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    Microwave variable attenuator
    1.
    发明授权
    Microwave variable attenuator 有权
    微波可变衰减器

    公开(公告)号：US07274272B2

    公开(公告)日：2007-09-25

    申请号：US11154040

    申请日：2005-06-15

    Applicant: In-Kwon Ju ,  In-Bok Yom ,  Jong-Heung Park

    Inventor： In-Kwon Ju ,  In-Bok Yom ,  Jong-Heung Park

    IPC: H01P1/22

    CPC classification number: H01P1/227

    Abstract: The present invention relates to a microwave variable attenuator variably attenuating while maintaining a matching state. The microwave variable attenuator includes: an input terminal for inputting a microwave signal; an output terminal for outputting a microwave signal; a control voltage supplying unit for supplying a control voltage; an input terminal matching unit for matching an impedance of the input terminal in response to the control voltage; an output terminal matching unit for matching an impedance of the output terminal in response to the control voltage; and an attenuating unit for attenuating the microwave signal inputted to the input terminal based on an attenuation controlled according to the control voltage and outputting the attenuated microwave signal, wherein the attenuating unit includes a pin diode and a resonant inductor connected each others in parallel for resonating an effect of a parallel capacitance.

    Abstract translation: 微波可变衰减器本发明涉及一种在保持匹配状态的同时可变地衰减的微波可变衰减器。 微波可变衰减器包括：用于输入微波信号的输入端; 输出微波信号的输出端子; 用于提供控制电压的控制电压提供单元; 输入端子匹配单元，用于响应于所述控制电压来匹配所述输入端子的阻抗; 输出端子匹配单元，用于响应于所述控制电压来匹配所述输出端子的阻抗; 以及衰减单元，用于基于根据所述控制电压控制的衰减衰减输入到所述输入端的微波信号，并输出所述衰减的微波信号，其中所述衰减单元包括并联连接的pin二极管和谐振电感器，用于谐振 并联电容的影响。

    Ultra wideband hermetically sealed surface mount technology for microwave monolithic integrated circuit package
    2.
    发明授权
    Ultra wideband hermetically sealed surface mount technology for microwave monolithic integrated circuit package 有权
    超宽带密封表面贴装技术，用于微波单片集成电路封装

    公开(公告)号：US08362608B2

    公开(公告)日：2013-01-29

    申请号：US12681617

    申请日：2008-06-16

    Applicant: In Kwon Ju ,  In Bok Yom

    Inventor： In Kwon Ju ,  In Bok Yom

    IPC: H01L23/34

    CPC classification number: H01L23/055 ,  H01L23/057 ,  H01L23/66 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19033 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: An ultra wideband hermetically sealed surface mount package for a microwave monolithic integrated circuit (MMIC) is provided including: an integrated circuit; a package body being mounted with the integrated circuit and comprising a plurality of first dielectrics formed in a multilayer, a first line unit mounted to a circuit substrate and is electrically connected with an external circuit, a second line unit upwardly extended from the first line unit and is electrically connected with the first line unit, a third line unit extended to the right angle from the second line unit and is electrically connected with the second line unit, and a bonding unit that electrically connects the third line unit and the mounted integrated circuit; and a package cover being formed on the package body to seal the integrated circuit and comprising a plurality of second dielectrics formed in a multilayer.

    Abstract translation: 提供了一种用于微波单片集成电路（MMIC）的超宽带气密密封表面贴装封装，包括：集成电路; 一个封装体与该集成电路一起安装，并且包括形成在多层中的多个第一电介质，一个安装在电路基板上并与外部电路电连接的第一线路单元，从第一线路单元向上延伸的第二线路单元 并且与第一线路单元电连接，第三线路单元从第二线路单元延伸成直角并与第二线路单元电连接;以及接合单元，其将第三线路单元和安装的集成电路 ; 以及封装盖，其形成在所述封装主体上以密封所述集成电路并且包括形成在多层中的多个第二电介质。

    Ultra wideband system-on-package
    3.
    发明授权
    Ultra wideband system-on-package 有权
    超宽带系统级封装

    公开(公告)号：US08049319B2

    公开(公告)日：2011-11-01

    申请号：US12604354

    申请日：2009-10-22

    Applicant: In-Kwon Ju ,  In-Bok Yom ,  Ho-Jin Lee

    Inventor： In-Kwon Ju ,  In-Bok Yom ,  Ho-Jin Lee

    IPC: H01L23/02 ,  H01L23/053 ,  H01L23/12 ,  H01L23/34

    CPC classification number: H01L23/66 ,  H01L23/552 ,  H01L2223/6616 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1423 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: This research discloses an ultra wideband system-on-package (SoP). The SoP includes a package body; a first integrated circuit mounted on the package body; a first signal transmission unit connected to the first integrated circuit; a signal via connected to the first signal transmission unit and including a slab line and a trough line; and a second signal transmission unit connected to the signal via. The technology of the present research can transmit ultra broadband signals by minimizing discontinuity of signals appearing during vertical transition that occurs in the course of a signal transmission to/from an external circuit, and a fabrication method thereof.

    Abstract translation: 该研究公开了一种超宽带系统级封装（SoP）。 SoP包括一个包装体; 安装在封装主体上的第一集成电路; 连接到第一集成电路的第一信号传输单元; 连接到第一信号传输单元并包括板条线和槽线的信号通路; 以及连接到信号通道的第二信号传输单元。 本研究的技术可以通过最小化在向外部电路传输信号的过程中发生的垂直转换期间出现的信号的不连续性来传输超宽带信号及其制造方法。

    BROADBAND ACTIVE BALUN AND BALANCED MIXER USING REACTIVE FEEDBACK
    5.
    发明申请
    BROADBAND ACTIVE BALUN AND BALANCED MIXER USING REACTIVE FEEDBACK 审中-公开
    宽带主动巴伦和平衡混合器使用反应性反馈

    公开(公告)号：US20100015941A1

    公开(公告)日：2010-01-21

    申请号：US12517581

    申请日：2007-06-20

    Applicant: Jin-Cheol Jeong ,  In-Bok Yom ,  Dong-Pil Chang ,  Dong-Hwan Shin ,  In-Kwon Ju ,  Youn-Sub Noh

    Inventor： Jin-Cheol Jeong ,  In-Bok Yom ,  Dong-Pil Chang ,  Dong-Hwan Shin ,  In-Kwon Ju ,  Youn-Sub Noh

    IPC: H04B1/28

    CPC classification number: H03H11/32

    Abstract: A broadband active balun using reactive feedback and a balanced mixer using the balun are provided. The broadband active balun comprises a common gate FET having a source connected to an input terminal, a gate connected to the ground, and a drain connected to a first output terminal; a reactive impedance element having one end connected to the drain of the common gate FET and the other end connected to one of the gate and the source of the common gate FET, and a common source FET having a gate connected to the input terminal, a source connected to the ground and a drain connected to a second output terminal. Accordingly, the active balun has a small physical size and a wide frequency band.

    Abstract translation: 提供使用反馈反馈的宽带主动平衡变换器和使用平衡 - 不平衡转换器的平衡混频器。 宽带主动平衡 - 不平衡变压器包括：公共栅极FET，其源极连接到输入端子，栅极连接到地，以及漏极连接到第一输出端子; 无源阻抗元件，其一端连接到公共栅极FET的漏极，另一端连接到公共栅极FET的栅极和源极之一，以及具有连接到输入端子的栅极的公共源极FET， 源极连接到地和连接到第二输出端的漏极。 因此，主动平衡 - 不平衡变换器具有小的物理尺寸和宽的频带。

    Microwave variable attenuator
    6.
    发明申请
    Microwave variable attenuator 有权
    微波可变衰减器

    公开(公告)号：US20060097821A1

    公开(公告)日：2006-05-11

    申请号：US11154040

    申请日：2005-06-15

    Applicant: In-Kwon Ju ,  In-Bok Yom ,  Jong-Heung Park

    Inventor： In-Kwon Ju ,  In-Bok Yom ,  Jong-Heung Park

    IPC: H01P1/22

    CPC classification number: H01P1/227

    Abstract: The present invention relates to a microwave variable attenuator variably attenuating while maintaining a matching state. The microwave variable attenuator includes: an input terminal for inputting a microwave signal; an output terminal for outputting a microwave signal; a control voltage supplying unit for supplying a control voltage; an input terminal matching unit for matching an impedance of the input terminal in response to the control voltage; an output terminal matching unit for matching an impedance of the output terminal in response to the control voltage; and an attenuating unit for attenuating the microwave signal inputted to the input terminal based on an attenuation controlled according to the control voltage and outputting the attenuated microwave signal, wherein the attenuating unit includes a pin diode and a resonant inductor connected each others in parallel for resonating an effect of a parallel capacitance.

    Abstract translation: 微波可变衰减器本发明涉及一种在保持匹配状态的同时可变地衰减的微波可变衰减器。 微波可变衰减器包括：用于输入微波信号的输入端; 输出微波信号的输出端子; 用于提供控制电压的控制电压提供单元; 输入端子匹配单元，用于响应于所述控制电压来匹配所述输入端子的阻抗; 输出端子匹配单元，用于响应于所述控制电压来匹配所述输出端子的阻抗; 以及衰减单元，用于基于根据所述控制电压控制的衰减衰减输入到所述输入端的微波信号，并输出所述衰减的微波信号，其中所述衰减单元包括并联连接的pin二极管和谐振电感器，用于谐振 并联电容的影响。

    HIGH SPEED FLIP-FLOP CIRCUIT AND CONFIGURATION METHOD THEREOF
    7.
    发明申请
    HIGH SPEED FLIP-FLOP CIRCUIT AND CONFIGURATION METHOD THEREOF 有权
    高速FLIP-FLOP电路及其配置方法

    公开(公告)号：US20110291701A1

    公开(公告)日：2011-12-01

    申请号：US12914360

    申请日：2010-10-28

    Applicant: In Kwon JU ,  In Bok YOM

    Inventor： In Kwon JU ,  In Bok YOM

    IPC: H03K19/21 ,  H03K3/00

    CPC classification number: H03K3/012 ,  H03K3/0372

    Abstract: A high speed flip-flop circuit and a configuration method thereof are provided. A small number of transistors may be used to configure a flip-flop circuit, so that the flip-flop circuit may be operated at a high-speed. Additionally, an area occupied by the flip-flop circuit may be reduced, and power consumption may be reduced. Accordingly, the flip-flop circuit may be integrated together with a microwave frequency integrated circuit using a Gallium Arsenide (GaAs) compound semiconductor process.

    Abstract translation: 提供了一种高速触发电路及其配置方法。 可以使用少量的晶体管来配置触发器电路，使得触发器电路可以以高速运行。 此外，可以减少触发器电路占据的面积，并且可以降低功耗。 因此，触发器电路可以与使用砷化镓（GaAs）化合物半导体工艺的微波频率集成电路集成在一起。

    ULTRA WIDEBAND SYSTEM-ON-PACKAGE AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    ULTRA WIDEBAND SYSTEM-ON-PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
    超宽带系统封装及其制造方法

    公开(公告)号：US20100102425A1

    公开(公告)日：2010-04-29

    申请号：US12604354

    申请日：2009-10-22

    Applicant: In-Kwon JU ,  In-Bok Yom ,  Ho-Jin Lee

    Inventor： In-Kwon JU ,  In-Bok Yom ,  Ho-Jin Lee

    IPC: H01L23/52 ,  H01L21/70

    CPC classification number: H01L23/66 ,  H01L23/552 ,  H01L2223/6616 ,  H01L2223/6622 ,  H01L2223/6627 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1423 ,  H01L2924/19032 ,  H01L2924/19033 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: This research discloses an ultra wideband system-on-package (SoP). The SoP includes a package body; a first integrated circuit mounted on the package body; a first signal transmission unit connected to the first integrated circuit; a signal via connected to the first signal transmission unit and including a slab line and a trough line; and a second signal transmission unit connected to the signal via. The technology of the present research can transmit ultra broadband signals by minimizing discontinuity of signals appearing during vertical transition that occurs in the course of a signal transmission to/from an external circuit, and a fabrication method thereof.

    Abstract translation: 该研究公开了一种超宽带系统级封装（SoP）。 SoP包括一个包装体; 安装在封装主体上的第一集成电路; 连接到第一集成电路的第一信号传输单元; 连接到第一信号传输单元并包括板条线和槽线的信号通路; 以及连接到信号通道的第二信号传输单元。 本研究的技术可以通过最小化在向外部电路传输信号的过程中发生的垂直转换期间出现的信号的不连续性来传输超宽带信号及其制造方法。

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