公开(公告)号：US07320242B2

公开(公告)日：2008-01-22

申请号：US10387095

申请日：2003-03-12

申请人： Michelle S. Hoo Fatt ,  Ibrahim Bekar ,  Joseph Padoyan

发明人： Michelle S. Hoo Fatt ,  Ibrahim Bekar ,  Joseph Padoyan

IPC分类号： G01M7/00

CPC分类号： G01N3/30 ,  G01N33/445 ,  G01N2203/001 ,  G01N2203/0017 ,  G01N2203/0032 ,  G01N2203/0039 ,  G01N2203/0098 ,  G01N2203/027 ,  G01N2203/0282 ,  G01N2203/0623

摘要： The present invention generally relates to a tensile impact apparatus that is designed to give dynamic stress-strain curves and fracture characteristics for a rubber specimen undergoing tensile impact loading. More particularly, this invention relates to a tensile impact apparatus that is capable of achieving strains of up to fracture. The apparatus is also capable of visually recording fracture phenomena.

摘要翻译： 本发明总体上涉及一种拉伸冲击装置，其被设计成对经受拉伸冲击载荷的橡胶试样产生动态应力 - 应变曲线和断裂特性。 更具体地说，本发明涉及一种拉伸冲击装置，其能够实现高达断裂的应变。 该装置还能够可视地记录断裂现象。

公开(公告)号：US20070026575A1

公开(公告)日：2007-02-01

申请号：US11167073

申请日：2005-06-24

申请人： Sankara Subramanian ,  Mitul Modi ,  Ibrahim Bekar

发明人： Sankara Subramanian ,  Mitul Modi ,  Ibrahim Bekar

IPC分类号： H01L21/00

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73203 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83856 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/0665

摘要： A more reliable and easier to manufacture underfill assembly is shown. Underfill layers are shown that are manufacturable separately from an assembly operation. In one example, underfill layers have the ability for pick and place operations during assembly. Another advantage of underfill layers provided includes self aligning holes that aid in placing semiconductor chips over an appropriate location on a substrate. Another advantage of selected underfill layers includes pre-formed conductive plugs within an underfill layer that eliminate the need for forming solder bumps on an adjacent component surface.

摘要翻译： 显示出更可靠和更容易制造的底部填充组件。 示出了与组装操作分开制造的底部填充层。 在一个示例中，底部填充层具有在组装期间拾取和放置操作的能力。 提供的底部填充层的另一个优点包括有助于将半导体芯片放置在衬底上的合适位置上的自对准孔。 选择的底部填充层的另一个优点包括在底部填充层内的预先形成的导电插塞，其消除了在相邻部件表面上形成焊料凸块的需要。