摘要:
The present invention relates to a method for the diagnosis and prognosis of cancers using an epigenetic marker consisting of a specific single CpG site in TTP (Tristetraprolin) promoter and treatment of cancers by regulating its epigenetic status. Particularly, the present invention relates to a method for the diagnosis and prognosis of liver cancer by measuring specific methylation of C, the 32nd residue of the nucleic acid sequence represented by SEQ. ID. NO. 41, and a method for treatment of cancer by regulating the same. The present invention can be effectively used for the diagnosis and/or treatment of liver cancer characterized by TTP down-regulation and methylation of C, the 32nd residue of the nucleic acid sequence represented by SEQ. ID. NO. 41. The present invention can be further applied for the diagnosis and treatment of other cancers or inflammatory diseases that are characterized by TTP down-regulation and methylation of C, the 32nd residue of the nucleic acid sequence represented by SEQ. ID. NO. 41.
摘要翻译:本发明涉及使用由TTP(Tristetraprolin)启动子中的特定单个CpG位点组成的表观遗传标记和通过调节其表观遗传学状态来治疗癌症来诊断和预后的方法。 特别地,本发明涉及通过测定由SEQ ID NO:1表示的核酸序列的第32个残基的C的特异性甲基化来诊断和预测肝癌的方法。 ID。 没有。 41,以及通过调节癌症治疗癌症的方法。 本发明可有效地用于诊断和/或治疗特征为TTP下调和甲基化的肝癌,即SEQ SEQ ID NO:1所示的核酸序列的第32个残基。 ID。 没有。 41.本发明可以进一步应用于以TTP下调和甲基化为特征的其他癌症或炎性疾病的诊断和治疗,C是SEQ ID NO:1所示的核酸序列的第32个残基。 ID。 没有。 41。
摘要:
Plasma processing equipment having a structure for preventing gap formation includes: a chamber inside which a plasma environment is formed; an upper electrode positioned at a upper position of the chamber; an electrostatic chuck positioned at a lower position of the electrostatic chuck, having a lower electrode and holding a wafer on a top surface thereof; a ring positioned at an outer side of the electrostatic chuck; and a gap prevention unit for isolating from the outside a space between the electrostatic chuck and the ring.
摘要:
Plasma processing equipment having a structure for preventing gap formation includes: a chamber inside which a plasma environment is formed; an upper electrode positioned at a upper position of the chamber; an electrostatic chuck positioned at a lower position of the electrostatic chuck, having a lower electrode and holding a wafer on a top surface thereof; a ring positioned at an outer side of the electrostatic chuck; and a gap prevention unit for isolating from the outside a space between the electrostatic chuck and the ring.
摘要:
Provided is a call connecting system and method based on mobile Voice over Internet Protocol (mVoIP). The method of connecting a call based on mVoIP performed in the system for connecting a call based on mVoIP including a subscriber server and a call processing apparatus may include the subscriber server receiving a call connection request to a second user terminal from a first user terminal and providing notification of the received call connection request to the second user terminal, the call processing apparatus receiving a call attempt message from the first user terminal, the call processing apparatus receiving a call waiting notification, providing notification of a ready state from the second user terminal, and the call processing apparatus establishing a call connection between the first user terminal and the second user terminal by transmitting the received call attempt message to the second user terminal.
摘要:
The present invention relates to a method for the diagnosis and prognosis of cancers using an epigenetic marker consisting of a specific single CpG site in TTP (Tristetraprolin) promoter and treatment of cancers by regulating its epigenetic status. Particularly, the present invention relates to a method for the diagnosis and prognosis of liver cancer by measuring specific methylation of C, the 32nd residue of the nucleic acid sequence represented by SEQ. ID. NO. 41, and a method for treatment of cancer by regulating the same. The present invention can be effectively used for the diagnosis and/or treatment of liver cancer characterized by TTP down-regulation and methylation of C, the 32nd residue of the nucleic acid sequence represented by SEQ. ID. NO. 41. The present invention can be further applied for the diagnosis and treatment of other cancers or inflammatory diseases that are characterized by TTP down-regulation and methylation of C, the 32nd residue of the nucleic acid sequence represented by SEQ. ID. NO. 41.
摘要翻译:本发明涉及使用由TTP(Tristetraprolin)启动子中的特定单个CpG位点组成的表观遗传标记和通过调节其表观遗传学状态来治疗癌症来诊断和预后的方法。 特别地,本发明涉及通过测定由SEQ ID NO:1表示的核酸序列的第32个残基的C的特异性甲基化来诊断和预测肝癌的方法。 ID。 没有。 41,以及通过调节癌症治疗癌症的方法。 本发明可有效地用于诊断和/或治疗特征为TTP下调和甲基化的肝癌,即SEQ SEQ ID NO:1所示的核酸序列的第32个残基。 ID。 没有。 41.本发明可以进一步应用于以TTP下调和甲基化为特征的其他癌症或炎性疾病的诊断和治疗,C是SEQ ID NO:1所示的核酸序列的第32个残基。 ID。 没有。 41。
摘要:
Disclosed is an electronic device module including a module substrate having first and second electronic device pair portions. The first electronic device pair portion may include a first and a second contact pad area and a first via area between the first and second contact pad areas. The first electronic device pair portion may also include a first layer and a second layer. The first layer may include a plurality of first lines connecting a plurality of contact pads in the first contact pad area on one side of the module substrate to a plurality of vias. The second layer may include a plurality of second lines connecting a plurality of contact pads in the second contact pad area to a plurality of vias in the via area. The second layer may also include a plurality of third lines connecting the first and second electronic device pair portions.
摘要:
Disclosed is an electronic device module including a module substrate having first and second electronic device pair portions. The first electronic device pair portion may include a first and a second contact pad area and a first via area between the first and second contact pad areas. The first electronic device pair portion may also include a first layer and a second layer. The first layer may include a plurality of first lines connecting a plurality of contact pads in the first contact pad area on one side of the module substrate to a plurality of vias. The second layer may include a plurality of second lines connecting a plurality of contact pads in the second contact pad area to a plurality of vias in the via area. The second layer may also include a plurality of third lines connecting the first and second electronic device pair portions.