Method for diagnosis/prognosis of cancers using an epigenetic marker consisting of a specific single CpG site in TTP promoter and treatment of cancers by regulating its epigenetic status
    1.
    发明授权
    Method for diagnosis/prognosis of cancers using an epigenetic marker consisting of a specific single CpG site in TTP promoter and treatment of cancers by regulating its epigenetic status 有权
    使用由TTP启动子中的特定单个CpG位点组成的表观遗传标记和通过调节其表观遗传学状态来治疗癌症的癌症的诊断/预后的方法

    公开(公告)号:US08703419B2

    公开(公告)日:2014-04-22

    申请号:US13514913

    申请日:2010-09-08

    IPC分类号: C12N15/10

    摘要: The present invention relates to a method for the diagnosis and prognosis of cancers using an epigenetic marker consisting of a specific single CpG site in TTP (Tristetraprolin) promoter and treatment of cancers by regulating its epigenetic status. Particularly, the present invention relates to a method for the diagnosis and prognosis of liver cancer by measuring specific methylation of C, the 32nd residue of the nucleic acid sequence represented by SEQ. ID. NO. 41, and a method for treatment of cancer by regulating the same. The present invention can be effectively used for the diagnosis and/or treatment of liver cancer characterized by TTP down-regulation and methylation of C, the 32nd residue of the nucleic acid sequence represented by SEQ. ID. NO. 41. The present invention can be further applied for the diagnosis and treatment of other cancers or inflammatory diseases that are characterized by TTP down-regulation and methylation of C, the 32nd residue of the nucleic acid sequence represented by SEQ. ID. NO. 41.

    摘要翻译: 本发明涉及使用由TTP(Tristetraprolin)启动子中的特定单个CpG位点组成的表观遗传标记和通过调节其表观遗传学状态来治疗癌症来诊断和预后的方法。 特别地,本发明涉及通过测定由SEQ ID NO:1表示的核酸序列的第32个残基的C的特异性甲基化来诊断和预测肝癌的方法。 ID。 没有。 41,以及通过调节癌症治疗癌症的方法。 本发明可有效地用于诊断和/或治疗特征为TTP下调和甲基化的肝癌,即SEQ SEQ ID NO:1所示的核酸序列的第32个残基。 ID。 没有。 41.本发明可以进一步应用于以TTP下调和甲基化为特征的其他癌症或炎性疾病的诊断和治疗,C是SEQ ID NO:1所示的核酸序列的第32个残基。 ID。 没有。 41。

    Structure for preventing gap formation and plasma processing equipment having the same
    2.
    发明授权
    Structure for preventing gap formation and plasma processing equipment having the same 失效
    用于防止间隙形成的结构和具有其的等离子体处理设备

    公开(公告)号:US07727354B2

    公开(公告)日:2010-06-01

    申请号:US11971568

    申请日:2008-01-09

    IPC分类号: C23F1/00 H01L21/306 C23C16/00

    摘要: Plasma processing equipment having a structure for preventing gap formation includes: a chamber inside which a plasma environment is formed; an upper electrode positioned at a upper position of the chamber; an electrostatic chuck positioned at a lower position of the electrostatic chuck, having a lower electrode and holding a wafer on a top surface thereof; a ring positioned at an outer side of the electrostatic chuck; and a gap prevention unit for isolating from the outside a space between the electrostatic chuck and the ring.

    摘要翻译: 具有防止间隙形成的结构的等离子体处理设备包括:形成等离子体环境的室; 位于所述室的上部位置的上部电极; 位于所述静电卡盘的下部位置的静电卡盘,具有下部电极并且在其顶面保持晶片; 位于所述静电卡盘的外侧的环; 以及间隙防止单元,用于从外部隔离静电卡盘和环之间的空间。

    STRUCTURE FOR PREVENTING GAP FORMATION AND PLASMA PROCESSING EQUIPMENT HAVING THE SAME
    3.
    发明申请
    STRUCTURE FOR PREVENTING GAP FORMATION AND PLASMA PROCESSING EQUIPMENT HAVING THE SAME 失效
    用于防止GAP形成和等离子体处理设备的结构

    公开(公告)号:US20090044751A1

    公开(公告)日:2009-02-19

    申请号:US11971568

    申请日:2008-01-09

    IPC分类号: C23C16/54

    摘要: Plasma processing equipment having a structure for preventing gap formation includes: a chamber inside which a plasma environment is formed; an upper electrode positioned at a upper position of the chamber; an electrostatic chuck positioned at a lower position of the electrostatic chuck, having a lower electrode and holding a wafer on a top surface thereof; a ring positioned at an outer side of the electrostatic chuck; and a gap prevention unit for isolating from the outside a space between the electrostatic chuck and the ring.

    摘要翻译: 具有防止间隙形成的结构的等离子体处理设备包括:形成等离子体环境的室; 位于所述室的上部位置的上部电极; 位于所述静电卡盘的下部位置的静电卡盘,具有下部电极并且在其顶面保持晶片; 位于所述静电卡盘的外侧的环; 以及间隙防止单元,用于从外部隔离静电卡盘和环之间的空间。

    CALL CONNECTING METHOD AND SYSTEM BASED ON MOBILE VoIP
    4.
    发明申请
    CALL CONNECTING METHOD AND SYSTEM BASED ON MOBILE VoIP 审中-公开
    基于移动VoIP的呼叫连接方法和系统

    公开(公告)号:US20130039223A1

    公开(公告)日:2013-02-14

    申请号:US13571000

    申请日:2012-08-09

    IPC分类号: H04W4/00 H04L12/16

    CPC分类号: H04L65/1069 H04L65/1073

    摘要: Provided is a call connecting system and method based on mobile Voice over Internet Protocol (mVoIP). The method of connecting a call based on mVoIP performed in the system for connecting a call based on mVoIP including a subscriber server and a call processing apparatus may include the subscriber server receiving a call connection request to a second user terminal from a first user terminal and providing notification of the received call connection request to the second user terminal, the call processing apparatus receiving a call attempt message from the first user terminal, the call processing apparatus receiving a call waiting notification, providing notification of a ready state from the second user terminal, and the call processing apparatus establishing a call connection between the first user terminal and the second user terminal by transmitting the received call attempt message to the second user terminal.

    摘要翻译: 提供了一种基于移动互联网语音协议(mVoIP)的呼叫连接系统和方法。 基于在用于连接基于包含订户服务器和呼叫处理装置的mVoIP的呼叫的系统中执行的基于mVoIP的呼叫连接的方法可以包括订户服务器从第一用户终端接收到第二用户终端的呼叫连接请求,以及 向所述第二用户终端提供所接收的呼叫连接请求的通知,所述呼叫处理装置从所述第一用户终端接收呼叫尝试消息,所述呼叫处理装置接收呼叫等待通知,从所述第二用户终端提供就绪状态的通知 呼叫处理装置通过向第二用户终端发送接收到的呼叫尝试消息来建立第一用户终端与第二用户终端之间的呼叫连接。

    Electronics device module
    6.
    发明授权
    Electronics device module 有权
    电子设备模块

    公开(公告)号:US08369099B2

    公开(公告)日:2013-02-05

    申请号:US12656451

    申请日:2010-01-29

    IPC分类号: H05K7/00

    摘要: Disclosed is an electronic device module including a module substrate having first and second electronic device pair portions. The first electronic device pair portion may include a first and a second contact pad area and a first via area between the first and second contact pad areas. The first electronic device pair portion may also include a first layer and a second layer. The first layer may include a plurality of first lines connecting a plurality of contact pads in the first contact pad area on one side of the module substrate to a plurality of vias. The second layer may include a plurality of second lines connecting a plurality of contact pads in the second contact pad area to a plurality of vias in the via area. The second layer may also include a plurality of third lines connecting the first and second electronic device pair portions.

    摘要翻译: 公开了一种电子设备模块,包括具有第一和第二电子设备对部分的模块基板。 第一电子器件对部分可以包括第一和第二接触焊盘区域和第一和第二接触焊盘区域之间的第一通孔区域。 第一电子设备对部分还可以包括第一层和第二层。 第一层可以包括将模块衬底的一侧上的第一接触焊盘区域中的多个接触焊盘连接到多个通孔的多条第一线。 第二层可以包括将第二接触焊盘区域中的多个接触焊盘连接到通孔区域中的多个通孔的多条第二线路。 第二层还可以包括连接第一和第二电子设备对部分的多条第三线。

    Electronics device module
    7.
    发明申请
    Electronics device module 有权
    电子设备模块

    公开(公告)号:US20100195300A1

    公开(公告)日:2010-08-05

    申请号:US12656451

    申请日:2010-01-29

    IPC分类号: H05K7/00

    摘要: Disclosed is an electronic device module including a module substrate having first and second electronic device pair portions. The first electronic device pair portion may include a first and a second contact pad area and a first via area between the first and second contact pad areas. The first electronic device pair portion may also include a first layer and a second layer. The first layer may include a plurality of first lines connecting a plurality of contact pads in the first contact pad area on one side of the module substrate to a plurality of vias. The second layer may include a plurality of second lines connecting a plurality of contact pads in the second contact pad area to a plurality of vias in the via area. The second layer may also include a plurality of third lines connecting the first and second electronic device pair portions.

    摘要翻译: 公开了一种电子设备模块,包括具有第一和第二电子设备对部分的模块基板。 第一电子器件对部分可以包括第一和第二接触焊盘区域和第一和第二接触焊盘区域之间的第一通孔区域。 第一电子设备对部分还可以包括第一层和第二层。 第一层可以包括将模块衬底的一侧上的第一接触焊盘区域中的多个接触焊盘连接到多个通孔的多条第一线。 第二层可以包括将第二接触焊盘区域中的多个接触焊盘连接到通孔区域中的多个通孔的多条第二线路。 第二层还可以包括连接第一和第二电子设备对部分的多条第三线。