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1.发明公开公开(公告)号：US20230411335A1
公开(公告)日：2023-12-21
申请号：US18239496
申请日：2023-08-29
申请人： KYOCERA Corporation
发明人： Masakazu FUJIWARA , Yu SATAKE , Yuya NITANAI
IPC分类号： H01L23/00 , H01L23/373 , H01B1/22 , H01L21/52 , C09J9/02
CPC分类号： H01L24/29 , H01L23/3737 , H01B1/22 , H01L24/26 , H01L21/52 , H01L33/641 , H01L24/83 , H01L2224/29499 , H01L2924/3511 , H01L2224/83024 , H01L2224/2939 , C09J9/02
摘要： There are provided a thermosetting resin composition for semiconductor bonding and a thermosetting resin composition for light emitting device which have high thermal conductivity and an excellent heat dissipation property and are capable of reliable pressure-free bonding of a semiconductor element and a light emitting element to a substrate. A thermosetting resin composition comprising: (A) silver fine particles ranging from 1 nm to 200 nm in thickness or in minor axis; (B) a silver powder having an average particle size of more than 0.2 μm and 30 μm or less; (C) resin particles; and (D) a thermosetting resin, wherein an amount of the resin particles (C) is 0.01 to 1 part by mass and an amount of the thermosetting resin (D) is 1 to 20 parts by mass, to 100 parts by mass being a total amount of the silver fine particles (A) and the silver powder (B).
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公开(公告)号：US20160111395A1
公开(公告)日：2016-04-21
申请号：US14870064
申请日：2015-09-30
发明人： Alexander Heinrich
IPC分类号： H01L23/00 , H01L25/065
CPC分类号： H01L25/0655 , H01L21/6835 , H01L23/13 , H01L23/4827 , H01L23/49503 , H01L23/49513 , H01L23/544 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L24/97 , H01L25/50 , H01L2221/68354 , H01L2223/54426 , H01L2223/54486 , H01L2224/04026 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05184 , H01L2224/05624 , H01L2224/05639 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05684 , H01L2224/05687 , H01L2224/06183 , H01L2224/26145 , H01L2224/26175 , H01L2224/27334 , H01L2224/27436 , H01L2224/2908 , H01L2224/291 , H01L2224/29105 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29116 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29144 , H01L2224/29147 , H01L2224/29155 , H01L2224/2916 , H01L2224/29166 , H01L2224/29171 , H01L2224/2919 , H01L2224/29294 , H01L2224/293 , H01L2224/29339 , H01L2224/29347 , H01L2224/32225 , H01L2224/32245 , H01L2224/32503 , H01L2224/75102 , H01L2224/75251 , H01L2224/75265 , H01L2224/75303 , H01L2224/75753 , H01L2224/7598 , H01L2224/83002 , H01L2224/83005 , H01L2224/83007 , H01L2224/83024 , H01L2224/83055 , H01L2224/83065 , H01L2224/83075 , H01L2224/8309 , H01L2224/83091 , H01L2224/83092 , H01L2224/83101 , H01L2224/83127 , H01L2224/83132 , H01L2224/83143 , H01L2224/83191 , H01L2224/83192 , H01L2224/83193 , H01L2224/83201 , H01L2224/83203 , H01L2224/83208 , H01L2224/83222 , H01L2224/83385 , H01L2224/83424 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8346 , H01L2224/83464 , H01L2224/83466 , H01L2224/83469 , H01L2224/8381 , H01L2224/83815 , H01L2224/8382 , H01L2224/83825 , H01L2224/8384 , H01L2224/83851 , H01L2224/83855 , H01L2224/83856 , H01L2224/83862 , H01L2224/83907 , H01L2224/83986 , H01L2224/97 , H01L2924/00012 , H01L2924/01015 , H01L2924/04941 , H01L2924/0496 , H01L2924/15153 , H01L2924/15156 , H01L2924/15157 , H01L2924/157 , H01L2924/15747 , H01L2924/1576 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2224/83 , H01L2924/00014 , H01L2924/014 , H01L2924/01047 , H01L2924/01028 , H01L2924/01026 , H01L2924/0105 , H01L2924/01082 , H01L2924/01074 , H01L2924/01024 , H01L2924/01023 , H01L2924/01027
摘要： A method of forming a chip assembly may include forming a plurality of cavities in a carrier; The method may further include arranging a die attach liquid in each of the cavities; arranging a plurality of chips on the die attach liquid, each chip comprising a rear side metallization and a rear side interconnect material disposed over the rear side metallization, wherein the rear side interconnect material faces the carrier; evaporating the die attach liquid; and after the evaporating the die attach liquid, fixing the plurality of chips to the carrier.
摘要翻译： 形成芯片组件的方法可以包括在载体中形成多个空腔; 该方法还可以包括在每个空腔中设置管芯附着液体; 在芯片安装液体上布置多个芯片，每个芯片包括设置在后侧金属化之后的后侧金属化和后侧互连材料，其中后侧互连材料面向载体; 蒸发管芯附着液体; 并且在蒸发模具附着液体之后，将多个芯片固定到载体上。
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公开(公告)号：US08882301B2
公开(公告)日：2014-11-11
申请号：US12674804
申请日：2008-08-29
CPC分类号： H01L24/83 , H01L24/33 , H01L31/02002 , H01L33/62 , H01L2224/33104 , H01L2224/335 , H01L2224/80359 , H01L2224/83024 , H01L2224/83095 , H01L2224/83193 , H01L2224/83203 , H01L2224/83232 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/351 , H05K1/0203 , H05K1/056 , H05K3/341 , H05K3/3421 , H05K3/3436 , H05K3/3494 , H05K2201/10106 , H05K2201/10689 , H05K2201/10719 , H05K2201/10734 , H05K2201/10969 , H05K2203/0278 , H05K2203/0405 , H05K2203/1163 , Y02P70/613 , Y10S362/80 , H01L2924/00
摘要： A method for bonding an LED assembly (71) or other electronic package (31) to a substrate PCB containing a heat-sink (52), which utilizes layers of reactive multilayer foil (51) disposed between contacts (32, 34) of the electronic package 31 and the associated contact pads (55) on the supporting substrate PCB. By initiating an exothermic reaction in the reactive multilayer foil (51), together with an application of pressure, sufficient heat is generated between the contacts (32, 34) and the associated contact pads (55) to melt adjacent bonding material (54) to obtain good electrically and thermally conductive bonds between the contacts 32, 34 and contact pads (55) without thermally damaging the electronic package (31), heat-sensitive components (35) associated with the electronic package (31), or other the supporting substrate PCB.
摘要翻译： 一种用于将LED组件（71）或其它电子封装（31）接合到包含散热器（52）的基板PCB的方法，所述基板PCB利用设置在所述散热器（52）的触点（32,34）之间的反应性多层箔（51） 电子封装31和支撑基板PCB上的相关接触焊盘（55）。 通过在反应性多层箔（51）中引发放热反应以及施加压力，在触头（32,34）和相关联的接触垫（55）之间产生足够的热量以将相邻的接合材料（54）熔化成 在电子封装（31），与电子封装（31）相关联的热敏元件（35）或其他支撑衬底（31）之间，在触点32,34和接触焊盘（55）之间获得良好的导电和导热接合， PCB。
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公开(公告)号：US20130334292A1
公开(公告)日：2013-12-19
申请号：US13947525
申请日：2013-07-22
CPC分类号： H05K1/02 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45686 , H01L2224/4569 , H01L2224/48225 , H01L2224/48227 , H01L2224/48245 , H01L2224/48247 , H01L2224/48647 , H01L2224/48747 , H01L2224/48847 , H01L2224/81024 , H01L2224/81395 , H01L2224/81815 , H01L2224/83024 , H01L2224/83205 , H01L2224/83395 , H01L2224/83815 , H01L2224/85203 , H01L2224/85207 , H01L2224/85395 , H01L2224/85447 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H05K3/00 , H05K3/282 , H05K3/285 , H05K3/288 , H05K3/3484 , H05K3/3489 , H05K3/3494 , H05K2201/015 , H05K2201/0179 , H05K2203/092 , H05K2203/107 , H05K2203/1338 , H05K2203/1366 , H05K2203/1372 , H05K2203/1383 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A printed circuit board to which a localised solder connection is to be made, the surface of said printed circuit board having a continuous or non-continuous coating of a composition comprising a halo-hydrocarbon polymer at a thickness of from 1 nm to 10 μm.
摘要翻译： 印刷电路板将要制成局部焊接连接，所述印刷电路板的表面具有包含厚度为1nm至10μm的卤代烃聚合物的组合物的连续或非连续涂层。
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公开(公告)号：US20120187862A1
公开(公告)日：2012-07-26
申请号：US13187232
申请日：2011-07-20
申请人： Jeffrey Carl Britt , Brandon Stanton , Yankun Fu
发明人： Jeffrey Carl Britt , Brandon Stanton , Yankun Fu
CPC分类号： H01L33/62 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L33/54 , H01L33/642 , H01L33/647 , H01L2224/29144 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48647 , H01L2224/73265 , H01L2224/83024 , H01L2224/83097 , H01L2224/83191 , H01L2224/83447 , H01L2224/8349 , H01L2224/83805 , H01L2224/83815 , H01L2224/83912 , H01L2224/85447 , H01L2224/92247 , H01L2924/00011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01087 , H01L2924/01322 , H01L2924/12032 , H01L2924/12041 , H01L2924/00014 , H01L2924/0105 , H01L2924/00012 , H01L2924/00 , H01L2224/83205
摘要： LED packages and related methods are provided. The LED packages can include a submount having a top and bottom surface and a plurality of top electrically conductive elements on the top surface of the submount. An LED can be disposed on one of the top electrically conductive elements. The LED can emit a dominant wavelength generally between approximately 600 nm and approximately 650 nm, and more particularly between approximately 610 nm and approximately 630 nm when an electrical signal is applied to the top electrically conductive elements. A bottom thermally conductive element can be provided on the bottom surface and is not in electrical contact with the top electrically conductive elements. A lens can be disposed over the LED. The LED packages can have improved lumen performances, lower thermal resistances, improved efficiencies, and longer operational lifetimes.
摘要翻译： 提供LED封装及相关方法。 LED封装可以包括在底座的顶表面上具有顶表面和底表面的底座和多个顶部导电元件。 LED可以设置在顶部导电元件中的一个上。 当电信号施加到顶部导电元件时，LED可以发射一般在约600nm和约650nm之间的主波长，更特别地在约610nm和约630nm之间。 底部导热元件可以设置在底表面上并且不与顶部导电元件电接触。 透镜可以放置在LED的上方。 LED封装可以改善流明性能，降低热阻，提高效率，延长使用寿命。
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公开(公告)号：US20170207193A1
公开(公告)日：2017-07-20
申请号：US15417780
申请日：2017-01-27
申请人： X-Celeprint Limited
发明人： Christopher Bower , Matthew Meitl , David Gomez , Salvatore Bonafede , David Kneeburg , Ronald S. Cok
CPC分类号： H01L24/83 , B41F16/00 , B41F16/0046 , B41F16/0073 , H01L21/6835 , H01L24/75 , H01L24/97 , H01L25/50 , H01L2221/68318 , H01L2221/68354 , H01L2221/68368 , H01L2221/68381 , H01L2224/2781 , H01L2224/32225 , H01L2224/32245 , H01L2224/75315 , H01L2224/7598 , H01L2224/83001 , H01L2224/83011 , H01L2224/83013 , H01L2224/83024 , H01L2224/832 , H01L2224/83203 , H01L2224/83894 , H01L2224/83895 , H01L2224/95001 , H01L2224/97 , H01L2924/10253 , H01L2924/1032 , H01L2924/10328 , H01L2924/10329 , H01L2924/10332 , H01L2924/10335 , H01L2924/10336 , H01L2924/10337 , H01L2924/10338 , H01L2924/1034 , H01L2224/83 , H01L2224/81
摘要： In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed. In yet another aspect, a method and structure for heat-assisted micro-transfer printing is disclosed.
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公开(公告)号：US09704819B1
公开(公告)日：2017-07-11
申请号：US15084442
申请日：2016-03-29
发明人： Ziyang Gao , Ya Lv
IPC分类号： H01L23/34 , H05K7/10 , H01L21/00 , H01L23/00 , H01L25/00 , H01L21/66 , H01L23/31 , H01L25/065 , H01L23/498
CPC分类号： H01L25/0657 , H01L21/563 , H01L22/20 , H01L23/3107 , H01L23/3735 , H01L23/4334 , H01L23/49833 , H01L23/5385 , H01L23/5386 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/072 , H01L25/105 , H01L2224/11334 , H01L2224/11849 , H01L2224/13013 , H01L2224/13082 , H01L2224/13083 , H01L2224/131 , H01L2224/13294 , H01L2224/133 , H01L2224/16227 , H01L2224/17181 , H01L2224/27334 , H01L2224/27849 , H01L2224/29082 , H01L2224/29083 , H01L2224/291 , H01L2224/2919 , H01L2224/29191 , H01L2224/29294 , H01L2224/293 , H01L2224/32227 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2224/81024 , H01L2224/8109 , H01L2224/81192 , H01L2224/83024 , H01L2224/8309 , H01L2224/83104 , H01L2224/83192 , H01L2224/92125 , H01L2224/92242 , H01L2924/014 , H01L2924/0665 , H01L2924/00014 , H01L2224/81
摘要： A power electronic package includes a first substrate, a second substrate oppositely disposed from the first substrate, one or more chips disposed between the substrates, and at least three spacers. The spacers control a height variation of the power electronic package and protect the chips and other electronics from experiencing excessive stress. The height of the spacers is determined based on a height of the chips, on a height of solder blocks that connect the chips to the top substrate, and on a height of solder blocks that connect the chips to the bottom substrate.
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公开(公告)号：US09358775B2
公开(公告)日：2016-06-07
申请号：US14803980
申请日：2015-07-20
申请人： X-Celeprint Limited
IPC分类号： H01L21/30 , B41F16/00 , H01L21/3065 , H01L21/52 , H01L21/56 , H01L23/29 , B41K3/12 , H01L21/683 , H01L21/67 , H01L23/00 , B25J15/00 , H01L23/31 , H01L25/00 , H01L31/18
CPC分类号： B41F16/00 , B25J15/00 , B41F16/0046 , B41F16/006 , B41F16/0073 , B41K3/04 , B41K3/12 , H01L21/3065 , H01L21/52 , H01L21/565 , H01L21/568 , H01L21/67103 , H01L21/683 , H01L21/6835 , H01L23/293 , H01L23/3171 , H01L24/75 , H01L24/83 , H01L24/97 , H01L25/50 , H01L31/1892 , H01L2221/68318 , H01L2221/68354 , H01L2221/68368 , H01L2221/68377 , H01L2221/68381 , H01L2224/32225 , H01L2224/32245 , H01L2224/75315 , H01L2224/7598 , H01L2224/83001 , H01L2224/83011 , H01L2224/83013 , H01L2224/83024 , H01L2224/832 , H01L2224/83894 , H01L2224/83895 , H01L2924/10253 , H01L2924/1032 , H01L2924/10328 , H01L2924/10329 , H01L2924/10332 , H01L2924/10335 , H01L2924/10336 , H01L2924/10337 , H01L2924/10338 , H01L2924/1034
摘要： In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.
摘要翻译： 在一方面，公开了一种用于在目的基板的接收表面上组装半导体器件的系统和方法。 另一方面，公开了一种用于在具有地形特征的目的地基板上组装半导体器件的系统和方法。 另一方面，公开了一种用于印刷半导体器件的重力辅助分离系统和方法。 另一方面，公开了用于印刷半导体器件的转印装置的各种特征。
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公开(公告)号：US20160016399A1
公开(公告)日：2016-01-21
申请号：US14804047
申请日：2015-07-20
申请人： X-Celeprint Limited
IPC分类号： B41F16/00
CPC分类号： B41F16/00 , B25J15/00 , B41F16/0046 , B41F16/006 , B41F16/0073 , B41K3/04 , B41K3/12 , H01L21/3065 , H01L21/52 , H01L21/565 , H01L21/568 , H01L21/67103 , H01L21/683 , H01L21/6835 , H01L23/293 , H01L23/3171 , H01L24/75 , H01L24/83 , H01L24/97 , H01L25/50 , H01L31/1892 , H01L2221/68318 , H01L2221/68354 , H01L2221/68368 , H01L2221/68377 , H01L2221/68381 , H01L2224/32225 , H01L2224/32245 , H01L2224/75315 , H01L2224/7598 , H01L2224/83001 , H01L2224/83011 , H01L2224/83013 , H01L2224/83024 , H01L2224/832 , H01L2224/83894 , H01L2224/83895 , H01L2924/10253 , H01L2924/1032 , H01L2924/10328 , H01L2924/10329 , H01L2924/10332 , H01L2924/10335 , H01L2924/10336 , H01L2924/10337 , H01L2924/10338 , H01L2924/1034
摘要： In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.
摘要翻译： 在一方面，公开了一种用于在目的基板的接收表面上组装半导体器件的系统和方法。 另一方面，公开了一种用于在具有地形特征的目的地基板上组装半导体器件的系统和方法。 另一方面，公开了一种用于印刷半导体器件的重力辅助分离系统和方法。 另一方面，公开了用于印刷半导体器件的转印装置的各种特征。
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10.发明授权公开(公告)号：US09224678B2
公开(公告)日：2015-12-29
申请号：US13788015
申请日：2013-03-07
发明人： Hsien-Wei Chen
IPC分类号： H01L23/498
CPC分类号： H01L24/81 , H01L21/56 , H01L23/49811 , H01L23/49894 , H01L24/13 , H01L24/16 , H01L2224/023 , H01L2224/03828 , H01L2224/0401 , H01L2224/05569 , H01L2224/13 , H01L2224/13024 , H01L2224/13111 , H01L2224/13113 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16058 , H01L2224/16112 , H01L2224/16227 , H01L2224/73104 , H01L2224/81011 , H01L2224/81024 , H01L2224/81191 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2224/8192 , H01L2224/83024 , H01L2924/013 , H01L2924/14 , H01L2924/2064 , H01L2924/014
摘要： Methods and apparatus are disclosed for attaching the integrated circuit (IC) packages to printed circuit boards (PCBs) to form smooth solder joints. A polymer flux may be provided in the process to mount an IC package to a PCB. The polymer flux may be provided on connectors of the IC package, or provided on PCB contact pad and/or pre-solder of the PCB. When the IC package is mounted onto the PCB, the polymer flux may cover a part of the connector, and may extend to cover a surface of the molding compound on the IC package. The polymer flux may completely cover the connector as well. The polymer flux delivers a fluxing component that facilitates smooth solder joint formation as well as a polymer component that offers added device protection by encapsulating individual connectors. The polymer component may be an epoxy.
摘要翻译： 公开了用于将集成电路（IC）封装连接到印刷电路板（PCB）以形成平滑的焊点的方法和装置。 在将IC封装安装到PCB的过程中可以提供聚合物助焊剂。 聚合物通量可以设置在IC封装的连接器上，或者设置在PCB接触焊盘和/或PCB的预焊上。 当IC封装被安装到PCB上时，聚合物焊剂可以覆盖连接器的一部分，并且可以延伸以覆盖IC封装上的模塑料的表面。 聚合物助焊剂也可以完全覆盖连接器。 聚合物助焊剂提供助焊剂组分，有利于平滑的焊点形成以及聚合物组分，通过封装各个连接器提供附加的器件保护。 聚合物组分可以是环氧树脂。
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