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    Structural body and wiring board
    5.
    发明授权
    Structural body and wiring board 有权
    结构体和接线板

    公开(公告)号：US09564870B2

    公开(公告)日：2017-02-07

    申请号：US14412311

    申请日：2013-03-28

    Applicant: NEC CORPORATION

    Inventor： Yoshiaki Kasahara ,  Hiroshi Toyao

    IPC: H01P1/203 ,  H01P3/08 ,  H03H7/01 ,  H01P1/20 ,  H01Q15/00 ,  H05K1/02 ,  H05K1/16

    CPC classification number: H03H7/0161 ,  H01P1/2005 ,  H01P1/203 ,  H01P3/08 ,  H01Q15/0066 ,  H01Q15/008 ,  H03H7/0115 ,  H05K1/0236 ,  H05K1/162 ,  H05K2201/09254 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/09727 ,  H05K2201/09781

    Abstract: A second conductor plane (102) is formed in a layer different from a layer in which a first conductor plane (101) is formed, and faces the first conductor plane (101). A first transmission line (104) is formed in a layer different from the layers in which the first conductor plane (101) and the second conductor plane (102) are formed, and faces the second conductor plane (102), and one end thereof is an open end. A conductor via (106) connects the other end of the first transmission line (104) and the first conductor plane (101). An insular conductor (112) is connected to a portion of the first transmission line (104) other than a portion thereof at which the transmission line (104) is attached to the conductor via (106), is located in a layer different from the layer in which the second conductor plane (102) is located, and faces the second conductor plane (102).

    Abstract translation: 第二导体平面（102）形成在与形成第一导体平面（101）的层不同的层中，并且面向第一导体平面（101）。 第一传输线（104）形成在与形成第一导体平面（101）和第二导体平面（102）的层不同的层中，并且面向第二导体平面（102），并且其一端 是一个开放的结局。 导体通孔（106）连接第一传输线（104）的另一端和第一导体平面（101）。 绝缘导体（112）连接到第一传输线（104）的除了传输线（104）附接到导体通孔（106）的部分之外的部分，位于不同于 层，其中第二导体平面（102）所在，并面向第二导体平面（102）。

    NOVEL HIGH SPEED SIGNAL ROUTING TOPOLOGY FOR BETTER SIGNAL QUALITY
    7.
    发明申请
    NOVEL HIGH SPEED SIGNAL ROUTING TOPOLOGY FOR BETTER SIGNAL QUALITY 有权
    用于更好的信号质量的新型高速信号路由拓扑

    公开(公告)号：US20160205767A1

    公开(公告)日：2016-07-14

    申请号：US14595175

    申请日：2015-01-12

    Applicant: QUALCOMM Incorporated

    Inventor： Yokesh SUBRAMANIAN

    IPC: H05K1/02 ,  H05K1/18

    CPC classification number: H05K1/0213 ,  G11C5/025 ,  H05K1/0243 ,  H05K1/0246 ,  H05K1/0248 ,  H05K1/025 ,  H05K1/18 ,  H05K2201/09227 ,  H05K2201/09254

    Abstract: An apparatus including an output driver on a PCB and a number of chips on the PCB, the chips including a first chip and a second chip. The PCB includes a first transmission line connected to the output driver, a second transmission line connected to the first transmission line and the first chip, the second transmission line having a length greater than or equal to 10 times a length of the first transmission line, and a third transmission line connected to the first transmission line and the second chip, the third transmission line having a length greater than or equal to 10 times the length of the first transmission line. The second transmission line connects to the first chip without being coupled to a termination resistor on the PCB and the third transmission line connects to the second chip without being coupled to a termination resistor on the PCB.

    Abstract translation: 一种包括PCB上的输出驱动器和PCB上的多个芯片的装置，所述芯片包括第一芯片和第二芯片。 PCB包括连接到输出驱动器的第一传输线，连接到第一传输线和第一芯片的第二传输线，第二传输线的长度大于或等于第一传输线的长度的10倍， 以及连接到所述第一传输线和所述第二芯片的第三传输线，所述第三传输线的长度大于或等于所述第一传输线的长度的10倍。 第二传输线连接到第一芯片而不连接到PCB上的终端电阻器，并且第三传输线路连接到第二芯片，而不与PCB上的终端电阻耦合。

    ULTRA-SMALL LED ELECTRODE ASSEMBLY AND METHOD FOR MANUFACTURING SAME
    8.
    发明申请
    ULTRA-SMALL LED ELECTRODE ASSEMBLY AND METHOD FOR MANUFACTURING SAME 有权
    超小型LED电极组件及其制造方法

    公开(公告)号：US20160148911A1

    公开(公告)日：2016-05-26

    申请号：US14903858

    申请日：2014-07-08

    Applicant: PSI CO., LTD.

    Inventor： Young Rag Do

    IPC: H01L25/075 ,  H01L33/38 ,  H01L33/62

    CPC classification number: H01L25/0753 ,  H01L33/38 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05K1/0295 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/048 ,  Y02P70/611 ,  H01L2924/00

    Abstract: Provided are a nano-scale LED assembly and a method for manufacturing the same. First, a nano-scale LED device that is independently manufactured may be aligned and connected to two electrodes different from each other to solve a limitation in which a nano-scale LED device having a nano unit is coupled to two electrodes different from each other in a stand-up state. Also, since the LED device and the electrodes are disposed on the same plane, light extraction efficiency of the LED device may be improved. Furthermore, the number of nano-scale LED devices may be adjusted. Second, since the nano-scale LED device does not stand up to be three-dimensionally coupled to upper and lower electrodes, but lies to be coupled to two electrodes different from each other on the same plane, the light extraction efficiency may be very improved. Also, since a separate layer is formed on a surface of the LED device to prevent the LED device and the electrode from being electrically short-circuited, defects of the LED electrode assembly may be minimized. Also, in preparation for the occurrence of the very rare defects of the LED device, the plurality of LED devices may be connected to the electrode to maintain the original function of the nano-scale LED electrode assembly.

    Abstract translation: 提供了一种纳米级LED组件及其制造方法。 首先，独立制造的纳米级LED器件可以对准并连接到彼此不同的两个电极，以解决将具有纳米单元的纳米级LED器件耦合到彼此不同的两个电极的限制 站立状态。 此外，由于LED器件和电极设置在同一平面上，所以可以提高LED器件的光提取效率。 此外，可以调整纳米级LED器件的数量。 第二，由于纳米尺度的LED器件不能立即连接到上电极和下电极，而是要被连接到在同一平面上彼此不同的两个电极，所以光提取效率可以非常改善 。 此外，由于在LED器件的表面上形成单独的层以防止LED器件和电极电短路，所以可以使LED电极组件的缺陷最小化。 此外，为了准备LED装置的非常罕见的缺陷的发生，可以将多个LED器件连接到电极以保持纳米级LED电极组件的原始功能。

    Light emitting device including a light emitting element mounted on a sub-mount
    9.
    发明授权
    Light emitting device including a light emitting element mounted on a sub-mount 有权
    发光装置，其包括安装在副安装座上的发光元件

    公开(公告)号：US09119304B2

    公开(公告)日：2015-08-25

    申请号：US13566291

    申请日：2012-08-03

    Applicant: Yu-Sik Kim ,  Woo-Sung Han

    Inventor： Yu-Sik Kim ,  Woo-Sung Han

    IPC: H05K1/11 ,  H05K1/14 ,  H05K1/02 ,  H01L25/075

    CPC classification number: H05K1/0295 ,  H01L25/0753 ,  H01L2224/16225 ,  H05K2201/09227 ,  H05K2201/09254 ,  H05K2201/09318 ,  H05K2201/0949 ,  H05K2201/09663 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2203/173

    Abstract: A sub-mount adapted for AC and DC operation of devices mountable thereon, light emitting devices including such a sub-mount, and methods of manufacturing such a sub-mount are provided. The sub-mount includes a base substrate having first and second surfaces, a conductive pattern on the first surface, first and second pairs of first and second electrodes on the second surface and vias extending through the base substrate between the first and second surfaces. The conductive pattern includes a first set of mounting portions and two via portions along a first electrical path between the first pair of first and second electrodes, and a second set of mounting portions and two via portions along a second electrical path between the second pair of first and second electrodes, the via portions connecting respective portions of the conductive pattern to respective electrodes.

    Abstract translation: 提供一种适用于可安装在其上的设备的AC和DC操作的子座，包括这种子座的发光设备以及制造这种子座的方法。 子座包括具有第一表面和第二表面的基底基底，第一表面上的导电图案，第二表面上的第一和第二对第一和第二电极以及在第一和第二表面之间延伸穿过基底的通孔。 导电图案包括第一组安装部分和沿着第一对第一和第二电极之间的第一电路径的两个通孔部分，以及第二组安装部分和沿第二电路的第二组电路之间的两个通孔部分 第一和第二电极，通孔部分将导电图案的各个部分连接到相应的电极。

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