氮介电层。 第二栅极电极可以形成在第二区域上。 可以在第二区域和第二栅电极之间插入第二栅极电介质层。 第一栅极介电层可以具有与第二栅极介电层相同或基本相同的厚度,并且含氮介电层可以与引入氮的有源区接触。

    SEMICONDUCTOR DEVICE HAVING A PLURALITY OF METAL LAYERS DEPOSITED THEREON
    7.
    发明申请
    SEMICONDUCTOR DEVICE HAVING A PLURALITY OF METAL LAYERS DEPOSITED THEREON 审中-公开
    具有多孔金属层的半导体器件

    公开(公告)号:US20070178681A1

    公开(公告)日:2007-08-02

    申请号:US11621589

    申请日:2007-01-10

    IPC分类号: H01L21/20

    摘要: A semiconductor device has a plurality of stacked metal layers. The semiconductor device includes a substrate, a gate oxide layer deposited on the substrate and formed from a high-k dielectric material, a first metal layer deposited on the gate oxide layer and formed from a nitride of a metal of the high-k dielectric material of the gate oxide layer, a second metal layer deposited on the first metal layer, a third metal layer deposited on the second metal layer, and a material layer deposited on the third metal layer, wherein the material layer taken together with the first, second and third metal layers forms a gate electrode. Because any chemical reaction between the gate oxide layer and the metal layer can be controlled, deterioration of the capacitance equivalent oxide thickness) and leakage of current are prevented, and a semiconductor device having improved insulation can be provided.

    摘要翻译: 半导体器件具有多个堆叠的金属层。 半导体器件包括衬底,沉积在衬底上并由高k电介质材料形成的栅极氧化物层,沉积在栅极氧化物层上并由高k电介质材料的金属的氮化物形成的第一金属层 栅极氧化物层,沉积在第一金属层上的第二金属层,沉积在第二金属层上的第三金属层和沉积在第三金属层上的材料层,其中材料层与第一,第二金属层 并且第三金属层形成栅电极。 由于可以控制栅氧化层和金属层之间的任何化学反应,所以可以防止电容当量氧化物厚度的劣化)和电流泄漏,并且可以提供绝缘性提高的半导体器件。

    Method of fabricating gate of semiconductor device using oxygen-free ashing process
    8.
    发明申请
    Method of fabricating gate of semiconductor device using oxygen-free ashing process 审中-公开
    使用无氧灰化工艺制造半导体器件栅极的方法

    公开(公告)号:US20070178637A1

    公开(公告)日:2007-08-02

    申请号:US11699784

    申请日:2007-01-30

    IPC分类号: H01L21/8238

    摘要: A method of fabricating a gate of a semiconductor device using an oxygen-free ashing process is disclosed. The method includes forming a high-k dielectric film, having a dielectric constant higher than a silicon oxide film, on a semiconductor substrate including an NMOS region and a PMOS region, forming an etching target film on the high-k dielectric film, forming a photoresist pattern to expose any one region of the two regions, on the etching target film, etching the etching target film using the photoresist pattern as an etching mask, and removing the photoresist pattern using plasma formed in the presence of an oxygen-free reactive gas.

    摘要翻译: 公开了一种使用无氧灰化工艺制造半导体器件的栅极的方法。 该方法包括在包括NMOS区域和PMOS区域的半导体衬底上形成具有高于氧化硅膜的介电常数的高k电介质膜,在高k电介质膜上形成蚀刻靶膜,形成 光致抗蚀剂图案以暴露两个区域的任何一个区域,在蚀刻目标膜上,使用光刻胶图案蚀刻蚀刻目标膜作为蚀刻掩模,以及使用在无氧反应气体存在下形成的等离子体去除光致抗蚀剂图案 。

    Transistors with multilayered dielectric films and methods of manufacturing such transistors
    10.
    发明申请
    Transistors with multilayered dielectric films and methods of manufacturing such transistors 有权
    具有多层介电膜的晶体管和制造这种晶体管的方法

    公开(公告)号:US20060081948A1

    公开(公告)日:2006-04-20

    申请号:US11252514

    申请日:2005-10-18

    IPC分类号: H01L21/8238 H01L29/94

    摘要: Transistors that include multilayered dielectric films on a channel region are provided. The multilayered dielectric comprises a lower dielectric film that may have a thickness that is at least 50% the thickness of the multilayered dielectric film and that comprises a metal oxide, a metal silicate, an aluminate, or a mixture thereof, and an upper dielectric film on the lower dielectric film, the upper dielectric film comprising a Group III metal oxide, Group III metal nitride, Group XIII metal oxide or Group XIII metal nitride. A gate electrode is provided on the multilayered dielectric film.

    摘要翻译: 提供了在通道区​​域上包括多层电介质膜的晶体管。 多层电介质包括下电介质膜,该电介质膜的厚度至少为多层电介质膜的厚度的50%,并且包括金属氧化物,金属硅酸盐,铝酸盐或其混合物,以及上电介质膜 在下介电膜上,上电介质膜包含III族金属氧化物,III族金属氮化物,第ⅩⅢ族金属氧化物或第ⅩⅢ族金属氮化物。 在多层电介质膜上设置栅电极。